Methods for packaging image sensitive electronic devices
First Claim
1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
- mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
loading a transparent lid into a mold tooling element;
loading said carrier substrate with said electronic device and said at least one electrical interconnection into said mold tooling element so that a surface of said electronic device is aligned against said transparent lid;
filling said mold tooling element with molding compound;
forming a molded layer on said carrier substrate to encapsulate said at least one electrical interconnection and a perimeter of said electronic device; and
retaining said transparent lid with said molded layer.
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Abstract
The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the chip with a transparent lid. In another embodiment of the invention, the perimeter area of a chip, including interconnections, is encapsulated with a liquid dispensed epoxy, and a transparent lid is attached. In yet another embodiment of the invention, a unitary shell of entirely transparent material is used. In yet another embodiment of the invention, a substrate-mounted chip and a transparent lid are loaded into a transfer mold that holds them in optimal alignment. The transfer mold is then filled with molding compound to encapsulate the chip and interconnections, and to retain the transparent lid.
49 Citations
8 Claims
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1. A method for assembling a package containing an electronic device sensitive to light or other radiation comprising:
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mounting said electronic device on a carrier substrate having at least one conductive trace thereon, said at least one conductive trace having a first end and a second end;
providing at least one electrical interconnection between said electronic device and said first end of said at least one conductive trace;
loading a transparent lid into a mold tooling element;
loading said carrier substrate with said electronic device and said at least one electrical interconnection into said mold tooling element so that a surface of said electronic device is aligned against said transparent lid;
filling said mold tooling element with molding compound;
forming a molded layer on said carrier substrate to encapsulate said at least one electrical interconnection and a perimeter of said electronic device; and
retaining said transparent lid with said molded layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification