Method for producing semiconductor chips using thin film technology, and semiconductor chip using thin film technology
First Claim
Patent Images
1. A method for producing thin film semiconductor chips (1) comprising the steps:
- applying an active layer sequence (20), which is suitable for generating electromagnetic radiation, on a growth substrate (3), forming a reflective electrically conductive contact material layer (40) on the active layer sequence, patterning the active layer sequence and the contact material layer (40) to form active layer stacks (21), which are separate from one another, on the growth substrate (3), applying a flexible electrically conductive foil (6) to the reflective electrically conductive contact material layer (4), and at least partially removing the growth substrate (3).
3 Assignments
0 Petitions
Accused Products
Abstract
For semiconductor chips (1) using thin film technology, an active layer sequence (20) is applied to a growth substrate (3), on which a reflective electrically conductive contact material layer (40) is then formed. The active layer sequence is patterned to form active layer stacks (2), and reflective electrically conductive contact material layer (40) is patterned to be located on each active layer stack (2). Then, a flexible, electrically conductive foil (6) is applied to the contact material layers as an auxiliary carrier layer, and the growth substrate is removed.
-
Citations
28 Claims
-
1. A method for producing thin film semiconductor chips (1) comprising the steps:
-
applying an active layer sequence (20), which is suitable for generating electromagnetic radiation, on a growth substrate (3), forming a reflective electrically conductive contact material layer (40) on the active layer sequence, patterning the active layer sequence and the contact material layer (40) to form active layer stacks (21), which are separate from one another, on the growth substrate (3), applying a flexible electrically conductive foil (6) to the reflective electrically conductive contact material layer (4), and at least partially removing the growth substrate (3). - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15)
-
-
16. A thin film semiconductor chip (1) comprising:
-
an active layer stack (2) which is suitable for generating electromagnetic radiation, an electrically conductive reflective contact material layer (4) on the active layer stack (2), and a carrier layer comprising a flexible electrically conductive foil (6) on the electrically conductive reflective contact material layer (4). - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24)
-
-
25. A method for producing thin film semiconductor chips (1) comprising the steps of:
-
applying an active layer sequence (20), which is suitable for generating electromagnetic radiation, on a growth substrate (3);
forming a reflective electrically conductive contact material layer (40) on the active layer sequence;
forming composite layer stacks separated from each other on the growth substrate, each composite layer stack comprising a part of the active layer sequence and a part of the reflective electrically conductive contact material layer;
applying a flexible electrically conductive foil (6) to the reflective electrically conductive contact material layer (4); and
at least partially removing the growth substrate (3). - View Dependent Claims (26, 27, 28)
-
Specification