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Film thickness measuring method of member to be processed using emission spectroscopy and processing method of the member using the measuring method

  • US 20060039008A1
  • Filed: 10/25/2005
  • Published: 02/23/2006
  • Est. Priority Date: 06/20/2000
  • Status: Active Grant
First Claim
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1. A system comprising:

  • a film thickness measuring apparatus for measuring a film thickness of a member to be processed, including;

    a differential waveform pattern data base for holding a standard pattern consisting of a time differential value of an interference light for each of multiple wavelengths with respect to a film thickness of a first member to be processed;

    a unit for measuring an intensity of an interference light for each of multiple wavelengths of a second member to be processed;

    a unit for obtaining a real pattern consisting of time differential values of measured interference light intensities; and

    a unit for obtaining a film thickness of said second member according to said standard pattern consisting of said time differential values and said real pattern consisting of said time differential values.

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