Method and apparatus for laser trimming of resistors using ultrafast laser pulse from ultrafast laser oscillator operating in picosecond and femtosecond pulse widths

• US 20060039419A1
• Filed: 08/15/2005
• Published: 02/23/2006
• Est. Priority Date: 08/16/2004
• Status: Abandoned Application

• Current Assignee: Laserfacturing Incorporated
• Original Assignee: Laserfacturing Incorporated
• Inventors: Deshi, Tan
• Application Number:
  US11/203,428
• Publication Number:
  US 20060039419A1
• Time in Patent Office: Days
• US Class Current: 372/9
• CPC Class Codes: B23K 26/0624 using ultrashort pulses, i.e. pulses of 1ns or less
• CPC Class Codes: H01C 17/242 by laser trimming by laser in general B23K26/351
• CPC Class Codes: H01S 3/0085 Modulating the output, i.e. the laser beam is modulated outside the laser cavity
• CPC Class Codes: H01S 3/1106 Mode locking

Abstract

The present invention relates to a method and apparatus for laser trimming of resistors in semiconductor applications using ultrafast laser pulse from diode pumped or CW pumped solid state mode locked ultrafast pulse laser oscillator without amplification. The invention disclosed has a means to avoid/reduce the cumulative heating effect to avoid machine quality degrading in multi shot ablation. The disclosed invention provides a cost effective and stable system for high volume manufacturing application. The disclosed invention is used for thick and thin film trimming. Ultrafast laser oscillator can be a called as femtosecond laser oscillator or a picosecond laser oscillator depending on the pulse with of the laser beam generated.

Claims

1. A laser maching method for trimming a resistor film from an intial value to a desired value using ultrafast laser pulse from ultrafast laser oscillator comprising the step of;

placing a resistor film on a substrate;

emitting a pulsed laser beam from ultrafast laser oscillator;

modulating the laser pulse, in order to minimize the cumulative heating effect and improve the machining quality;

expanding or reducing the beam to vary the diameter of the laser beam in one or two axis and hence the diameter of the focused spot size;

converting the polarization of the laser beam;

improving beam quality;

scanning the laser beam in two axes; and

focusinng the pulsed laser beam on to the resistor film on the substrate;

wherein the resistor film material is ablated within the target area of the resistor to change its initial value to the desired value.

2. A method according to claim 1 which further includes the step of changing the polarization state of the laser beam.

3. A method according to claim 1 which further includes the step of moving the wafer in three dimensions.

4. A method according to claim 1 which further includes the step of injecting a liquid or gas to assist in reducing the cumulative heating effect.

5. A method according to claim 1 which further includes the step of controlling the scanning speed.

6. A method according to claim 1 which further includes the step of imaging the laser beam in order to align the laser beam with the wafer and to monitor the machining process.

7. A method according to claim 1 which further includes the step of using a longer or shorter wavelength laser beam depending on the thickness of the resistor film and required resistor trimming accuracy.

8. A method according to claim 1 which further includes the step of controlling the laser pulse energy and the pulse number.

9. A method according to claim 1 which further includes measuring the resistor value of the device while ablating the resistor film by ultrafast laser pulse from oscillator.

10. A method according to claim 1 which further includes determining whether further ablation of resistor film is required to change the resistor value to the desired value.

11. A method according to claim 1 which further includes terminating resistor trimming upon reaching the desired value by turning off the laser pulse from reaching the target surface through pulse modulator.

12. A method according to claim 1 which further includes the step of changing the shape of the laser beam to improve the machining efficiency and quality.

13. A method according to claim 1 which further includes the step of reducing the ablated feature size below the focused spot size by controlling the laser threshold fluence.

14. A method according to claim 1 wherein the work piece is a semiconductor wafer.

15. The method according to claim 1, which further includes for aligning the work piece to the focused laser beam and to monitor the laser trimming process.

16. A method according to claim 1, wherein;

overlying resistor layers can be removed in a single cycle or in multiple cycles by controlling the laser fluence; and

the thickness of the resistor film on the substrate vary from few micrometers to few nanometers.

17. The method of claim 1, wherein the measured resistor value is compared with the predetermined resistor value and the need for additional ultrafast laser trimming is determined.

