Singular and co-molded pre-forms

• US 20060043635A1
• Filed: 09/20/2005
• Published: 03/02/2006
• Est. Priority Date: 10/31/2003
• Status: Abandoned Application

• Current Assignee: Lauren A. Groth
• Original Assignee: Lauren A. Groth
• Inventors: Groth, Lauren A.
• Application Number:
  US11/230,441
• Publication Number:
  US 20060043635A1
• Time in Patent Office: Days
• US Class Current: 264/219
• CPC Class Codes: B29C 33/3835 Designing moulds, e.g. using CAD-CAM
• CPC Class Codes: B29C 45/1676 using a soft material and a rigid material, e.g. making articles with a sealing part
• CPC Class Codes: B29L 2031/3425 Printed circuits
• CPC Class Codes: B29L 2031/721 Vibration dampening equipment, e.g. shock absorbers bumpers B29L2031/3044, springs B29L2031/774
• CPC Class Codes: E21B 47/017 Protecting measuring instruments
• CPC Class Codes: H05K 2203/0173 Template for holding a PCB having mounted components thereon
• CPC Class Codes: H05K 2203/1316 Moulded encapsulation of mounted components
• CPC Class Codes: H05K 3/284 for encapsulating mounted components H05K1/185 takes precedence
• CPC Class Codes: H05K 7/1417 having securing means for mounting boards, plates or wiring boards H05K7/1461 takes precedence
• CPC Class Codes: Y10T 29/49176 with molding of electrically insulating material

Abstract

Molded pre-forms that are used to protect electronic components and assemblies from damage due to vibration, shock and/or thermal exposure. The pre-forms can be singularly molded or co-molded. Co-molded pre-forms can include hard surface layers over softer molded compositions. The pre-forms are molded in molds that are formed using modified images obtained from printed circuit boards having the electronic components thereon. Images of the printed circuit boards are obtained and modified to improve vibrational dampening and/or heat transfer. The molded pre-forms allow for access to the printed circuit boards for purposes of replacing or repairing the printed circuit boards.

Claims

1. A method of protecting electrical components in electrical devices which comprises:

providing an electrical device that includes an electrical component;

providing a first molded form complementarily configured to cover a first portion of the electrical component;

providing a second molded form complementarily configured to cover a second portion of the electrical component; and

securing the electrical component between the first and second molded forms to protect the electrical component from damage caused by at least one of vibration, shock and thermal effects.

2. A method of protecting electrical components according to claim 1, wherein the electrical device comprises a portable electrical device.

3. A method of protecting electrical components according to claim 2, wherein the electrical device comprises a hand-held device.

4. A method of protecting electrical components according to claim 2, wherein the electrical device comprises a computer.

5. A method of protecting electrical components according to claim 1, wherein the electrical device comprises a computer module.

6. A method of protecting electrical components according to claim 5, wherein the electrical device comprises a computer module that is incorporated into a transportation device.

7. A method of protecting electrical components according to claim 6, wherein the transportation device is one of a motor vehicle, rail vehicle, aircraft, spacecraft, boat and vessel.

8. A method of protecting electrical components according to claim 1, wherein the electrical device comprises an appliance.

9. A method of protecting electrical components according to claim 1, wherein the electrical components comprises a circuit board.

10. A method of protecting electrical components according to claim 1, wherein the electrical component comprises a battery.

11. A method of protecting electrical components according to claim 1, wherein the first and second molded forms comprises co-molded forms.

12. A method of protecting electrical components according to claim 1, wherein the co-molded forms comprise an outer surface layer that is harder than a central portion of the co-molded forms.

13. A method of protecting electrical components according to claim 1, wherein the first and second molded forms are molded together about a hinge.

14. A method of fabricating a molded form used to protect an electrical component which method comprises the steps of:

a) providing an electrical device that includes an electrical component;

b) obtaining dimensional data of the electrical component;

c) modifying the obtained dimensional data of the electrical component;

d) fabricating a mold for molding a molded form that is substantially complementarily shaped to a first portion of the electrical component, said mold being complementarily shaped to the first portion of the electrical component by an operation that utilizes the modified dimensional data of the electrical component; and

e) molding a molded form using the mold.

15. A method of fabricating a molded form used to protect an electrical component according to claim 14, wherein the step b) of obtaining dimensional data of the electrical component comprises at least one of obtaining an image of the electronic component and physically measuring the dimensions of the electronic component.

16. A method of fabricating a molded form used to protect an electrical component according to claim 14, wherein the step c) of modifying the obtained dimensional data comprises at least one of adding or subtracting a factor to at least portions of the obtained dimensional data.

17. A method of fabricating a molded form used to protect an electrical component according to claim 14, wherein the electrical device comprises a portable electrical device.

18. A method of fabricating a molded form used to protect an electrical component according to claim 17, wherein the electrical device comprises a computer.

19. A method of fabricating a molded form used to protect an electrical component according to claim 14, wherein the electrical device comprises a computer module

20. A method of fabricating a molded form used to protect an electrical component according to claim 19, wherein the computer module is incorporated into a transportation device.