Heat dissipation device

• US 20060044765A1
• Filed: 09/01/2004
• Published: 03/02/2006
• Est. Priority Date: 09/01/2004
• Status: Abandoned Application

• Current Assignee: Infowize Technologies Corporation
• Original Assignee: Infowize Technologies Corporation
• Inventors: Chen, Bai-Shiou
• Application Number:
  US10/930,788
• Publication Number:
  US 20060044765A1
• Time in Patent Office: Days
• US Class Current: 361/720
• CPC Class Codes: H05K 1/0206 by printed thermal vias
• CPC Class Codes: H05K 2201/09781 Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
• CPC Class Codes: H05K 2201/10689 Leaded Integrated Circuit [IC] package, e.g. dual-in-line [DIL]
• CPC Class Codes: H05K 3/4069 for via connections in organic insulating substrates
• CPC Class Codes: H05K 3/429 Plated through-holes specially for multilayer circuits, e.g. having connections to inner circuit layers
• CPC Class Codes: H05K 3/4641 having integrally laminated metal sheets or special power cores

Abstract

A heat dissipation device of a PCB has electronic devices arranged thereon. The heat dissipation device has a plurality of heat dissipation holes formed on the PCB and corresponding to the electronic devices, respectively. The heat dissipation device can dissipate heat from an electronic device without a fan, so that a restriction of an arrangement of the electronic device on the PCB can be prevented.

Claims

1. A heat dissipation device adopted for a PCB having a plurality of electronic devices, comprising a plurality of heat dissipation holes formed in the PCB and corresponding to the electronic devices, respectively.

2. The heat dissipation device as claimed in claim 1, wherein the PCB is a multilayered PCB.

3. The heat dissipation device as claimed in claim 1, wherein the PCB is a single-layer PCB.

4. The heat dissipation device as claimed in claim 1, wherein the heat dissipation holes are formed beneath the electronic devices, respectively.

5. The heat dissipation device as claimed in claim 1, wherein the heat dissipation holes are formed surrounding the electronic devices, respectively.

6. The heat dissipation device as claimed in claim 1, wherein the heat dissipation holes are through holes penetrating the PCB.

7. The heat dissipation device as claimed in claim 1, wherein the heat dissipation holes are concave from the PCB.

8. The heat dissipation device as claimed in claim 1, further including a heat conductor arranged on an inner wall of each of the heat dissipation holes.

9. The heat dissipation device as claimed in claim 1, further including a heat conductor filled with each of the heat dissipation holes.

10. The heat dissipation device as claimed in claim 1, further including a plurality of heat-conducting lines connecting the heat dissipation holes, wherein the heat-conducting lines are arranged on the PCB.

11. The heat dissipation device as claimed in claim 10, wherein the heat-conducting lines are made of metallic materials with good heat conductivities.

12. The heat dissipation device as claimed in claim 10, wherein the heat-conducting lines are arranged on an upper surface of the PCB.

13. The heat dissipation device as claimed in claim 10, wherein the heat-conducting lines are arranged on a lower surface of the PCB.

14. The heat dissipation device as claimed in claim 10, wherein the heat-conducting lines are arranged on different layers of the PCB.

15. The heat dissipation device as claimed in claim 10, wherein the heat-conducting lines connect to one another.

16. The heat dissipation device as claimed in claim 10, wherein the heat-conducting lines fail to connect to one another.

17. The heat dissipation device as claimed in claim 10, wherein each of the heat-conducting lines has an end extending towards an edge of the PCB.

18. The heat dissipation device as claimed in claim 10, wherein a respective one of the electronic devices is an IC.

19. The heat dissipation device as claimed in claim 10, wherein a respective one of the electronic devices is a socket.