Multiprocessor chip having bidirectional ring interconnect
First Claim
1. An apparatus comprising at least one bidirectional ring structure on a semiconductor chip.
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Abstract
Embodiments of the present invention are related in general to on-chip integration of multiple components on a single die and in particular to on-chip integration of multiple processors via a bidirectional ring interconnect. An embodiment of a semiconductor chip includes a plurality of processors, an address space shared between the processors, and a bidirectional ring interconnect to couple the processors and the address space. An embodiment of a method includes calculating distances between a packet source and destination on multiple ring interconnects, determining on which interconnect to transport the packet, and then transporting the packet on the determined interconnect. Embodiments provide improved latency and bandwidth in a multiprocessor chip. Exemplary applications include chip multiprocessing.
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Citations
46 Claims
- 1. An apparatus comprising at least one bidirectional ring structure on a semiconductor chip.
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8. A semiconductor chip comprising:
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a plurality of processors;
an address space shared between the plurality of processors; and
a bidirectional ring structure to couple to the plurality of processors and the address space. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A system comprising:
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a multiprocessor chip comprising at least one central processing unit, a shared address space, and at least one bidirectional ring structure to couple the at least one central processor unit and agents of the shared address space; and
a bus to transport packets from the multiprocessor chip. - View Dependent Claims (30, 31, 32, 33, 34)
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35. A method comprising:
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calculating distances on first and second ring structures on a chip between a source node and a destination node;
determining on which of the first and second ring structures to transport a packet between the source and destination nodes based on the calculated distances; and
transporting the packet from the source node to the destination node on the determined ring structure. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42)
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43. A machine readable medium having stored thereon a plurality of executable instructions to perform a method comprising:
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calculating distances along a plurality of ring structures on a chip between a source node and a destination node;
identifying on which of the plurality of ring structures to transport a packet between the source and destination nodes according to the calculated distances; and
transporting the packet from the source node to the destination node on the identified ring structure. - View Dependent Claims (44, 45, 46)
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Specification