METHOD AND APPARATUS FOR DETECTING LEAKS IN A FLUID COOLING SYSTEM

• US 20060042358A1
• Filed: 08/27/2004
• Published: 03/02/2006
• Est. Priority Date: 08/27/2004
• Status: Active Grant

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Hamann, Hendrik F., Von Gutfeld, Robert J., Gelorme, Jeffrey D.
• Granted Patent: US 7,021,124 B2
• Time in Patent Office: Days
• US Class Current: 73/40
• CPC Class Codes: G01M 3/04 by detecting the presence of fluid at the leakage point
• CPC Class Codes: G01M 3/188 for radiators

Abstract

One embodiment of the present method and apparatus for detecting leaks in a fluid cooling system enables a user to rapidly detect fluid leaks in the vicinity of a microprocessor chip or other delicate item. In one embodiment, the invention comprises a detector and a border coupled to the detector and disposed peripherally about a protected item (e.g., the microprocessor chip or other delicate item). In one embodiment, the border is a layered structure that is adapted to complete an electrical circuit with the detector when the border comes into contact with fluid.

Claims

1. Apparatus for detecting fluid leaks in the vicinity of a protected item, the apparatus comprising:

a detector; and

a border disposed peripherally about said protected item for completing an electrical circuit with said detector when said border is exposed to moisture, said border comprising;

a first conductive layer coupled to said detector at a first detector connection;

a second conductive layer coupled to said detector at a second detector connection and further coupled to a main wire that is peripherally disposed about said protected item and is electrically coupled to said detector, and

a hygroscopic layer disposed between said first conductive layer and said second conductive layer, wherein said hygroscopic layer comprises a material that is substantially electrically insulating when dry but becomes electrically conductive when exposed to moisture.

3. The apparatus of claim 1, further comprising:

an insulating layer disposed beneath said first conductive layer.

4. The apparatus of claim 3, wherein said insulating layer is a carrier of a microprocessor chip.

5. The apparatus of claim 1, wherein said first conductive layer comprises a thin film metal layer formed from at least one of gold, aluminum and copper.

6. The apparatus of claim 1, wherein said first conductive layer has a thickness of approximately 100 to 200 nanometers.

7. The apparatus of claim 1, wherein said hygroscopic layer is formed from at least one of sodium chloride, magnesium zinc ferrite and lithium chloride.

8. The apparatus of claim 1, wherein said hygroscopic layer has a thickness of approximately 100 to 200 nanometers.

9. The apparatus of claim 1, wherein said second conductive layer comprises:

a plurality of wires or thin films disposed in a substantially perpendicular orientation relative to said first conductive layer.

10. The apparatus of claim 9, wherein wires in said plurality of thin films or wires are spaced at least several hundreds of microns apart.

11. The apparatus of claim 1, wherein said second conductive layer is formed from at least one of gold, aluminum and copper.

13. The apparatus of claim 1, further comprising:

an alarm coupled to said detector; and

a shut-off mechanism coupled to said alarm and adapted for shutting down a source of said fluid leak.

14. The apparatus of claim 1, wherein said apparatus is adapted for protecting a museum piece or art item.

15. The apparatus of claim 13, wherein said alarm is at least one of an audible alarm, a visual alarm, an alert sent to a remote device, or a meter.

2. (canceled)

12. (canceled)

16-23. -23. (canceled)

24. Apparatus for detecting fluid leaks in the vicinity of a protected item, the apparatus comprising:

a detector; and

a border disposed peripherally about said protected item for completing an electrical circuit with said detector when said border is exposed to moisture, said border comprising;

a first conductive layer coupled to said detector at a first detector connection;

an insulating layer embodied in a microprocessor chip carrier and disposed beneath said first conductive layer;

a second conductive layer coupled to said detector at a second detector connection; and

a hygroscopic layer disposed between said first conductive layer and said second conductive layer, wherein said hygroscopic layer comprises a material that is substantially electrically insulating when dry, but becomes electrically conductive when exposed to moisture.

25. The apparatus of claim 24, wherein said first conductive layer comprises a thin film metal layer formed from at least one of gold, aluminum and copper.

26. The apparatus of claim 24, wherein said first conductive layer has a thickness of approximately 100 to 200 nanometers.

27. The apparatus of claim 24, wherein said hygroscopic layer is formed from at least one of sodium chloride, magnesium-zinc ferrite and lithium chloride.

28. The apparatus of claim 24, wherein said hygroscopic layer has a thickness of approximately 100 to 200 nanometers.

29. The apparatus of claim 24, wherein said second conductive layer comprises:

a plurality of wires or thin films disposed in a substantially perpendicular orientation relative to said first conductive layer.

30. The apparatus of claim 29, wherein wires in said plurality of thin films or wires are spaced at least several hundreds of microns apart.

31. The apparatus of claim 24, wherein said second conductive layer is formed from at least one of gold, aluminum and copper.

32. The apparatus of claim 24, further comprising:

an alarm coupled to said detector; and

a shut-off mechanism coupled to said alarm and adapted for shutting down, a source of said fluid leak.

33. The apparatus of claim 32, wherein said alarm is at least one of an audible alarm, a visual alarm, an alert sent to a remote device, or a meter.