Die package, conductive element, semiconductor device including same, microlens, system including same, and methods of manufacture
First Claim
1. A method of packaging a plurality of semiconductor dice, comprising:
- providing a plurality of semiconductor dice, each including an active surface and bond pads thereon, a backside generally opposite thereto, and an exterior periphery;
affixing the backside of each of the plurality of semiconductor dice to a carrier;
disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice;
at least partially curing, substantially as a whole, the flowable, uncured dielectric material; and
singulating each of the plurality of the semiconductor dice through the cured dielectric material.
8 Assignments
0 Petitions
Accused Products
Abstract
A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Method of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.
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Citations
63 Claims
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1. A method of packaging a plurality of semiconductor dice, comprising:
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providing a plurality of semiconductor dice, each including an active surface and bond pads thereon, a backside generally opposite thereto, and an exterior periphery;
affixing the backside of each of the plurality of semiconductor dice to a carrier;
disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice;
at least partially curing, substantially as a whole, the flowable, uncured dielectric material; and
singulating each of the plurality of the semiconductor dice through the cured dielectric material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. A method of forming a conductive element onto a substrate, comprising:
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forming an organometallic layer onto at least a portion of a surface of a substrate;
heating, at most, a portion of the organometallic layer; and
removing an unheated portion of the organometallic layer. - View Dependent Claims (18, 19, 20, 21, 22, 23, 24)
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25. A method of forming a conductive via, comprising:
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forming a hole at least partially through a thickness of a substrate;
depositing an organometallic material within at least a portion of the hole;
selectively heating at least a portion of the organometallic material. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35)
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36. A method of forming a conductive element onto a substrate, the method comprising:
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depositing a flowable, uncured conductive material onto a surface of a substrate;
selectively curing the flowable, uncured conductive material over at least a portion of the surface thereof;
removing a portion of the cured conductive material. - View Dependent Claims (37, 38, 39, 40, 41, 42)
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43. A method of fabrication of a microlens for use in an imaging device, comprising:
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disposing a flowable, uncured optically transmissive material in at least one layer onto a surface of a substrate;
selectively curing at least a portion of the flowable, uncured optically transmissive material;
removing the flowable, uncured optically transmissive material from the surface of the substrate. - View Dependent Claims (44, 45, 46, 47, 48, 49, 50, 51, 52, 53, 54, 55, 56, 57)
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58. A microlens for directing radiation toward a sensor of an imaging device, comprising:
a plurality of mutually adhered layers of cured optically transmissive material. - View Dependent Claims (59, 60)
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61. A system, comprising:
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at least one microprocessor;
a substrate including an array of microlenses formed thereon in electrical communication with the at least one microprocessor;
wherein the array of microlenses includes at least one microlens comprising a plurality of mutually adhered layers of cured optically transmissive material. - View Dependent Claims (62, 63)
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Specification