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Method and apparatus for manufacturing stacked-type semiconductor device

  • US 20060038275A1
  • Filed: 08/10/2005
  • Published: 02/23/2006
  • Est. Priority Date: 08/11/2004
  • Status: Active Grant
First Claim
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1. A method of manufacturing a stacked-type semiconductor device, comprising:

  • arranging a plurality of stacked chips obtained by stacking semiconductor chips on a plurality of stages on a support substrate;

    connecting a semiconductor chip of each stage in each stacked chip and the support substrate by wire while performing heating in units of stacked chips;

    performing plastic molding of each stacked chip; and

    separating the stacked chips from each other.

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