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Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology

  • US 20060051937A1
  • Filed: 08/01/2005
  • Published: 03/09/2006
  • Est. Priority Date: 07/30/2004
  • Status: Active Grant
First Claim
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1. A method for producing thin film semiconductor chips (1) comprising the steps:

  • applying an active layer sequence (20), which is suitable for generating electromagnetic radiation, on a growth substrate (3), forming a reflective electrically conductive contact material layer (40) on the active layer sequence, patterning the active layer sequence and the contact material layer (40) to form active layer stacks (21), which are separate from one another, on the growth substrate (3), applying a flexible electrically conductive foil (6) to the reflective electrically conductive contact material layer (4), and at least partially removing the growth substrate (3).

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