Image pickup apparatus and image pickup system
First Claim
1. An image pickup apparatus including a photoelectric conversion element which has a first semiconductor region of a first conductive type, and a second semiconductor region of a second conductive type constituting a junction with the first semiconductor region, a third semiconductor region of a first conductive type, provided in the first semiconductor region for providing a potential of the first semiconductor region for a predetermined potential, an element isolation region provided between the third semiconductor region and the second semiconductor region, a conductive layer provided on the element isolation region, and a fourth semiconductor region of a first conductive type provided under the element isolation region:
- the apparatus comprising a side wall on a side of the conductive layer, wherein a width c of the element isolation region, a width b of the side wall and a distance a between an end of the element isolation region at the side of the third semiconductor region and an end of the conductive layer at the side of the third semiconductor region satisfy a relation c>
a≧
b.
1 Assignment
0 Petitions
Accused Products
Abstract
To provide a solid-state image pickup apparatus with little or no difference in the dark currents between adjacent photoelectric conversion elements and providing a high sensitivity and a low dark current even in a high-speed readout operation.
A well 302 is formed on a wafer 301, and semiconductor layers 101a, 101b are formed in the well to constitute photodiodes. A well contact 306 is formed between the semiconductor layers 101a, 101b. Element isolation regions 303b, 303a are provided between the well contact and the semiconductor layers, and channel stop layers 307b, 307a are provided under the element isolation regions 303b, 303a. A conductive layer 304 is provided on the element isolation region 303b, and a side wall 308 is provided on a side face of the conductive layer 304. A distance a between an end of the element isolation region 303b and the conductive layer 304, a width b of the side wall 308 and a device isolation width c satisfy a relation c>a≧b.
148 Citations
13 Claims
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1. An image pickup apparatus including a photoelectric conversion element which has a first semiconductor region of a first conductive type, and a second semiconductor region of a second conductive type constituting a junction with the first semiconductor region, a third semiconductor region of a first conductive type, provided in the first semiconductor region for providing a potential of the first semiconductor region for a predetermined potential, an element isolation region provided between the third semiconductor region and the second semiconductor region, a conductive layer provided on the element isolation region, and a fourth semiconductor region of a first conductive type provided under the element isolation region:
the apparatus comprising a side wall on a side of the conductive layer, wherein a width c of the element isolation region, a width b of the side wall and a distance a between an end of the element isolation region at the side of the third semiconductor region and an end of the conductive layer at the side of the third semiconductor region satisfy a relation c>
a≧
b.
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2. An image pickup apparatus including a photoelectric conversion element which has a first semiconductor region of a first conductive type, and a second semiconductor region of a second conductive type constituting a junction with the first semiconductor region, a third semiconductor region of a first conductive type, provided in the first semiconductor region for providing a potential of the first semiconductor region for a predetermined potential, a element isolation region provided between the third semiconductor region and the second semiconductor region, a conductive layer provided on the element isolation region, and a fourth semiconductor region of a first conductive type provided under the element isolation region:
the apparatus comprising a side wall on a side of the conductive layer, wherein the side wall is provided on the element isolation region in such a manner that an external end of the side wall does not exceed an end of the element isolation region. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 13)
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11. An image pickup apparatus including a photoelectric conversion element which has a first semiconductor region of a first conductive type, and a second semiconductor region of a second conductive type constituting a junction with the first semiconductor region, a third semiconductor region of a first conductive type, provided in the first semiconductor region and having a higher impurity concentration than in the first semiconductor region, a element isolation region provided between the third semiconductor region and the second semiconductor region, a conductive layer provided on the element isolation region, and a fourth semiconductor region of a first conductive type provided under the element isolation region and having a higher impurity concentration than in the first semiconductor region:
the apparatus comprising a side wall on a side of the conductive layer, wherein the side wall is provided on the element isolation region in such a manner that an external end of the side wall does not exceed an end of the element isolation region.
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12. An image pickup apparatus including a photoelectric conversion element which has a first semiconductor region of a first conductive type, and a second semiconductor region of a second conductive type constituting a junction with the first semiconductor region, a third semiconductor region of a first conductive type, provided in the first semiconductor region for fixing a potential of the first semiconductor region at a predetermined potential, a element isolation region provided between the third semiconductor region and the second semiconductor region, a conductive layer provided on the element isolation region, and a fourth semiconductor region of a first conductive type provided under the element isolation region:
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wherein the second semiconductor regions are arranged one-dimensionally or two-dimensionally, in which the plural second semiconductor regions arranged along a direction form a group by each predetermined number; and
the third semiconductor region is provided in the first semiconductor region between the second semiconductor region in a first group and the second semiconductor group in a second group, adjacent to the first group.
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Specification