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Fingerprint recognition module having a thin-film structure and comprising resistive temperature-sensitive elements

  • US 20060050935A1
  • Filed: 05/15/2003
  • Published: 03/09/2006
  • Est. Priority Date: 05/17/2002
  • Status: Active Grant
First Claim
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1. A fingerprint recognition module, characterized by a substrate, a composite of structured thin films of the surface of the substrate, that forms a measuring field on a portion of the substrate for measuring a fingerprint, including resistive, temperature-sensitive elements arranged in rows and columns, and that contains thin-film structures for heating the resistive, temperature-sensitive elements, and that contains strip conductors, connecting the resistive, temperature-dependent elements with a connection field located on the substrate outside of the measuring field, a microelectronic analyzing switching circuit, electrically connected with the connection field and contains the switching circuit with which the thin-film structures for heating the resistive, temperature-sensitive elements are controlled, the resistive, the temperature-sensitive elements are read out, and data are relayed.

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