Package for MEMS devices

• US 20060042382A1
• Filed: 09/01/2004
• Published: 03/02/2006
• Est. Priority Date: 09/01/2004
• Status: Active Grant

• Current Assignee: Honeywell International Inc.
• Original Assignee: Honeywell International Inc.
• Inventors: DCamp, Jon B., Curtis, Harlan L.
• Granted Patent: US 7,370,530 B2
• Time in Patent Office: Days
• US Class Current: 73/493
• CPC Class Codes: B81B 2201/025 Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
• CPC Class Codes: B81B 7/0074 3D packaging, i.e. encapsulation containing one or several MEMS devices arranged in planes non-parallel to the mounting board
• CPC Class Codes: G01C 19/56 Turn-sensitive devices using vibrating masses, e.g. vibratory angular rate sensors based on Coriolis forces
• CPC Class Codes: G01C 21/166 Mechanical, construction or arrangement details of inertial navigation systems
• CPC Class Codes: G01P 1/00 Details of instruments
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/1461 MEMS

Abstract

A package for packaging one or more MEMS devices is disclosed. A package in accordance with an illustrative embodiment of the present invention can include a packaging structure having a base section, a top section, and an interior cavity adapted to contain a number of MEMS devices therein. In some embodiments, the packaging structure can include a first side, a second side, a third side, and a top end, which, in certain embodiments, may form a pinout plane surface that can be used to connect the packaging structure to other external components. In some embodiments, a number of MEMS-type inertial sensors contained within the interior cavity of the packaging structure can be used to detect and measure motion in multiple dimensions, if desired.

Claims

1. A package, comprising:

two or more non-planar walls defining an interior cavity;

a first MEMS device mounted adjacent an inner surface of a first one of the non-planar walls; and

a second MEMS device mounted adjacent an inner surface of a second one of the non-planar walls.

2. The package of claim 1, wherein the inner surface of the first one of the non-planar walls is orthogonal to the inner surface of the second one of the non-planar walls.

3. The package of claim 2, further comprising a third MEMS device mounted adjacent an inner surface of a third one of the non-planar walls.

4. The package of claim 3, wherein the inner surface of the third one of the non-planar walls is orthogonal to the inner surface of the second one of the non-planar walls and is orthogonal to the inner surface of the first one of the non-planar walls.

5. The package of claim 1, wherein the interior cavity is hermetically sealed.

6. A package, comprising:

a packaging structure having a first side, a second side, a third side, and an interior cavity;

a first MEMS device mounted on an inner wall surface of the first side;

a second MEMS device mounted on an inner wall surface of the second side; and

a third MEMS device mounted on an inner wall surface of the third side.

7. The package of claim 6, wherein each of the first, second, and third sides slope inwardly at an angle of inclination away from a base section of the packaging structure.

8. The package of claim 7, wherein the angle of inclination for each of the first, second, and third sides is substantially equal.

9. The package of claim 6, further comprising a lid coupled to the packaging structure.

10. The package of claim 9, wherein the lid comprises a material different than the remaining portion of the packaging structure.

11. The package of claim 9, wherein the interior cavity is hermetically sealed.

12. The package of claim 9, wherein the interior cavity is vacuum sealed.

13. The package of claim 9, wherein the interior cavity contains an inert gas.

14. The package of claim 6, wherein the packaging structure has the general shape of a regular tetrahedron with an apex portion thereof removed.

15. The package of claim 6, wherein the packaging structure has the general shape of an irregular tetrahedron with an apex portion thereof removed.

16. The package of claim 6, wherein the packaging structure further includes a planar top end.

17. The package of claim 16, wherein the top end of the packaging structure defines a pinout plane surface.

18. The package of claim 6, wherein the packaging structure further includes a number of electronic pinouts.

19. The package of claim 6, wherein the packaging structure further includes one or more bondout pads adapted to connect the package to one or more external components.

20. The package of claim 6, wherein each of the first, second, and third MEMS devices is coupled to a corresponding die.

21. The package of claim 20, wherein each die is bonded to the inner wall surface using a layer of adhesive or epoxy.

22. The package of claim 20, wherein each die is bonded to the inner wall using a thermocompression bonding technique.

23. The package of claim 22, wherein said thermocompression bonding technique is a flip-chip thermocompression bonding technique.

24. The package of claim 20, wherein each die is bonded to the inner wall surface using a layer of solder.

25. The package of claim 6, wherein each MEMS device is a gyroscope.

26. The package of claim 6, wherein each MEMS device is an accelerometer.

27. The package of claim 6, wherein said package is a three-axis LCC package.

28. The package of claim 6, wherein the packaging structure comprises a single molded piece.

29. The package of claim 6, wherein the packaging structure comprises a number of separate pieces assembled together.

30. A three-axis package, comprising:

a packaging structure having a base section, a top section, and an interior cavity adapted to contain a plurality of MEMS devices therein;

the packaging structure including a first side, a second side, a third side, and a planar top end.

