Method for manufacturing a silicon structure
First Claim
1. A method of forming a single crystal silicon structure comprising:
- preparing a single crystal silicon surface that is substantially free of silicon oxide;
heating the silicon surface to a first temperature of no more than about 350°
C. under a first ambient and within a first pressure range;
further heating the silicon surface from the first temperature to a first silicon deposition temperature between about 350°
C. and about 530°
C. under a second ambient, the second ambient being maintained within a second pressure range, the second ambient including a silicon source gas and a non-oxidizing carrier gas; and
maintaining the silicon surface at the first silicon deposition temperature under the second ambient for a deposition period sufficient to form a first epitaxial single crystal silicon region having a first thickness on the silicon surface.
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Accused Products
Abstract
Provided are improved methods for forming silicon films, particularly single-crystal silicon films from amorphous silicon films in which a single-crystal silicon substrate is prepared by removing any native oxide, typically using an aqueous HF solution, and placed in a reaction chamber. The substrate is then heated from about 350° C. to a first deposition temperature under a first ambient to induce single-crystal epitaxial silicon deposition primarily on exposed silicon surfaces. The substrate is then heated to a second deposition temperature under a second ambient that will maintain the single-crystal epitaxial silicon deposition on exposed single-crystal silicon while inducing amorphous epitaxial silicon deposition on insulating surfaces. The amorphous epitaxial silicon can then be converted to single-crystal silicon using a solid phase epitaxy process to form a thin, high quality silicon layer. The first and second ambients include at least one silicon source gas and may include a non-oxidizing carrier gas.
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Citations
20 Claims
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1. A method of forming a single crystal silicon structure comprising:
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preparing a single crystal silicon surface that is substantially free of silicon oxide;
heating the silicon surface to a first temperature of no more than about 350°
C. under a first ambient and within a first pressure range;
further heating the silicon surface from the first temperature to a first silicon deposition temperature between about 350°
C. and about 530°
C. under a second ambient, the second ambient being maintained within a second pressure range, the second ambient including a silicon source gas and a non-oxidizing carrier gas; and
maintaining the silicon surface at the first silicon deposition temperature under the second ambient for a deposition period sufficient to form a first epitaxial single crystal silicon region having a first thickness on the silicon surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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9. A method of forming a single crystal silicon structure comprising:
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preparing a single crystal silicon surface that is substantially free of silicon oxide and an insulator surface adjacent the silicon surface;
heating the silicon surface and the insulator surface to a first temperature of no more than about 350°
C. under a first ambient maintained within a first pressure range;
further heating the silicon surface from the first temperature to a first silicon deposition temperature between about 350°
C. and about 530°
C. under a second ambient, the second ambient being maintained within a second pressure range, the second ambient including a silicon source gas and a non-oxidizing carrier gas; and
maintaining the silicon surface at the first silicon deposition temperature under the second ambient for a deposition period sufficient to form a first epitaxial single crystal silicon region having a first thickness on the silicon surface;
further heating the silicon surface from the first silicon deposition temperature to a second silicon deposition temperature of at least about 530°
C. under a third ambient, the third ambient being maintained within a third pressure range, the third ambient including a silicon source gas and a non-oxidizing carrier gas;
maintaining the silicon surface and insulator surface at the second silicon deposition temperature under the third ambient for a deposition period sufficient to form, in a substantially simultaneous manner, a second epitaxial single crystal silicon region having a second thickness on the first epitaxial single crystal silicon region and a substantially amorphous silicon layer having a third thickness on the insulator surface; and
further heating the amorphous silicon layer to an annealing temperature sufficient to induce solid phase epitaxy and convert substantially the entire amorphous silicon layer to single crystal silicon and thereby form a single crystal silicon layer. - View Dependent Claims (10, 11)
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12. A method of forming a single crystal silicon structure comprising:
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preparing a single crystal silicon surface;
depositing a layer of an insulating material on the silicon surface;
forming an opening through the insulating material to expose a portion of the single crystal silicon surface, the exposed portion being substantially free of silicon oxide;
performing a selective epitaxial process to fill the opening with a single crystal silicon plug, the silicon plug having an upper surface substantially free of silicon oxide and generally adjacent a top surface of the insulating material;