18. A laser maching apparatus for trimming a resistor film from an intial value to a desired value using ultrafast laser pulse from ultrafast laser oscillator comprising the step of;

a resistor film on a substrate;

a laser source that emits a pulsed laser beam from ultrafast laser oscillator;

modulating means for controlling the laser pulse, minimize the cumulative heating effect and improve the machining quality;

bam expanding or reducing means for varying the diameter of the laser beam in one or two axis and hence the diameter of the focused spot size;

means for polarization conversion;

means for improving beam quality;

scanning means for scanning the laser beam in two axes; and

focusing means for focusing the pulsed laser beam on to the resistor film on the substrate;

wherein the resistor film material is ablated within the target area of the resistor to change its initial value to the desired value.

19. The apparatus of claim 18,

wherein the laser source includes a diode pumped or CW laser pumped solid state ultrafast laser oscillator preferably of pulse width ranging from 1 fs to 100 ps, pulse energy 1 nanojoule-100 microjoule and the pulse repletion rate in a range of 1 MHz to 400 MHz;

wherein the repetition rate can be reduced and pulse energy can be increased by increasing a cavity length inside the ultrafast laser oscillator;

wherein the cumulative heating effect can be minimized and machining quality of the resistor trimming is improved with a reduction in the repetition rate of the laser pulse from the ultrafast laser oscillator.

20. The apparatus of claim 18;

wherein the wavelength of the laser beam from the ultrafast laser oscillator is preferably a fundamental frequency of 700 nm-1200 nm wavelength or a second harmonic of the fundamental frequency of 350 nm-600 nm wavelength or a third harmonic of the fundamental frequency of 233 nm-400 nm wavelength;

wherein the laser beam from the ultrafast laser oscillator preferably has the following characteristics;

a pointing stability of the beam is less than 100 μ

rad/100 nm;

a laser stability less than ±

1%;

laser noise less than ±

1%;

laser beam divergence of less than 4 mradian; and

a spatial mode TEM₀₀ of M² less than 2.

21. The apparatus of claim 18, which further includes polarization conversion means including;

a polarization plate that is placed in-between a telescopic module to change the polarization state of the laser beam along the axis of the beam;

wherein the laser beam at the central part travels a shorter distance in the polarization plate than those at the edge due to the divergence or convergence of the laser beam;

wherein the polarization state of the laser beam is different, along the axis, at different portions of the laser beam profile due to a different distance traveled through the polarization plate;

wherein the telescopic module can be of the keplerian telescope type, having two positive lenses or of the Galilean telescope type, having a positive and negative lens;

wherein the polarization plate is selected from a group including a half wave plate or a quarter wave plate or retardation plate or birefringent plate or a combination of half wave and quarter wave plate;

wherein the polarization state of the resultant laser beam from the polarization conversion means can be a partly or completely radially polarized.

22. The apparatus of claim 21 which further includes a polarization module for providing a resultant polarization state of the laser beam that results in;

a reduction in the focused machined feature size and spot size of the laser beam compared to linear or circularly polarized laser beam by 5-40%;

minimizes the debris surrounding the ablated area and hence the quality of resistor trimming compared to linearly or circularly polarized laser beams; and

increases the machining efficiency or ablation rate of the resistor trimming process by 10-50% compared to linearly or circularly polarized laser beams.

23. The apparatus of claim 18, wherein the pulsed laser beam from the ultrafast laser oscillator is modulatd by an electro optic modulator or an acousto optic modulator, which are driven by respective drivers to minimize the cumulative heating effect and to improve the quality of resistor trimming.

24. The apparatus of claim 23, wherein the electro optic modulator and acousto optic modulator serve as a laser shutter to turn on and off the laser pulse from the ultrafast laser oscillator when required.

25. The apparatus of claim 23, which further includes a photo detector that is placed before the electro optic modulator or acousto optic modulator means to obtain a signal and to synchronize the on/off signal to the electro optic modulator to avoid any clipping of the laser pulse.

26. The apparatus of claim 23, wherein the repletion rate of the laser pulse from ultrfast laser oscillator is reduced by modulating the laser pulse by electro optic modulator or acousto optic modulator means to minimize or eliminate the cumulative heating effect and improve the machining quality of resistor trimming.

