Methods for packaging image sensitive electronic devices
First Claim
1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
- mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace; and
enclosing said first end of said at least one conductive trace, said at least one electrical interconnection and said electronic device within a shell formed entirely of a transparent material.
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Accused Products
Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections such as wire bonds and bond pads, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, chip encapsulation is accomplished with a unitary shell of entirely transparent material. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment.
19 Citations
10 Claims
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1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on said electronic device and said first end of said at least one conductive trace; and
enclosing said first end of said at least one conductive trace, said at least one electrical interconnection and said electronic device within a shell formed entirely of a transparent material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting the electronic device on a carrier substrate having at least one conductive trace thereon, the at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between a bond pad on the electronic device and the first end of the at least one conductive trace; and
adhesively attaching a shell formed entirely of a single transparent material onto the carrier substrate to enclose the first end of the at least one conductive trace, the at least one electrical interconnection and the electronic device.
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Specification