Wide area lightning diverter overlay

• US 20060051592A1
• Filed: 09/19/2005
• Published: 03/09/2006
• Est. Priority Date: 09/30/2003
• Status: Active Grant

• Current Assignee: The Boeing Co.
• Original Assignee: The Boeing Co.
• Inventors: Rawlings, Diane C., Keough, Bruce K.
• Granted Patent: US 7,867,621 B2
• Time in Patent Office: Days
• US Class Current: 428/423.100
• CPC Class Codes: B29C 59/14 by plasma treatment plasma tubes per se H01J
• CPC Class Codes: B32B 15/08 of synthetic resin
• CPC Class Codes: B64C 1/12 Construction or attachment of skin panels
• CPC Class Codes: B64C 3/26 Construction, shape, or attachment of separate skins, e.g. panels
• CPC Class Codes: B64D 45/02 Lightning protectors; Static dischargers in general H01T
• CPC Class Codes: Y10T 428/24802 Discontinuous or differential coating, impregnation or bond [e.g., artwork, printing, retouched photograph, etc.]
• CPC Class Codes: Y10T 428/31551 Of polyamidoester [polyurethane, polyisocyanate, polycarbamate, etc.]
• CPC Class Codes: Y10T 428/31609 Particulate metal or metal compound-containing
• CPC Class Codes: Y10T 428/31678 Of metal
• CPC Class Codes: Y10T 428/31681 Next to polyester, polyamide or polyimide [e.g., alkyd, glue, or nylon, etc.]

Abstract

An overlay of patterned metal foil above a substrate to be protected supports development of localized coronas after a lightning strike. The localized coronas transport energy of a lightning strike above the substrate'"'"'s surface with limited removal of metal foil from the lightning strike attachment point. A first polymer film underlies patterned metal foil. A topcoat overlies the patterned metal foil. An adhesive, underlying the first polymer film affixes the lightning diverter overlay to the substrate. If desired, semiconductor particulates may be dispersed throughout the second polymer film to contribute to instantaneous generation of localized coronas. Also, an ink layer may be provided between the patterned metal foil and the topcoat or on the exterior, if desired, for aesthetic and/or anti-static purposes.

Claims

1. An overlay comprising:

a patterned metal foil; and

a polymer film underlying the patterned metal foil.

2. The overlay of claim 1, wherein the patterned metal foil includes a plurality of sections of the metal foil having a first non-zero thickness and that are separated from each other by areas having a second thickness that is less than the first thickness.

3. The overlay of claim 2, wherein the second thickness is greater than zero.

4. The overlay of claim 2, wherein the second thickness is zero.

5. The overlay of claim 1, wherein the patterned metal foil includes a plurality of areas of the metal foil having a non-zero thickness and that define a plurality of voids therebetween.

6. The overlay of claim 1, further comprising a topcoat overlying the patterned metal foil.

7. The overlay of claim 6, wherein the topcoat includes semiconductor particulates dispersed therein.

8. The overlay of claim 1, further comprising an adhesive underlying the polymer film.

9. An overlay comprising:

a patterned metal foil including a plurality of sections of the metal foil having a first non-zero thickness and that are separated from each other by areas having a second thickness that is less than the first thickness;

a polymer film underlying the patterned metal foil; and

a topcoat overlying the patterned metal foil.

10. The overlay of claim 9, wherein the second thickness is greater than zero.

11. The overlay of claim 9, wherein the second thickness is zero.

12. The overlay of claim 9, wherein the topcoat includes semiconductor particulates dispersed therein.

13. The overlay of claim 9, further comprising an adhesive underlying the polymer film.

14. An overlay comprising:

a patterned metal foil including a plurality of areas of the metal foil having a non-zero thickness and that define a plurality of voids therebetween;

a polymer film underlying the patterned metal foil; and

a topcoat overlying the patterned metal foil.

15. The overlay of claim 14, wherein the topcoat includes semiconductor particulates dispersed therein.

16. The overlay of claim 14, further comprising an adhesive underlying the polymer film.

17. A method of forming an overlay for a substrate, the method comprising:

providing a metal foil;

patterning the metal foil; and

providing a first polymer film underlying the metal foil.

18. The method of claim 17, further comprising providing a topcoat overlying the metal foil.

19. The method of claim 18, wherein providing a topcoat includes dispersing semiconductor particulates therein.

20. The method of claim 17, wherein patterning the metal foil includes patterning a plurality of sections of the metal foil having a first non-zero thickness and that are separated from each other by areas having a second thickness that is less than the first thickness.

21. The method of claim 17, wherein patterning the metal foil includes patterning a plurality of areas of the metal foil having a non-zero thickness and that define a plurality of voids therebetween.

22. The method of claim 17, wherein patterning the metal foil is performed by one of laser scribing, electroforming, electroless and electroplating, etching, chemical-mechanical-polishing, and lithography.