27. The apparatus of claim 23, wherein a time gap is provided between groups of laser pulses from the ultrafast laser oscillator resulting from modulating the laser pulse by electro optic modulator or acousto optic modulator means to minimize the cumulative heating effect and improve the machining quality of resistor trimming.

28. The apparatus of claim 23, wherein by modulating the laser pulse ultrafast laser oscillator by electro optic modulator or acousto optic modulator means the laser pulse from the can be transmitted or blocked when required.

29. The apparatus of claim 23, wherein the pulse energy of the laser beam from the ultrafast laser oscillator is controlled by varying the power applied to the electro optic modulator or acousto optic modulator from the electro optic driver or acousto optic driver respectively.

30. The apparatus of claim 23,

wherein the electro optic modulator is used in combination with a polarizing beam splitter or polarizer or prism for modulating the laser pulse;

the electro optic modulator is preferably includes pockels cells or a Q-switch or a pulse picker;

wherein the electro optic modulator has the following characteristics;

a short rise time in the range of 20 ns to 10 ps;

an energy/power loss less than 10%; and

a clear aperture diameter of 1-10 mm;

wherein an antireflection coating and type of crystal in the modulator depend on the laser wavelength, pulse width and energy;

wherein the electro optic modulator is driven by a driver which can be computer controlled;

wherein the electro optic modulator is driven by the driver by sending a trigger signal, which is preferably a power or voltage signal, which shifts the polarization state of the laser beam on passing through the electro optic modulator from horizontal to vertical polarization or vice versa.

31. The apparatus of claim 30;

wherein changing the polarization the pulse in the electro optic modulator will be transmitted or deflected by the polarizing beam splitter or a polarizer or prism, thus acting like a high speed shutter and modulating the laser pulse from the ultrafast laser oscillator;

wherein the transmitted beam can be used for ultrafast pulsed laser processing and the deflected beam is blocked by the beam blocking means and vice versa.

32. The apparatus of claim 23, wherein the electro optic modulator can change the polarization state of any individual pulse or a group of pulses from the ultrafast laser oscillator by 90 degrees to horizontal or vertical polarization state depending on the polarization state of the input pulse.

33. The apparatus of claim 23, wherein the acoustic optic modulator has the following characteristics;

a rise time of 5-10 ns;

an efficiency of 50-95%;

a clear aperture of 0.5-5 mm;

a center frequency/carrier frequency of 25 MHz to 300 MHz.

34. The apparatus of claim 23;

wherein the acousto optic modulator is driven by the driver by sending a trigger signal, which is preferably a power or voltage signal, splits the ultrafast laser beam in to first order and zero order beams, where the first order beam is deflected at an angle called the Bragg angle to the zero order beam;

wherein the zero order beam will have the same polarization state of the input beam and the first order beam will have a polarization state 90 degrees to the input beam;

wherein the first order or zero order beam can be used for laser processing and the other beam is blocked by a beam blocking means and thus acting like a high speed shutter and modulating the laser pulse from ultrafast laser oscillator.

35. The apparatus of claim 34, wherein the zero order beam has no dispersive effect and used for material processing and the first order beam is blocked by a beam blocking means.

36. The apparatus of claim 23, wherein the ablation of the resistor film is controlled by the acousto optic modulator or electro optic modulator depending on the feed back from the device measuring the resistor value of the device while ablating.

37. The apparatus of claim 23, wherein the laser beam ablates the resistor film till the resistor value reaches the nominal value.

38. The apparatus of claim 18, wherein the modulated ultrafast laser beam is expanded or reduced in beam diameter in one or two axis of the laser beam by beam expansion or reducing means of keplerian telescope type, including two positive lenses or of the Galilean telescope type, including positive and negative lenses.

39. The apparatus of claim 18, which further includes beam quality improving means including a diaphragm of the type having an Iris diaphragm.

40. The apparatus of claim 18, may have a pulse modulation/control means in the laser source and may nor require an external acousto optic modulator or elcetro optic modulator.

