Stereolithographic seal and support structure for semiconductor wafer
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Accused Products
Abstract
A support structure is applied directly to the first side of a semiconductor work piece or wafer by a stereolithographic process layer by layer completely about and extending inwardly of the periphery of the wafer, but external to the selected area within which a desired circuitry pattern is placed, the support structure being of a desired height and of a material resistive to an acid etch process effective to seal the circuitry pattern in the selected area from acid when the work piece is subjected to an acid etch on the opposing second side and about the periphery. The support structure further strengthens the work piece against flexural failure.
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Citations
29 Claims
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1-15. -15. (canceled)
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16. A method of forming a semiconductor work piece having a substrate with a surface on a first side and an opposing second side, the first side having a desired circuitry pattern on the surface within a selected area, the substrate having a periphery within which is the selected area, comprising the steps of:
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a. forming layer by layer a fixture to support a semiconductor work piece on an opposing second side to a first side having a desired circuitry pattern, the fixture having supporting structure on which the opposing second side sets and a plurality of abutting structures to engage the periphery of the work piece, at least one of the abutting structures designed to engage the periphery of the work piece in a mating and aligning relationship;
b. placing the work piece having a desired thickness on the fixture in alignment with the supporting structures so the periphery engages the supporting structure;
c. forming layer by layer a continuous sealing and support rim about the periphery of the work piece on the first side of the work piece effective to resist flexure, the rim extending a distance above the surface of the first side and being formed from an acid resistant material;
d. acid etching the work piece by exposing the fixture and the aligned work piece with the sealing rim to at least one acid mixture on the opposing second side to reduce the thickness of the work piece; and
e. removing the work piece from the at least one acid mixture. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification