Anisotropic conductivity connector, probe member, wafer inspecting device, and wafer inspecting method
2 Assignments
0 Petitions
Accused Products
Abstract
Disclosed herein are an anisotropically conductive connector, by which good conductivity is retained over a long period of time even when it is used repeatedly over many times or repeatedly used under a high-temperature environment, and applications thereof. The anisotropically conductive connector is an anisotropically conductive connector having an elastic anisotropically conductive film, in which a plurality of conductive parts for connection extending in a thickness-wise direction of the film have been formed. The elastic anisotropically conductive film has initial properties that supposing that the total number of the conductive parts for connection is Y, an electric resistance of the conductive part for connection in a state that a load of Y×1 g has been applied to the elastic anisotropically conductive film in a thickness-wise direction thereof is R1g, and an electric resistance of the conductive part for connection in a state that a load of Y×6 g has been applied to the elastic anisotropically conductive film in the thickness-wise direction is R6g, the number of conductive parts for connection that R1g is lower than 1 Ω is at least 90% of the total number of the conductive parts for connection, the number of conductive parts for connection that R6g is lower than 0.1 Ω is at least 95% of the total number of the conductive parts for connection, and the number of conductive parts for connection that R6g is at least 0.5 Ω is at most 1% of the total number of the conductive parts of connection.
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Citations
8 Claims
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1. (Canceled)
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2. An anisotropically conductive connector for electrically connecting a circuit board for inspection to a wafer by being arranged on the surface of the circuit board for inspection for conducting electrical inspection of each of a plurality of integrated circuits formed on the wafer in a state of the wafer, which comprises:
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a frame plate, in which a plurality of anisotropically conductive film-arranging holes each extending in a thickness-wise direction of the frame plate have been formed correspondingly to electrode regions, in which electrodes to be inspected have been arranged, in all or part of the integrated circuits formed on the wafer, which is an object of inspection, and a plurality of elastic anisotropically conductive films arranged in the respective anisotropically conductive film-arranging holes in this frame plate and each supported by the peripheral edge about the anisotropically conductive film-arranging hole, wherein each of the elastic anisotropically conductive films is composed of a functional part having a plurality of conductive parts for connection arranged correspondingly to the electrodes to be inspected in the integrated circuits formed on the wafer, which is the object of inspection, containing conductive particles exhibiting magnetism at a high density and extending in the thickness-wise direction of the film and an insulating part mutually insulating these conductive parts for connection, and a part to be supported integrally formed at a peripheral edge of the functional part and fixed to the peripheral edge about the anisotropically conductive film-arranging hole in the frame plate, and wherein the elastic anisotropically conductive film has initial properties that supposing that the total number of the conductive parts for connection is Y, an electric resistance of the conductive part for connection in a state that a load of Y×
1 g has been applied to the elastic anisotropically conductive film in a thickness-wise direction thereof is R1g, and an electric resistance of the conductive part for connection in a state that a load of Y×
6 g has been applied to the elastic anisotropically conductive film in the thickness-wise direction is R6g, the number of conductive parts for connection that a value of R1g is lower than 1 Ω
is at least 90% of the total number of the conductive parts for connection, the number of conductive parts for connection that a value of R6g is lower than 0.1 Ω
is at least 95% of the total number of the conductive parts for connection, and the number of conductive parts for connection that a value of R6g is at least 0.5 Ω
is at most 1% of the total number of the conductive parts for connection. - View Dependent Claims (3, 4, 5, 6, 7, 8)
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Specification