41. The apparatus of claim 18, wherein a one axis or two axis galvanometer scanner or a piezo scanner means scans the laser beam across the resistor film in any desired shape.

42. The apparatus of claim 41, wherein the piezo scanner that avoids pillow shaped field distortion at the image field due to common pivot points.

43. The apparatus of claim 18;

wherein the pulsed laser beam is focused on the resistor film substrate by a focusing means of type having an objective lens or telecentric or f-Theta lens or confocal microscopy lens or the like;

wherein the focusing means positioned at a distance from the scanning mirror approximately equal to the front focal length (forward working distance) of the focusing means and the work piece is positioned at approximately the back focal length (back working distance) of the focusing means.

44. The apparatus of claim 18, wherein the work piece/substrate is moved with respect to the laser beam by a translation table means.

45. The apparatus of claim 18, which further comprises a beam shaping means to change the shape of the beam profile at the focused spot size;

wherein the beam shaping means is of the type having a monoclinic double tungstate MDT element based on the phenomenon of internal conical reflection;

wherein the beam shaping is obtained by the combination of a quarter wave plate and the MDT element;

wherein the resultant beam profile depends on the diameter and wavelength on the incoming laser beam and the length of the MDT element;

wherein a flat top beam profile can be generated at the focal plane;

wherein flat bottom holes/trench can be generated;

wherein the effieciency of beam shaping is high due to the transitive efficiency of the MDT material and minimal optical elements involved; and

wherein the machining efficiency and quality of machining is improved due to beam shaping.

46. The apparatus of claim 18, which further includes pulse modulating means, two axis galvanometer or piezo scanning means and a translation table means that are controlled by a central processor control means.

47. The apparatus of claim 18, further comprises scanning strategy control means for controlling at least one of the incident laser beam power, pulse repetition rate, duration between successive pulse or a group of pulses and a galvanometer or piezo scanning speed during resistor trimming on the work piece/substrate.

48. The method of claim 18, wherein the cumulative heating effect is minimized, machining quality of resistor trimming is improved and machining speed is increased using gas or liquid assist means;

wherein the gas is applied at a pressure through a nozzle;

wherein the liquid is mixed with compressed air and applied at a pressure through a nozzle;

wherein single or multiple nozzles may be used depending on the application;

wherein the gas or liquid nozzle is placed close to the work piece surface;

wherein the gas assist may be air, HFC, SF₆, Nitrogen, Oxygen, argon, CF₄, Helium, or a chlorofluorocarbon or halocarbon gas; and

the liquid assist may be water, methanol or iso-propanol alcohol.

49. The apparatus of claim 18, wherein the film layer is a resistive material such as nichrome, tantalum nitride, cesium silicide, silicon chromide, titanium, aluminum, nickel, copper, tungsten, platinum, gold, chromide, tantalum nitride, titanium nitride, cesium silicide, nickel chromium compound, ruthenium oxide, tantalum nitride compound, doped polysilicon, disilcide or polycide.

50. The apparatus of claim 18, wherein the substrate material is silicon, ceramic material, germanium, indium gallium arsenide or semiconductor materials.

51. The apparatus of claim 18, wherein a spatial machining resolution of less than one-twentieth of a cross-sectional diameter of the pulsed laser beam from the ultrafast laser oscillator in a focused state at the surface of the resistor film can be achieved.

53. The apparatus of claim 18, wherein the cumulative heating effect is minimized, quality of resistor trimming is improved and machining efficiency is improved by controlling the scanning speed of a laser beam from the ultrafast laser oscillator of pulse repetition rate 1 MHZ to 400 MHZ;

wherein the optimal scanning speed to minimize the cumulative heating effect, improve the resistor trimming efficiency and improve the resistor trimming quality depend on the repletion rate of the laser beam, the ablated feature size and a type of gas or liquid assist used.

54. The apparatus of claim 18 further comprises means to improve the ablation efficiency and feature size repeatability;

wherein a pulsed laser beam from the ultrafast laser oscillator having the fundamental frequency having the wavelength in the range of 700 nm to 1200 nm, will have 50% to 200% higher resistor trimming efficiency than the second harmonic frequency of 350 nm-600 nm from the ultrafast laser oscillator due to the higher laser power; and

wherein a pulsed laser second harmonic frequency from the ultrafast laser oscillator having the wavelength in the range of 350 nm to 600 nm, will have 50% to 200% higher resistor trimming efficiency compared to third harmonic frequency from the ultrafast laser oscillator of 233 nm-400 nm due to the first laser power.

