Integrated antenna type circuit apparatus
First Claim
1. An integrated antenna type circuit apparatus comprising:
- a signal processing circuit unit formed by laminating an insulator layer and a wiring conductor layer, and embedding a circuit device into the insulator layer; and
an antenna conductor formed on the wiring conductor layer of the signal processing circuit unit, wherein the signal processing circuit unit has a ground conductor formed on a wiring conductor layer lying between the antenna conductor and the circuit device, the ground conductor overlapping with the antenna conductor.
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Accused Products
Abstract
An integrated antenna type circuit apparatus which provides excellent circuit characteristics while suppressing an increase in packaging area. The integrated antenna type circuit apparatus includes an insulating base, a semiconductor circuit device, chip parts, a molding resin, an antenna conductor, a ground conductor, and external lead electrodes. The plurality of chip parts are mounted on the insulating base, and are soldered to electrodes of wiring conductors on the top of the insulating base for electric and physical connection. The insulating base has a multilayer structure, being formed by laminating a plurality of insulator layers. The antenna conductor is formed on the bottom of the insulating base. A wiring conductor adjacent to the antenna conductor is provided with the ground conductor so that it overlaps with the antenna conductor.
148 Citations
15 Claims
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1. An integrated antenna type circuit apparatus comprising:
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a signal processing circuit unit formed by laminating an insulator layer and a wiring conductor layer, and embedding a circuit device into the insulator layer; and
an antenna conductor formed on the wiring conductor layer of the signal processing circuit unit, wherein the signal processing circuit unit has a ground conductor formed on a wiring conductor layer lying between the antenna conductor and the circuit device, the ground conductor overlapping with the antenna conductor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A semiconductor integrated circuit apparatus comprising:
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an insulating resin film;
a first circuit device embedded in the insulating resin film;
a flat-shaped wiring layer of fixed potential, being formed on the insulating resin film above the first circuit device; and
a second circuit device formed on the wiring layer. - View Dependent Claims (14)
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11. A semiconductor integrated circuit apparatus comprising:
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an insulating resin film;
a first circuit device embedded in the insulating resin film;
a first wiring layer having one end connected to the first circuit device and the other end extended to reach a top of the insulating resin film;
a second circuit device formed on the insulating resin film above the first circuit device; and
a second wiring layer of fixed potential, being formed around the second circuit device. - View Dependent Claims (12, 13, 15)
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Specification