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Optoelectronic component and housing

  • US 20060043546A1
  • Filed: 08/12/2005
  • Published: 03/02/2006
  • Est. Priority Date: 08/31/2004
  • Status: Abandoned Application
First Claim
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1. A housing for an optoelectronic component comprising:

  • at least one mounting area for mounting a semiconductor chip or a component comprising at least one semiconductor chip; and

    a reflector comprising at least one reflector wall that projects away from the mounting area in an intended radiation direction of the semiconductor chip and is connected thermally conductively to the mounting area, wherein the reflector wall is configured to function as a heat dissipating element for dissipating heat from the housing by radiation and convection.

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