heating the silicon plug to a first silicon deposition temperature between about 350°
C. and about 530°
C. under a first ambient, the first ambient being maintained within a first pressure range, the first ambient including a silicon source gas and a non-oxidizing carrier gas;
maintaining the silicon plug at the first silicon deposition temperature under the first ambient for a deposition period sufficient to form a first epitaxial single crystal silicon region having a first thickness on the upper surface of the silicon plug;
further heating the silicon plug to a second silicon deposition temperature of at least about 530°
C. under a second ambient, the second ambient being maintained within a second pressure range, the second ambient including a silicon source gas and a non-oxidizing carrier gas;
maintaining the silicon surface and insulator surface at the second silicon deposition temperature under the second ambient for a deposition period sufficient to form, in a substantially simultaneous manner, a second epitaxial single crystal silicon region having a second thickness on the first epitaxial single crystal silicon region and a substantially amorphous silicon layer having a third thickness on the insulator surface; and
further heating the amorphous silicon layer to an annealing temperature sufficient to induce solid phase epitaxy and convert substantially the entire amorphous silicon layer to single crystal silicon and form a single crystal silicon layer. - View Dependent Claims (13, 14)
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15. A method of forming a multi-layer single crystal silicon structure comprising:
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repeatedly preparing a single crystal silicon surface;
depositing a layer of an insulating material on the prepared single crystal silicon surface;
forming an opening through the insulating material to expose a portion of the prepared single crystal silicon surface, the exposed portion being substantially free of silicon oxide;
performing a selective epitaxial process to fill the first opening with a single crystal silicon plug, the single crystal silicon plug having an upper surface generally adjacent a top surface of the insulating material;
heating the single crystal silicon plug to a first silicon deposition temperature between about 350°
C. and about 530°
C. under an ambient maintained within a first pressure range and including a silicon source gas and a non-oxidizing carrier gas; and
maintaining the single crystal silicon plug at the first silicon deposition temperature under the first ambient for a deposition period sufficient to form a first epitaxial single crystal silicon region on the upper surface of the first silicon plug;
further heating the single crystal silicon plug to a second silicon deposition temperature of at least about 530°
C. under a second ambient maintained within a second pressure range and including a silicon source gas and a non-oxidizing carrier gas;
maintaining the single crystal silicon plug and the insulator surface at the second silicon deposition temperature under the second ambient for a deposition period sufficient to form, in a substantially simultaneous manner, a second epitaxial single crystal silicon region on the first epitaxial single crystal silicon region and a substantially amorphous silicon layer on the first insulator surface; and
further heating the substantially amorphous silicon layer to an annealing temperature sufficient to induce solid phase epitaxy and convert substantially the entire amorphous silicon layer to single crystal silicon and thereby form a single crystal silicon layer, the single crystal silicon layer being suitable for serving as a next single crystal silicon surface;
to thereby form a multi-layer single crystal silicon structure. - View Dependent Claims (16, 17, 18)
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19. A method of forming a single crystal silicon structure comprising:
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preparing a first single crystal silicon surface;
depositing a layer of a first insulating material on the first silicon surface;
forming a first opening through the first insulating material to expose a portion of the first single crystal silicon surface, the exposed portion being substantially free of silicon oxide;
heating the exposed portion of the first silicon surface to a first silicon deposition temperature between about 350°
C. and about 530°
C. under a first ambient, the first ambient being maintained within a first pressure range and including a silicon source gas and a non-oxidizing carrier gas; and
maintaining the first silicon surface at the first silicon deposition temperature under the first ambient for a deposition period sufficient to form a first epitaxial single crystal silicon region having a first thickness on the exposed portion of the first silicon surface;
further heating the first silicon surface and the first insulating material to a second silicon deposition temperature of at least about 500°
C. under a second ambient, the second ambient being maintained within a second pressure range, the second ambient including a silicon source gas and a non-oxidizing carrier gas; and
maintaining the first silicon surface and the first insulating material at the second silicon deposition temperature under the second ambient for a deposition period sufficient to form, in a substantially simultaneous manner, a second epitaxial single crystal silicon region having a second thickness on the first epitaxial single crystal silicon region and a first substantially polycrystalline silicon layer having a third thickness on the first insulating material whereby the opening is substantially filled with polycrystalline silicon. - View Dependent Claims (20)
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Specification