31. The three-axis package of claim 30, wherein each of the first, second, and third sides slope inwardly at an angle of inclination away from the base section of the packaging structure.

32. The three-axis package of claim 31, wherein the angle of inclination for each of the first, second, and third sides is substantially equal.

33. The three-axis package of claim 30, further comprising a lid coupled to the base section of the packaging structure.

34. The three-axis package of claim 33, wherein the lid comprises a material different than the remaining portion of the packaging structure.

35. The three-axis package of claim 33, wherein the interior cavity is hermetically sealed.

36. The three-axis package of claim 33, wherein the interior cavity is vacuum sealed.

37. The three-axis package of claim 33, wherein the interior cavity contains an inert gas.

38. The three-axis package of claim 30, wherein the packaging structure has the general shape of a regular tetrahedron with an apex portion thereof removed.

39. The three-axis package of claim 30, wherein the packaging structure has the general shape of an irregular tetrahedron with an apex portion thereof removed.

40. The three-axis package of claim 30, wherein the top end of the packaging structure defines a pinout plane surface.

41. The three-axis package of claim 30, wherein the packaging structure further includes a number of electronic pinouts.

42. The three-axis package of claim 30, wherein the packaging structure further includes one or more bondout pads adapted to connect the package to one or more external components.

43. The three-axis package of claim 30, further comprising a plurality of die coupled to the first, second, and third sides of the packaging structure, each die including an inertial measurement unit adapted to detect and measure motion of the package about a separate rate axis.

44. The three-axis package of claim 43, wherein each die is oriented lengthwise along an inner wall surface of each corresponding side of the packaging structure.

45. The three-axis package of claim 44, wherein each die is bonded to the inner wall surface using a layer of adhesive or epoxy.

46. The three-axis package of claim 44, wherein each die is bonded to the inner wall using a thermocompression bonding technique.

47. The three-axis package of claim 46, wherein said thermocompression bonding technique is a flip-chip thermocompression bonding technique.

48. The three-axis package of claim 44, wherein each die is bonded to the inner wall surface using a layer of solder.

49. The three-axis package of claim 43, wherein said plurality of die includes:

a first die coupled to the first side of the packaging structure, said first die including a first inertial sensor adapted to detect and measure motion about an X-rate axis;

a second die coupled to the second side of the packaging structure, said second die including a second inertial sensor adapted to detect and measure motion about a Y-rate axis; and

a third die coupled to the third side of the packaging structure, said third die including a third inertial sensor adapted to detect and measure motion about a Z-rate axis.

50. The three-axis package of claim 30, wherein said plurality of MEMS devices are gyroscopes.

51. The three-axis package of claim 30, wherein said plurality of MEMS devices are accelerometers.

52. The three-axis package of claim 30, wherein said three-axis package is a LCC package.

53. The three-axis package of claim 30, wherein the packaging structure comprises a single molded piece.

54. The three-axis package of claim 30, wherein the packaging structure comprises a number of separate pieces assembled together.

55. A three-axis package, comprising:

a packaging structure including a first side, a second side, a third side, a top end, and an interior cavity; and

a plurality of die coupled to an inner wall of the first, second, and third sides of the packaging structure, each die including an inertial measurement unit adapted to detect and measure motion of the package about a separate rate axis.

56. A three-axis package, comprising:

a packaging including a first side, a second side, a third side, a top end, and an interior cavity;

a first die coupled to an inner wall of the first side of the packaging structure, said first die including a first inertial sensor adapted to detect and measure motion about an X-rate axis;

a second die coupled to the inner wall of the second side of the packaging structure, said second die including a second inertial sensor adapted to detect and measure motion about a Y-rate axis; and

a third die coupled to the inner wall of the third side of the packaging structure, said third die including a third inertial sensor adapted to detect and measure motion about a Z-rate axis.

57. A MEMS device for detecting and measuring inertial motion in multiple dimensions, comprising:

a plurality of inertial measurement units each adapted to sense motion about a separate rate axis; and

a three-axis package adapted to contain said plurality of inertial measurement units.

58. The MEMS device of claim 57, wherein said package is a LCC.

59. A MEMS device for detecting and measuring inertial motion in three dimensions, comprising:

a first inertial measurement unit adapted to detect and measure motion about an X-rate axis of the device;

a second inertial measurement unit adapted to detect and measure motion about a Y-rate axis of the device;

a third inertial measurement unit adapted to detect and measure motion about a Z-rate axis of the device; and

a three-axis package adapted to contain said first, second, and third inertial measurement units.