×

Semiconductor device with simplified constitution

  • US 20060043514A1
  • Filed: 10/31/2003
  • Published: 03/02/2006
  • Est. Priority Date: 11/08/2002
  • Status: Active Grant
First Claim
Patent Images

1. A semiconductor device which is packaged at substantially identical outer dimensions to the outer dimensions of a first semiconductor chip, comprising:

  • first pads provided on a main surface of said first semiconductor chip;

    a light-receiving element portion provided on said main surface of said first semiconductor chip such that a light-receiving surface thereof is exposed;

    a light-transmitting portion provided so as to cover the light-receiving surface of said light-receiving element portion for transmitting incoming light to said light-receiving element portion;

    a wiring layer which is electrically connected to said first pads and extends from said first pads over said main surface of said first semiconductor chip; and

    external terminals which are provided in a position opposing said wiring layer and electrically connected to said first pads via said wiring layer.

View all claims
  • 2 Assignments
Timeline View
Assignment View
    ×
    ×