Self-aligned contact etch with high sensitivity to nitride shoulder

• US 20060051968A1
• Filed: 12/12/2002
• Published: 03/09/2006
• Est. Priority Date: 12/13/2001
• Status: Abandoned Application

• Current Assignee: Applied Materials Incorporated
• Original Assignee: Applied Materials Incorporated
• Inventors: Joshi, Ajey M., Stinnett, James A., Ng, Pui Man Agnes, Dadu, Usama, Regis, Jason M.
• Application Number:
  US10/498,857
• Publication Number:
  US 20060051968A1
• Time in Patent Office: Days
• US Class Current: 438/723
• CPC Class Codes: H01J 37/3266 Magnetic control means
• CPC Class Codes: H01L 21/31116 by dry-etching
• CPC Class Codes: H01L 21/76897 Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665

Abstract

A method and apparatus are provided for etching semiconductor and dielectric substrates through the use of plasmas based on mixtures of a first gas having the formula C_aF_b, and a second gas having the formula C_xH_yF_z, wherein a/b≧⅔, and wherein x/z≧½. The mixtures may be used in low or medium density plasmas sustained in a magnetically enhanced reactive ion chamber to provide a process that exhibits excellent corner layer selectivity, photo resist selectivity, under layer selectivity, and profile and bottom CD control. The percentages of the first and second gas may be varied during etching to provide a plasma that etches undoped oxide films or to provide an etch stop on such films.

Claims

1. A method for etching a substrate, comprising the steps of:

providing a substrate comprising at least one oxide layer, and

etching the oxide layer with a plasma based on a mixture of oxygen and at least a first and second gas;

wherein the first gas has the formula C_aF_b, wherein the second gas has the formula C_xH_yF_z wherein a/b≧

⅔

, wherein x/z≧

½

, and wherein a, b, x, y, and z are all greater than 0.

2. The method of claim 1, wherein x/y≧

⅓

.

3. The method of claim 1, wherein the mixture further comprises argon.

4. The method of claim 1, wherein a is 4.

5. The method of claim 1, wherein x is within the range of 1 to 3.

6. The method of claim 1, wherein the plasma has a density of less than about 1×

10¹¹/cm³.

7. The method of claim 1, wherein the plasma has a density within the range of about 1×

10⁹/cm³ to about 1×

10¹¹/cm³.

8. The method of claim 1, wherein the substrate further comprises a layer of photo resist, and wherein the plasma has a photo resist selectivity of at least 6:

1.

9. The method of claim 1, wherein the substrate further comprises a layer of photo resist, and wherein the plasma has a photo resist selectivity of at least 8:

1.

10. The method of claim 1, wherein the substrate further comprises a layer of nitride, and wherein the plasma has a nitride selectivity of at least 20:

1.

11. The method of claim 1, wherein the substrate is etched in such as way as to cause the formation of a hole in the substrate.

12. The method of claim 11, wherein the use of the mixture under the etching conditions results in the deposition of a fluoropolymer on at least one surface of the hole.

13. The method of claim 11, wherein the hole has a width in at least one direction of less than 0.25 microns.

14. The method of claim 11, wherein the hole has a width in at least one direction of less than about 0.18 microns.

15. The method of claim 11, wherein the hole has a width in at least one direction of less than about 0.14 microns.

16. The method of claim 1, wherein the second gas has the formula C₂H₂F₄.

17. The method of claim 1, wherein the second gas is a tetrafluoroethane.

18. The method of claim 17, wherein the second gas is 1,1,1,2-tetrafluoroethane.

19. The method of claim 1, wherein the first gas is C₄F₆.

20. The method of claim 19, wherein the first gas is

21. The method of claim 19, wherein the first gas is

22. The method of claim 1, wherein the mixture comprises C₄F₆, C₂H₂F₄, O₂ and Ar.

23. The method of claim 1, wherein the mixture comprises C₄F₆, CH₃F, O₂ and Ar.

24. The method of claim 1, wherein the mixture comprises C₄F₆, CH₂F₂, O₂ and Ar.

25. The method of claim 1, wherein the mixture further comprises CO.

26. The method of claim 21, wherein etching is conducted within a chamber, and wherein the ratio of the flow rate of O₂ to C₂H₂F₄ into the chamber is within the range of about 2 to about 8.

27. The method of claim 25, wherein the ratio of the flow rate of O₂ to C₂H₂F₄ is within the range of about 4 to about 6.

28. The method of claim 21, wherein etching is conducted within a chamber, and wherein the ratio of the flow rate of O₂ to C₄F₆ into the chamber is within the range of about 0.5 to about 1.0.

