Electronic component comprising a multilayer wiring frame and method for producing the same
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Accused Products
Abstract
The invention relates to an electronic component having a multilayered rewiring plate, which carries a circuit chip, in particular a magnetic memory chip, and connects contact areas of the chip to external contacts of the electronic component via rewiring lines. The rewiring plate has at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. Furthermore, the invention encompasses a method for producing this electronic component.
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Citations
55 Claims
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1-27. -27. (canceled)
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28. An electronic component comprising:
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a multilayered rewiring plate;
a circuit chip, including a magnetic memory chip, carried on the rewiring plate, wherein the rewiring plate connects contact areas of the chip to external contacts of the electronic component via rewiring lines, the rewiring plate having at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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44. A method for producing an electronic component comprising:
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defining the electronic component to include a multilayered rewiring plate, which carries at least one circuit chip and connects contact areas of the circuit chip to external contacts of the electronic component via rewiring lines, the rewiring plate having at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy;
patterning of a shielding film made of amorphous metal or an amorphous metal alloy for a panel with a plurality of component positions;
laminating the patterned shielding film onto the rewiring plate of the panel;
applying and electrical connecting of circuit chips in the component positions of the rewiring plate of the panel;
applying a plastic housing composition to the panel embedding the circuit chips and the electrical connections;
applying external contacts in the component positions of the panel; and
singulation of the component positions of the panel to form individual electronic components. - View Dependent Claims (45, 46, 47, 48, 49, 50, 51, 52, 53, 54)
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55. An electronic component comprising:
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a multilayered rewiring plate;
a circuit chip, including a magnetic memory chip, carried on the rewiring plate, wherein the rewiring plate includes connecting means for connecting contact areas of the chip to external contacts of the electronic component via rewiring lines, the rewiring plate having at least one patterned, magnetic shielding layer made of an amorphous metal or an amorphous metal alloy.
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Specification