Electronic device and method of manufacturing the same

• US 20060049527A1
• Filed: 08/09/2005
• Published: 03/09/2006
• Est. Priority Date: 09/09/2004
• Status: Abandoned Application

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Hashimoto, Nobuaki
• Application Number:
  US11/200,302
• Publication Number:
  US 20060049527A1
• Time in Patent Office: Days
• US Class Current: 257/773
• CPC Class Codes: H01L 2224/24051 Conformal with the semiconductor or solid-state device
• CPC Class Codes: H01L 2224/24225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/24226 the HDI interconnect connecting to the same level of the item at which the semiconductor or solid-state body is mounted, e.g. the item being planar
• CPC Class Codes: H01L 2224/24998 Reinforcing structures, e.g. ramp-like support
• CPC Class Codes: H01L 2224/2612 Auxiliary members for layer connectors, e.g. spacers
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/73267 Layer and HDI connectors
• CPC Class Codes: H01L 2224/76155 Jetting means, e.g. ink jet
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/82007 involving a permanent auxiliary member being left in the finished device, e.g. aids for holding or protecting a build-up interconnect during or after the bonding process
• CPC Class Codes: H01L 2224/82102 using jetting, e.g. ink jet
• CPC Class Codes: H01L 2224/92244 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 23/13 characterised by the shape
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/49833 the chip support structure consisting of a plurality of insulating substrates
• CPC Class Codes: H01L 23/5389 the chips being integrally enclosed by the interconnect and support structures
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/25 of a plurality of high density interconnect connectors
• CPC Class Codes: H01L 24/32 of an individual layer connector
• CPC Class Codes: H01L 24/82 : by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI] interconnection structure between a plurality of semiconductor chips H01L23/5389
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01024 : Chromium [Cr]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/0132 : Binary Alloys
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor

Abstract

An electronic device including a substrate provided with a first wiring formed thereon; and a pedestal provided above the substrate and provided with a second wiring formed thereon, wherein the second wiring is connected to the first wiring on the substrate.

Claims

1. An electronic device comprising:

a substrate provided with a first wiring formed thereon; and

a pedestal provided above the substrate and provided with a second wiring formed thereon,

wherein the second wiring is connected to the first wiring on the substrate.

2. The electronic device according to claim 1, wherein at least a part of an end face of the pedestal forms an incline at an angle with an upper surface of the substrate.

3. The electronic device according to claim 2, wherein the angle formed by the incline with the upper surface of the substrate is an acute angle.

4. The electronic device according to claim 1, wherein an additional component connected to the second wiring is mounted on the pedestal.

5. The electronic device according to claim 4, wherein the second wiring is connected to an upper surface of the additional component.

6. The electronic device according to claim 4, wherein the additional component is an IC chip.

7. The electronic device according to claim 1, wherein the pedestal includes a plurality of sub-pedestals stacked one another.

8. An electronic device comprising:

a substrate provided with a first wiring formed thereon; and

an additional component provided above the substrate and provided with a second wiring formed on an upper surface thereof,

wherein the second wiring is connected to the first wiring on the substrate.

9. The electronic device according to claim 8, wherein the additional component is an IC chip.

10. A method of manufacturing an electronic device, comprising:

forming a first wiring and a pedestal on a substrate; and

forming a second wiring above the substrate so as to be connected to the first wiring on the substrate and is laid down onto the pedestal.

11. The method of manufacturing an electronic device according to claim 10, wherein at least a part of an end face of the pedestal forms an incline at an angle with an upper surface of the substrate.

12. The method of manufacturing an electronic device according to claim 11, wherein the angle formed by the incline with the upper surface of the substrate is an acute angle.

13. The method of manufacturing an electronic device according to claim 10, wherein an additional component connected to the second wiring is mounted on the pedestal.

14. The method of manufacturing an electronic device according to claim 13, further comprising:

mounting the additional component on the pedestal,

wherein, in the step of forming the second wiring, the second wiring is connected to an upper surface of the additional component.

15. The method of manufacturing an electronic device according to claim 13, wherein the additional component is an IC chip.

16. The method of manufacturing an electronic device according to claim 15, further comprising:

providing an insulating section to at least a part of a side of the IC chip, an end face of the insulating section forming an incline at an angle with an upper surface of the pedestal.

17. The method of manufacturing an electronic device according to claim 16, wherein the angle formed by the incline with the upper surface of the pedestal is an acute angle.