Manufacturing method and joining device for solid-state imaging devices

• US 20060051887A1
• Filed: 09/06/2005
• Published: 03/09/2006
• Est. Priority Date: 09/06/2004
• Status: Abandoned Application

• Current Assignee: Fujifilm Corporation (Fujifilm Holdings Corporation)
• Original Assignee: Fuji Photo Film Co Limited (Fujifilm Holdings Corporation)
• Inventors: Yamamoto, Kiyofumi, Okutsu, Kazuo, Takasaki, Kousuke
• Application Number:
  US11/218,553
• Publication Number:
  US 20060051887A1
• Time in Patent Office: Days
• US Class Current: 438/64
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/16235 Connecting to a semiconductor or solid-state bodies, i.e. cap-to-chip

Abstract

The present invention provides a method of manufacturing solid-state imaging devices comprising the steps of: forming a large number of solid-state image sensing devices over a wafer; forming, in positions matching said solid-state image sensing devices on the under face of a transparent flat plate to be joined to said wafer, frame-shaped spacers of a prescribed thickness each in a shape of surrounding an individual solid imaging element; aligning said wafer and said transparent flat plate opposite each other; supporting with a fixed table substantially the whole of one of the under face of said wafer and the upper face of said transparent flat plate, supporting substantially the other face with a pressing member via an elastic member, and thereby joining said wafer and said transparent flat plate via said spacers by the pressing member; and splitting said wafer and said transparent flat plate individual solid-state image sensing devices.

Claims

1. A method of manufacturing solid-state imaging devices comprising the steps of:

forming a large number of solid-state image sensing devices over the upper face of a wafer;

forming, in positions matching said solid-state image sensing devices on the under face of a transparent flat plate to be joined to said wafer, frame-shaped spacers of a prescribed thickness each in a shape of surrounding an individual solid imaging element;

aligning said wafer and said transparent flat plate opposite each other;

supporting with a fixed table substantially the whole of one of the under face of said wafer and the upper face of said transparent flat plate that have been aligned, supporting substantially the whole of the other face with a pressing member via an elastic member, and thereby joining said wafer and said transparent flat plate via said spacers by applying a pressure with the pressing member; and

splitting said wafer and said transparent flat plate that have been joined into individual solid-state image sensing devices.

2. The method of manufacturing solid-state imaging devices according to claim 1, wherein the ASKER C hardness of said elastic member is 20 to 40.

3. The method of manufacturing solid-state imaging devices according to claim 1, wherein a pressing force by a fluid pressure is applied from the rear face of said pressing member.

4. The method of manufacturing solid-state imaging devices according to claim 2, wherein a pressing force by a fluid pressure is applied from the rear face of said pressing member.

5. The method of manufacturing solid-state imaging devices according to claim 1, wherein said pressing member is engaged with a pressure vessel on the rear side of the pressing member via a sealing member disposed on the peripheral edge of the pressing member, pressure fluid is fed between the pressure vessel and said pressing member;

and

at said joining step, said pressing member can incline pivoting on substantially the center point of said other one of the under face of said wafer and the upper face of said transparent flat plate.

6. The method of manufacturing solid-state imaging devices according to claim 2, wherein said pressing member is engaged with a pressure vessel on the rear side of the pressing member via a sealing member disposed on the peripheral edge of the pressing member, pressure fluid is fed between the pressure vessel and said pressing member;

and

at said joining step, said pressing member can incline pivoting on substantially the center point of said other one of the under face of said wafer and the upper face of said transparent flat plate.

7. A joining device for joining two planar members aligned opposite each other by applying pressure, comprising:

a fixed table supporting substantially the whole of one of said planar members;

a pressing member supporting substantially the whole of the other of said planar members via an elastic member;

a pressure vessel which is disposed on the rear side of the pressing member and supports the pressing member via a sealing member disposed on the peripheral edge of the pressing member;

a pressing force supplying device which feeds pressure fluid between said pressure vessel and said pressing member and applies a pressing force to said two planar members by way of said fixed table and said pressing member; and

a pressing member supporting device which supports said pressing member to enable the member to incline pivoting on substantially the center point of the surface of the other one of said planar members.