Physical quantity sensor

• US 20060049497A1
• Filed: 08/23/2005
• Published: 03/09/2006
• Est. Priority Date: 09/08/2004
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ohta, Tameharu
• Granted Patent: US 7,468,552 B2
• Time in Patent Office: Days
• US Class Current: 257/678
• CPC Class Codes: B81B 2201/0242 Gyroscopes
• CPC Class Codes: B81B 7/0058 for protecting against damages due to external chemical or mechanical influences, e.g. shocks or vibrations
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: G01P 1/023 for acceleration measuring devices
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

A physical quantity sensor includes a package, a circuit chip disposed and held in the package, a sensor chip stacked and fixed on the circuit chip, and a wiring member having flexibility, through which the circuit chip and the package are electrically and mechanically bonded together. In the physical quantity sensor, unwanted external vibrations transmitted to the sensor chip are reduced without an external vibration dumping system such as a rubber pad, because the wiring member weakens the vibrations.

Claims

1. A physical quantity sensor comprising:

a package;

a circuit chip disposed in the package;

a sensor chip stacked on the circuit chip; and

a wiring member having flexibility, through which the circuit chip and the package are electrically and mechanically bonded together, wherein

the wiring member is in tape form.

2. The sensor according to claim 1, wherein

the wiring member is disposed to enclose the circuit chip,

the wiring member has an overhanging portion which projects from an inner edge of the wiring member toward the circuit chip, and

the wiring member and the circuit chip are bonded together at the overhanging portion.

3. The sensor according to claim 2, wherein

the overhanging portion of the wiring member has a slit.

4. The sensor according to claim 2, wherein

the wiring member includes a flexible tape and a lead bonded on the flexible tape,

the flexible tape has the overhanging portion, and

the circuit chip and the package are mechanically bonded together through the overhanging portion and electrically bonded together through the lead.

5. The sensor according to claim 2, wherein

the overhanging portion includes a rectangular body and a pair of beams, and

the rectangular body is connected to the inner edge of the wiring member through the beams.

6. The sensor according to claim 4, wherein

the package has a hollow and a stage defining the hollow,

the circuit chip is disposed in the hollow, and

the wiring member is disposed on the stage.