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Device and method for applying semiconductor chips to carriers

  • US 20060043584A1
  • Filed: 09/27/2003
  • Published: 03/02/2006
  • Est. Priority Date: 09/28/2002
  • Status: Active Grant
First Claim
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1. An apparatus for applying semiconductor chips to a plurality of substrates, in particular smartcard modules or flexboards, wherein at an adhesive application device adhesive is applied to the substrate at predefined substrate positions, at a fitting device the substrate is fitted with the semiconductor chips at the substrate positions, and in a curing device the adhesive is cured, characterized in that the curing device and/or a further device can be connected by a clamping device to a conveyor belt which transports the substrates along the devices, and can be moved in the transport direction, at a transport speed of the conveyor belt, by a lifting device.

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