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Circuitized substrate, method of making same and information handling system using same

  • US 20060040426A1
  • Filed: 10/26/2005
  • Published: 02/23/2006
  • Est. Priority Date: 10/07/2003
  • Status: Active Grant
First Claim
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1. A method of making a circuitized substrate, said method comprising:

  • providing a first dielectric layer having a first surface and a second opposing surface;

    forming a first pattern of conductors and a second pattern of conductors spaced from said first pattern and electrically coupled thereto on said first surface of said first dielectric layer;

    forming a common conductive line on said second opposing surface of said first dielectric layer and electrically connected to each of said conductors of said second pattern of conductors; and

    thereafter terminating said electrical connections between each of said conductors of said second pattern of conductors and said common conductive line using a laser.

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