Optoelectronic component and housing
First Claim
Patent Images
1. A housing for an optoelectronic component comprising:
- at least one mounting area for mounting a semiconductor chip or a component comprising at least one semiconductor chip; and
a reflector comprising at least one reflector wall that projects away from the mounting area in an intended radiation direction of the semiconductor chip and is connected thermally conductively to the mounting area, wherein the reflector wall is configured to function as a heat dissipating element for dissipating heat from the housing by radiation and convection.
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Abstract
Disclosed is a housing for an optoelectronic component comprising a reflector and a heat dissipating element, wherein the housing comprises a mounting portion with at least one mounting area for mounting a semiconductor chip or a component provided with at least one semiconductor chip, plus at least one reflector wall implemented as a heat dissipating element, which is connected thermally conductively to the mounting area and through which the heat is dissipated from the housing. Also disclosed is an optoelectronic component provided with such a housing.
85 Citations
13 Claims
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1. A housing for an optoelectronic component comprising:
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at least one mounting area for mounting a semiconductor chip or a component comprising at least one semiconductor chip; and
a reflector comprising at least one reflector wall that projects away from the mounting area in an intended radiation direction of the semiconductor chip and is connected thermally conductively to the mounting area, wherein the reflector wall is configured to function as a heat dissipating element for dissipating heat from the housing by radiation and convection. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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Specification