55. The apparatus of claim 54;

wherein the fundamental frequency from ultrafast laser oscillator has better laser stability position accuracy and feature size repeatability than the second harmonic frequency from an ultrafast laser oscillator due to increased optical components and sensitivity of the frequency conversion crystal; and

wherein the second harmonic frequency from the ultrafast laser oscillator has better laser stability, position accuracy and feature size repeatability than the third harmonic frequency from the ultrafast laser oscillator due to increased optical components and sensitivity of the frequency conversion crystals.

56. The apparatus of claim 18, wherein the ultrafast laser oscillator can be a fiber oscillator amplifier of repetition rate greater than 1 MHZ.

57. The apparatus of claim 18, wherein debris is loosely bound to the surface of the work piece and can be removed while machining using pressurized gas assist and hence the process may not require post processing.

58. The apparatus of claim 18, wherein the resistor film is a thin film or a thick film resistor.

59. The apparatus of claim 18, wherein the resistor film is a thin film and thick film hybrid resistor.

60. The apparatus of claim 18, wherein the pulse modulating means, scanning means, resistor measuring device and the translation table means are controlled by central processor control means.

61. The apparatus of claim 18, the resistive layer or film is selective removed by laser pulse from ultrafast laser oscillator wherein;

a layer of material can be selectively removed without ablating the underlying material by precisely controlling the pulsed laser fluence;

the resistor trimming can be of any desired shape depending on the application;

overlying resistive layer can be removed layer by layer or few layers together by controlling the laser fluence;

each layer can vary in thickness from few micrometers to few nanometers;

the laser fluence of the material depend on the material, number of pulse at each scan point, scanning speed, focused spot size, repletion rate of the laser pulse, laser wavelength and the pulse width;

62. The apparatus of claim 18, wherein resistor trimming using ultrafast laser pulse has miminal or no microcracks formed on the substrate, that cause resistor value drift from normal value.

63. The apparatus of claim 18, wherein ultrafast laser ablation is very sensitive to wavelength and hence not limited to certain wavelength range depending on the resistor film material and substrate material, hence depending on the required spot size, speed, resistive film thickness the wavelength is selected.

64. The apparatus of claim 18, wherein resistor trimming using ultrafast laser pulse has minimal or no heat affected zone, debris and molten material and there is no damage to the adjacent devices and hence the restriction on minimum space between components is eased and hence increase the compactness of the device, paving the way for smaller devices or circuits for both integrated circuit, or hybrid circuits.

65. The apparatus of claim 64, wherein the number of device per wafer can be increased and hence the overall reduction in the cost of manufacturing of the devices.

66. The apparatus of claim 18, wherein the ablated feature size and hence the trim kerf can be precisely controlled using laser pulse from ultrafast laser oscillator, hence uniform trim kerf can be obtained, which results in precise control and post determination of resistor values.

67. The apparatus of claim 18, wherein there is minimal or no heat affected zone due to short pulse width of ultrafast laser beam hence no device settling time is required between laser trim and functional measurement of the active devices and the overall processing time is reduced.

68. The apparatus of claim 18, wherein molten resistive material and debris are minimal or absent, due to short laser pulse width which results in long term stability of resistor value and quality of laser trimming and hence minimal or no post processing may be required to remove the resistive molten material and debris.

52. An apparatus for ablating a feature smaller then the focused spot size of the pulsed laser beam from an ultrfast laser oscillator of a pulse repetition rate of 1 MHZ to 400 MHZ, comprising;

means for controlling the laser threshold fluence slightly above the ablation threshold of the material;

means for controlling the number of pulses and the duration between the pulses for minimizing or eliminating the cumulative heating effect, using pulse modulation means; and

wherein a spatial machining resolution of less than one-twentieth of a cross-sectional diameter of the pulsed laser beam in a focused state at the surface of the work piece is obtained.