29. The method of claim 1, wherein the mixture is varied during the etching process from a first mixture to a second mixture, and wherein the molar ratio of the second gas to the first gas is higher in the second mixture than the first mixture.

30. The method of claim 29, wherein the substrate comprises a layer of a doped oxide disposed on a layer of an undoped oxide, wherein the first and second mixtures etch doped oxide, and wherein the second mixture etches the undoped oxide at a slower rate than the rate at which the first mixture etches the doped oxide.

31. The method of claim 1, wherein the substrate is etched in a magnetically enhanced reactive ion etcher.

32. The method of claim 31, wherein the etcher is equipped with a cathode, and wherein the cathode has a temperature within the range of about 0 to about 40°

C.

33. The method of claim 1, wherein the substrate is etched at a pressure within the range of about 40 to 80 mTorr.

34. The method of claim 1, wherein the substrate is etched in the presence of a magnetic field of less than about 50 Gauss.

35. The method of claim 1, wherein the substrate is etched in the presence of a magnetic field within the range of about 10 to about 40 Gauss.

36. A method for etching a substrate, comprising the steps of:

positioning in a chamber a structure comprising a first layer disposed on a substrate, the first layer being selected from the group consisting of dielectric layers and semiconductor layers;

supplying a reactive gas mixture to the chamber, the gas mixture comprising a first gas having the formula C_aF_b and a second gas having the formula C_xH_yF_z, wherein a/b≧

⅔ and

x/z≧

½

, and wherein a, b, x, y, and z are all greater than 0;

applying sufficient RF energy to the chamber to establish an etching plasma and an associated electric field perpendicular to the surface of the substrate;

applying a magnetic field to the chamber substantially perpendicular to the electric field and substantially parallel to the surface of the substrate; and

allowing the plasma to etch at least a portion of the first layer.

37. The method of claim 36, further comprising the steps of:

applying a masking layer to the first layer, and

forming an opening in the masking layer to expose the first layer through the opening.

38. The method of claim 36, wherein the first layer is a silicon oxide layer.

39. The method of claim 36, wherein the first layer is a silicon layer.

40. The method of claim 36, wherein the chamber is equipped with a cathode, and wherein the substrate is positioned at the cathode.

41. The method of claim 40, further comprising the step of establishing a temperature between about −

40°

C. and about 20°

C. at the cathode prior to allowing the reactive gas mixture to etch at least a portion of the first layer.

42. The method of claim 40, further comprising the step of establishing a temperature between about 0°

C. and about 20°

C. at the cathode prior to allowing the reactive gas mixture to etch at least a portion of the first layer.

43. The method of claim 36, wherein the magnetic field is a DC magnetic field.

44. The method of claim 36, wherein the magnetic field is independently controllable in direction and magnitude.

45. A method for etching a substrate, comprising the steps of:

providing a substrate selected from the group consisting of semiconductor and dielectric substrates; and

etching the substrate through a magnetically enhanced reactive ion etch process, the process including the addition of a source of hydrogen radicals to a gas mixture in an amount sufficient to increase the value of at least one parameter selected from the group consisting of etch rate and selectivity of the reactive gas mixture for the substrate;

wherein the gas mixture comprises a first gas having the formula C_aF_b and a second gas having the formula C_xH_yF_z, and wherein a/b≧

⅔ and

x/z≧

½

, and wherein a, b, x, y, and z are all greater than 0.

46. A apparatus for etching substrates, comprising:

a chamber adapted to receive a substrate to be etched; and

at least one reservoir in open communication with said chamber, said at least one reservoir adapted to supply a gas mixture to the chamber, said gas mixture comprising a first gas having the formula Cab and a second gas having the formula C_xH_yF_z, wherein a/b≧

⅔ and

x/z≧

½

, and wherein a, b, x, y, and z are all greater than 0.

47. The apparatus of claim 46, wherein said gas mixture further comprises oxygen.

48. The apparatus of claim 46, wherein the second gas has the formula C₂H₂F₄.

49. The apparatus of claim 46, wherein the second gas is a tetrafluoroethane.

50. The apparatus of claim 46, wherein the second gas is 1,1,1,2-tetrafluoroethane.

51. The apparatus of claim 46, wherein the first gas is C₄F₆.

52. The apparatus of claim 46, wherein the first gas is

53. The apparatus of claim 46, wherein the first gas is

54. The apparatus of claim 46, wherein the mixture comprises C₄F₆, C₂H₂F₄, O₂ and Ar.

55. The apparatus of claim 46, wherein the mixture comprises C₄F₆, CH₃F, O₂ and Ar.

56. The apparatus of claim 46, wherein the mixture comprises C₄F₆, CH₂F₂, O₂ and Ar.

57. The apparatus of claim 46, wherein the mixture farther comprises CO.

58. The apparatus of claim 54, wherein the ratio of the flow rate of O₂ to C₂H₂F₄ into the chamber is within the range of about 2 to about 8.

