Construction for DC to AC power inverter
1 Assignment
0 Petitions
Accused Products
Abstract
A construction for DC to AC power inverter includes a circuit board and at least a conductive member. The soldered surface of the circuit board where larger amount of current passes through is inserted with the conductive member. The conductive member provides a contour can be changed in accordance with the shape of the circuit board and the periphery thereof is joined with several inserting pins so that the conductive member can be inversely hooked to the circuit board. Further, the conductive member can adhesively attached to the circuit board tightly by way of operation of tin soldering with the tin furnace. Hence, the conductive member can facially contact with the circuit board to enhance capability of the copper foil on the circuit board to endure the current with lower fabricating cost and promoted utilization efficiency. Besides, obstruction of other electronic parts can be avoided so as to facilitate fabrication process and strengthen market competitive power.
10 Citations
16 Claims
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1-5. -5. (canceled)
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6. A circuit board assembly for a DC to AC power inverter comprising:
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a circuit board having a soldered surface and an opposed component surface for a plurality of electronic parts mounting thereon, wherein a copper foil is provided on said soldered surface of said circuit board for electrically connecting with said electronic parts, wherein said circuit board further has a plurality of fitting holes formed on said circuit board to communicate said soldered surface of said circuit board to said component surface thereof, wherein said fitting holes are located in vicinity of a predetermined high-current area of said circuit board for a relatively larger current passing through said copper foil; and
at least a conductive member comprising a plurality of inserting pins spacedly extending along a periphery of said conductive member, wherein said inserting pins are slidaby inserted into said fitting holes respectively to securely overlap said conductive member on said soldered surface of said circuit board at said high-current area such that said conductive member allow said relatively larger current passing though at said high-current area of said copper foil of said circuit board so as to enhance an endurance of said high-current area of said copper foil of said circuit board. - View Dependent Claims (7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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13-1. The circuit board assembly, as recited in claim 8, wherein said conductive member is made of copper.
Specification