Image sensor having integrated electrical optical device and related method

• US 20060043260A1
• Filed: 08/24/2004
• Published: 03/02/2006
• Est. Priority Date: 08/24/2004
• Status: Active Grant

• Current Assignee: Aptina Imaging Corporation (ON Semiconductor Corporation)
• Original Assignee: Micron Technology, Inc.
• Inventors: Hartlove, Jason, Ma, Guolin
• Granted Patent: US 7,329,856 B2
• Time in Patent Office: Days
• US Class Current: 250/208.100
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14645 Colour imagers
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/02162 for filtering or shielding light, e.g. multicolour filters for photodetectors
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An image sensing device is disclosed having a die formed with an array of photosensing sites and a structure of optical material having infrared absorbing characteristics formed over the photosensing sites. An embodiment is disclosed in which the structure of optical material having infrared absorbing characteristics is formed as an array of microlenses for directing visible image light onto the photosensing sites and at the same time filtering out infrared wavelengths that interfere with image capture. Alternatively, the structure may be designed to filter out other ranges of wavelengths outside of the visible spectrum.

Claims

1. An imaging device, comprising

a substrate having photosensing elements;

a light-transmissive optical structure on the substrate to direct light onto the photosensing elements; and

wherein the optical structure absorbs infrared energy from the light.

2. The imaging device of claim 1 wherein the optical structure comprises an any of lenses.

3. The imaging device of claim 1 wherein the optical structure comprises a plastic material formed into an array of lenses.

4. The imaging device of claim 3 wherein the plastic material comprises a dye that absorbs infrared energy.

5. The imaging device of claim 1 wherein the optical structure comprises a plastic resin.

6. The imaging device of claim 5 wherein the optical structure comprises a layer of plastic resin formed on the substrate into an array of microlens.

7. The imaging device of claim 1 wherein the photosensing elements include CMOS devices.

8. The imaging device of claim 1 wherein the optical structure comprises a plastic substance formed on the substrate to direct light energy onto the photosensing elements, and

the plastic substance has a dye that selectively absorbs infrared energy.

9. The imaging device of claim 1 wherein the optical structure includes:

an optical layer disposed on the substrate and operable to absorb the infrared energy from the light; and

an array of microlenses disposed on the optical layer.

10. An imaging device comprising:

a substrate including integrated electrical elements;

an array of lenses on the substrate;

a shell structure surrounding the array of lenses and having a top opening,

a light-transmissive cover attached to the top opening of the shell structure; and

wherein the array of lenses is made of a substance that is substantially transmissive of visible light and substantially absorbent of selected wavelengths of light outside the visible spectrum.

11. The imaging device of claim 10 wherein the cover comprises glass.

12. The imaging device of claim 10 wherein the array of the lenses is formed from a polymer resin.

13. The imaging device of claim 10 wherein the array of lenses is formed from a mixture of a polymer and a dye for absorbing the selected wavelengths of light outside the visible spectrum.

14. The imaging device of claim 10 wherein the array of lenses comprises a plastic resin mixed with a dye that absorbs energy in the infrared band.

15. The imaging device of claim 10, further comprising a field lens mounted in spaced elation to the cover for directing image light onto the array of lenses.

16. The imaging device of claim 10 wherein the field lens comprises glass.

17. The imaging device of claim 10 wherein the electrical elements include CMOS vices.

18. The imaging device of claim 10, further comprising an adhesive sealant attaching the cover to the shell structure to protect the lens array and substrate.

19. The imaging device of claim 10 wherein the array of lenses comprises microlenses formed on the substrate so as to focus light energy onto certain of the electrical elements.

20. The imaging device of claim 10, further comprising color filters operable to cause the electrical elements to capture color content of an image.

21-26. -26. (canceled)