59. The apparatus of claim 54, wherein the ratio of the flow rate of O₂ to C₂H₂F₄ is within the range of about 4 to about 6.

60. The apparatus of claim 54, wherein the ratio of the flow rate of O₂ to C₄F₆ into the chamber is within the range of about 0.5 to about 1.0.

61. The apparatus of claim 46, wherein the mixture is varied during the etching process from a first mixture to a second mixture, and wherein the molar ratio of the second gas to the first gas is higher in the second mixture than the first mixture.

62. The apparatus of claim 46, wherein said at least one reservoir comprises a first, second, third, and fourth reservoir, wherein said first reservoir contains C₄F₆, wherein said second reservoir contains C₂H₂F₄, wherein said third reservoir contains O₂, and wherein said fourth reservoir contains Ar.

63. The apparatus of claim 62, wherein each of said first, second, third and fourth reservoirs is equipped with a control valve for controlling the flow rate of gas from the reservoir.

64. The apparatus of claim 46, further equipped with a device for analyzing the composition of the atmosphere within the chamber.

65. The apparatus of claim 64, wherein said at least one reservoir comprises at least a first and second reservoir, and wherein the apparatus is adapted to adjust the flow of gas from said first and second reservoirs in response to the composition of the atmosphere within the chamber.

66. The apparatus of claim 64, wherein said first reservoir contains C₄F₆, wherein said second reservoir contains C₂H₂F₄, wherein the ratio of the rate of gas flow from the first reservoir to the rate of gas flow from the second reservoir is r, wherein the concentration of boron in the chamber is b, and wherein, for constants m,n>

0, r<

m when b<

n and r≧

n when b≧

n.

67. A method for etching a substrate, comprising the steps of:

providing a substrate selected from the group consisting of semiconductor and dielectric substrates;

etching the substrate through the use of a plasma based on a gaseous mixture comprising C₄F₆, O₂, and Ar, thereby forming a modified substrate; and

further etching the modified substrate through the use of a plasma based on a gaseous mixture comprising C₄F₆, O₂, Ar, and C₂H₂F₄.

68. A method for etching a substrate, comprising the steps of:

providing a substrate comprising (a) a first layer comprising a doped oxide, and (b) a second layer, comprising an undoped oxide;

etching the substrate through the use of a plasma based on a first gaseous mixture comprising C₄F₆, O₂ and Ar so as to form a depression that extends at least partially through the second layer, but does not extend substantially into the first layer, thereby forming a modified substrate; and

etching the modified substrate through the use of a plasma based on a second gaseous mixture comprising C₄F₆, O₂, C₂H₂F₄, and Ar so as to extend the depression substantially into the first layer.

69. The method of claim 68, wherein the first layer comprises boron phosphorosilicate glass.

70. The method of claim 68, wherein the second layer comprises tetraethylorthosilicate.

71. The method of claim 68, wherein said first and second gaseous mixtures are distinct.

72. The method of claim 68, wherein the substrate is etched with the first gaseous mixture so as to form a depression that extends only partially through the second layer.

73. The method of claim 68, wherein the substrate is further provided with a third layer comprising a photo resist.

74. The method of claim 68, wherein the second layer is contiguous to the first layer.

75. An article, comprising:

a substrate;

first and second gate structures disposed on said substrate, said first and second gate structures being separated by a gap of less than about 0.25 microns;

a layer of silicon nitride disposed over said gate structures and said gap;

a layer of doped oxide disposed over said layer of silicon nitride; and

a layer of undoped oxide disposed over said layer of doped oxide.

76. The article of claim 75, wherein said doped oxide comprises boron phosphorosilicate glass.

77. The article of claim 75, wherein said undoped oxide comprises tetraethylorthosilicate.

78. The article of claim 75, further comprising an antireflective layer disposed over said layer of undoped oxide.

79. The article of claim 78, further comprising a layer of photo resist disposed over said antireflective layer.

80. The article of claim 78, wherein said layer of photo resist contains a second gap which overlaps said first gap, and wherein the minimum width of the second gap is greater than the maximum width of the first gap.