High power density insulated metal substrate based power converter assembly with very low BUS impedance
First Claim
1. An electrical power circuit assembly, apparatus and method comprising;
- an insulated metal substrate (IMS) printed circuit board (PCB) assembly, designated IMS PCB, further comprising a metal substrate, one or more electrically insulating layers, one or more electrically conductive circuit foil layers and a plurality of semiconductor power devices soldered to said conductive circuit foil layers, a second PCB assembly, designated filter PCB, further comprising, one or more electrically non-conductive board layers, one or more electrically conductive circuit foil layers and one or more capacitors, one or more, electrically conductive bus bars located between said IMS PCB and said filter PCB, where the bus bar minor dimension is between said PCBs and the major dimension runs perpendicular to the electrical current flow in the said semiconductor power devices or where any other bus bar geometry is used that substantially serves to minimize the inductance between said semiconductor power devices on the IMS PCB and said capacitors on the filter PCB, a rigid heatsink or a heat removal surface, a clamping mechanism
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Accused Products
Abstract
The invention is an electromechanical packaging method for high power, high reliability, high frequency, switch mode power converters where high power density is required. An Insulated Metal Substrate (IMS) Printed Circuit Board (PCB) assembly, with a plurality of surface mount semiconductor power devices, is interfaced to a heatsink. Low profile bus bars are used between the IMS PCB and a fiberglass PCB. The fiberglass PCB has a laminated DC bus structure and a plurality of filter capacitors electrically connected across the DC bus structure. Clamp bars, substantially following the footprint of the bus bars, are installed on top of the fiberglass PCB and are used to pull the heatsink-IMS-bus bar-fiberglass PCB-clamp bar sandwich together. The clamping action provides low contact resistance between the bus bars and the two printed circuit boards. The clamping action also supplies the pressure needed between the IMS substrate and the heatsink for good heat transfer across this interface. The assembly also provides a robust mechanical mounting method for the bus bars and printed circuit boards. The geometry and layout of the bus bars provides a connection from the IMS PCB to the fiberglass PCB with very low parasitic inductance between the surface mounted semiconductor power devices and the filter capacitors on the fiberglass PCB.
37 Citations
11 Claims
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1. An electrical power circuit assembly, apparatus and method comprising;
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an insulated metal substrate (IMS) printed circuit board (PCB) assembly, designated IMS PCB, further comprising a metal substrate, one or more electrically insulating layers, one or more electrically conductive circuit foil layers and a plurality of semiconductor power devices soldered to said conductive circuit foil layers, a second PCB assembly, designated filter PCB, further comprising, one or more electrically non-conductive board layers, one or more electrically conductive circuit foil layers and one or more capacitors, one or more, electrically conductive bus bars located between said IMS PCB and said filter PCB, where the bus bar minor dimension is between said PCBs and the major dimension runs perpendicular to the electrical current flow in the said semiconductor power devices or where any other bus bar geometry is used that substantially serves to minimize the inductance between said semiconductor power devices on the IMS PCB and said capacitors on the filter PCB, a rigid heatsink or a heat removal surface, a clamping mechanism - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification