Printing process and solder mask ink composition

• US 20060047014A1
• Filed: 08/22/2003
• Published: 03/02/2006
• Est. Priority Date: 09/20/2002
• Status: Abandoned Application

• Current Assignee: FUJIFILM Imaging Colorants Limited (Fujifilm Holdings Corporation)
• Original Assignee: FUJIFILM Imaging Colorants Limited (Fujifilm Holdings Corporation)
• Inventors: Hopper, Alan John, Robert, James Mark
• Application Number:
  US10/528,583
• Publication Number:
  US 20060047014A1
• Time in Patent Office: Days
• US Class Current: 523/160
• CPC Class Codes: C09D 11/36 based on non-aqueous solvents
• CPC Class Codes: H05K 3/287 Photosensitive compositions

Abstract

A process for making an electronic device which comprises applying a non-aqueous solder mask ink which is substantially free from organic solvent to a dielectric substrate containing electrically conductive metal circuitry, exposing the solder mask ink to actinic radiation and/or particle beam radiation optionally followed by thermal treatment, whereby the solder mask ink is applied to selected areas of the substrate under the control of a computer by ink jet printing and wherein the solder mask ink comprises the components: A) 30-90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising from 5-95% by weight of one or more monofunctional monomers; B) 0.1-30 parts metal adhesion promoting organic compound; C) 0-30 parts initiator, D) 0-10 parts polymer and/or prepolymer; E) 0-5 parts colorant; E) 0-5 parts surfactant; and Wherein all parts are by weight.

Claims

1. A process for making an electronic device which comprises applying a non-aqueous solder mask ink which is substantially free from organic solvent to a dielectric substrate containing electrically conductive metal circuitry, exposing the solder mask ink to actinic radiation and/or particle beam radiation optionally followed by thermal treatment, whereby the solder mask ink is applied to selected areas of the substrate under the control of a computer by ink jet printing and wherein the solder mask ink comprises the components:

A) 30-90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising from 5-95% by weight of one or more monofunctional monomers;

B) 0.1-30 parts metal adhesion promoting organic compound;

C) 0-30 parts initiator;

D) 0-10 parts polymer and/or prepolymer;

E) 0-5 parts colorant;

F) 0-5 parts surfactant; and

wherein all parts are by weight;

2. A process as claimed in claim 1 wherein the viscosity of the solder mask ink is from 8 to 20 cPs (mPa.s) at 40°

C.

3. A process as claimed in claim 1 wherein the weight average molecular weight of the acrylate functional monomer is not greater than 2,000.

4. A process as claimed in claim 1 wherein the acrylate functional monomer is isobornyl acrylate, tripropylene glycol diacrylate or trimethylolpropane ethoxylate triacrylate.

5. A process as claimed in claim 1 wherein the amount of mono-functional acrylate monomer is 70-95% by weight of the acrylate-functional monomer (component A)).

6. A process as claimed in claim 1 wherein the adhesion promoter is an acrylate functional monomer.

7. A process as claimed in claim 1 wherein the adhesion promoter contains a metal chelant group which is a carboxylic acid.

8. A process as claimed in claim 7 wherein the adhesion promoter is (meth)acrylic acid.

9. A process as claimed in claim 1 wherein the adhesion promoter is a polypropylene glycol tetra acrylate containing (meth)acrylic acid.

10. A process as claimed in claim 9 wherein the adhesion promoter has an acid value of not greater than 120 mg KOH/g.

11. A process as claimed in claim 1 wherein the amount of adhesion promoter is not greater than 15 parts by weight.

15. A process as claimed in claim 1 wherein the electronic device is a printed circuit board.

16. A process as claimed in claim 1 wherein the solder mask ink has an acid value of not greater than 30 mg KOH/g.

18. A process as claimed in claim 1 wherein the amount of initiator is not less than 5 parts.

24. A process as claimed in claim 1 wherein the number of parts of components A)+B)+C)+D)+E)+F)=100.

30. An electronic device obtained by a process according to claim 1.

12-14. -14. (canceled)

17. (canceled)

19-23. -23. (canceled)

25. A non-aqueous solder mask ink which is substantially free from organic solvents which comprises the components:

A) 30 to 90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising from 5-95% by weight of one or more monofunctional monomers;

B) 0.1 to 30 parts metal adhesion promoting compound;

C) 5 to 30 parts initiator;

D) 0 to 10 parts polymer and/or prepolymer;

E) 0 to 5 parts colorant;

F) 0 to 5 parts surfactant; and

wherein the ink has a viscosity of not greater than 30 cPs (mPa.s) at 40°

C. and all parts are by weight.

28. An ink as claimed in claims 25, 26 or 27 wherein the number of parts of components A)+B)+C)+D)+E)+F)=100.

26. A non-aqueous solder mask ink which is substantially free from organic solvents which comprises the components:

A) 30 to 90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising from 5-95% by weight of one or more monofunctional monomers;

B) 0.1 to 30 parts metal adhesion promoting organic compound containing one or more carboxylic acid groups and having an acid value of not greater than 120 mg KOH/gm;

C) 5 to 30 parts initiator;

D) 0 to 10 parts polymer and/or prepolymer;

E) 0 to 5 parts colorant; and

F) 0 to 5 parts surfactant;

wherein the ink has a viscosity of not greater than 30 cPs (mPa.s) at 40°

C. and all parts are by weight.

27. A non-aqueous solder mask ink which is substantially free from organic solvents which comprises the components:

A) 30 to 90 parts acrylate functional monomers which are mono or higher acrylate functional monomers comprising 5-95% by weight of one or more mono-functional monomers;

B) 0.1 to 30 parts metal adhesion promoting organic compound containing one or more carboxylic acid groups;

C) 5 to 30 parts initiator;

D) 0 to 10 parts polymer and/or prepolymer;

E) 0 to 5 parts colorant;

F) 0 to 5 parts surfactant; and

wherein the acid value of the total solder mask ink is not greater than 30 mg KOH/g and all parts are by weight.

29. A cartridge for an ink jet printer comprising a chamber and an ink wherein the ink is present in the chamber and the ink is a solder mask ink as claimed in claim 27.