Testing integrated circuits using high bandwidth wireless technology

• US 20060052075A1
• Filed: 09/07/2004
• Published: 03/09/2006
• Est. Priority Date: 09/07/2004
• Status: Abandoned Application

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Kundu, Sandip, Mak, Tak M., Galivanche, Rajeshwar
• Application Number:
  US10/936,090
• Publication Number:
  US 20060052075A1
• Time in Patent Office: Days
• US Class Current: 455/323
• CPC Class Codes: G01R 31/3025 Wireless interface with the DUT
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01Q 1/2283 mounted in or on the surface of a semiconductor substrate as a chip-type antenna or integrated with other components into an IC package

Abstract

According to embodiments of the present invention, a UWB (ultra wideband) communication system is employed to wirelessly test and configure circuits on a die. Baseband signals may be utilized with resulting simplification in CMOS circuits, or orthogonal frequency division multiplexing may be employed to allow more than one communication channel. In one embodiment, the antenna for communicating with circuits on a die is placed between the package and the heat spreader, in electrical contact with a solder bump. In another embodiment, the antennas are placed onto wafer scribe lines, and are used to test chips before the wafer is sawed. Other embodiments are described and claimed.

Claims

1. A system comprising:

a wafer comprising a plurality of integrated circuits, wherein each integrated circuit comprises an ultra wide bandwidth (UWB) transceiver; and

a tester comprising an UWB transceiver to communication with the ultra wide bandwidth transceivers on the wafer.

2. The system as set forth in claim 1, the wafer have scribe lines, the wafer further comprising at least one antenna, where each of the least one antenna is formed on one of the scribe lines.

3. The system as set forth in claim 2, the wafer further comprising at least one capacitor so that each of the at least one antenna is capacitively coupled to at least one of the UWB transceivers on the wafer.

4. The system as set forth in claim 2, the wafer further comprising at least one inductor so that each of the at least one antenna is inductively coupled to at least one of the UWB transceivers on the wafer.

5. The system as set forth in claim 1, wherein the UWB transceivers transmit baseband signals.

6. The system as set forth in claim 5, the wafer have scribe lines, the wafer further comprising at least one antenna, where each of the least one antenna is formed on one of the scribe lines.

7. The system as set forth in claim 6, the wafer further comprising at least one capacitor so that each of the at least one antenna is capacitively coupled to at least one of the UWB transceivers on the wafer.

8. The system as set forth in claim 6, the wafer further comprising at least one inductor so that each of the at least one antenna is inductively coupled to at least one of the UWB transceivers on the wafer.

9. The system as set forth in claim 1, wherein the UWB transceivers transmit signals having a carrier frequency, wherein each transmitted signal has a bandwidth at least twenty percent that of its carrier frequency.

10. The system as set forth in claim 9, the wafer have scribe lines, the wafer further comprising at least one antenna, where each of the least one antenna is formed on one of the scribe lines.

11. The system as set forth in claim 10, the wafer further comprising at least one capacitor so that each of the at least one antenna is capacitively coupled to at least one of the UWB transceivers on the wafer.

12. The system as set forth in claim 10, the wafer further comprising at least one inductor so that each of the at least one antenna is inductively coupled to at least one of the UWB transceivers on the wafer.

13. A wafer comprising:

a plurality of scribe lines;

a plurality of antennas, where each of the antennas is formed on one of the scribe lines;

a plurality of capacitors, each capacitor comprising a first plate connected to one of the antennas, and a second plate not connected to the first plate; and

a plurality of transceivers, where each transceiver is connected to one of the second plates.

14. The wafer as set forth in claim 13, wherein each of the transceivers is an ultra wide bandwidth (UWB) transceiver.

15. The wafer as set forth in claim 14, wherein each of the transceivers transmits a baseband signal.

16. The wafer as set forth in claim 14, wherein each of the transceivers transmits a signal having a bandwidth and a carrier frequency, where for each signal its bandwidth is at least twenty percent that of its carrier frequency.

17. A system comprising:

a tester comprising a transceiver; and

a wafer comprising;

a plurality of scribe lines;

a plurality of antennas, where each of the antennas is formed on one of the scribe lines;

a plurality of capacitors, each capacitor comprising a first plate connected to one of the antennas, and a second plate not connected to the first plate; and

a plurality of transceivers to communicate with the transceiver on the tester, where each transceiver on the wafer is connected to one of the second plates.

18. The system as set forth in claim 17, wherein each of the transceivers is a ultra wide bandwidth (UWB) transceiver.

19. The system as set forth in claim 18, wherein each of the transceivers transmits a baseband signal.

20. The system as set forth in claim 18, wherein each of the transceivers transmits a signal having a bandwidth and a carrier frequency, where for each signal its bandwidth is at least twenty percent that of its carrier frequency.

21. A wafer comprising:

a plurality of scribe lines;

a plurality of antennas, where each of the antennas is formed on one of the scribe lines;

a plurality of inductors, each inductor comprising a first winding connected to one of the antennas, and a second winding not connected to the first winding; and

a plurality of transceivers, where each transceiver is connected to one of the second windings.

22. The wafer as set forth in claim 21, wherein each of the transceivers is an ultra wide bandwidth (UWB) transceiver.

23. The wafer as set forth in claim 22, wherein each of the transceivers transmits a baseband signal.

24. The wafer as set forth in claim 22, wherein each of the transceivers transmits a signal having a bandwidth and a carrier frequency, where for each signal its bandwidth is at least twenty percent that of its carrier frequency.

25. A system comprising:

a tester comprising a transceiver; and

a wafer comprising;

a plurality of scribe lines;

a plurality of antennas, where each of the antennas is formed on one of the scribe lines;

a plurality of inductors, each capacitor comprising a first winding connected to one of the antennas, and a second winding not connected to the first plate; and

a plurality of transceivers to communicate with the transceiver on the tester, where each transceiver on the wafer is connected to one of the second windings.

26. The system as set forth in claim 25, wherein each of the transceivers is a ultra wide bandwidth (UWB) transceiver.

27. The system as set forth in claim 26, wherein each of the transceivers transmits a baseband signal.

28. The system as set forth in claim 26, wherein each of the transceivers transmits a signal having a bandwidth and a carrier frequency, where for each signal its bandwidth is at least twenty percent that of its carrier frequency.

29. An apparatus comprising:

a die;

a set of solder bumps in electrical contact with the die;

a package in contact with the set of solder bumps;

a heat spreader adjacent to the die; and

an antenna disposed on the package.

30. The apparatus as set forth in claim 29, wherein a first portion of the antenna is in between the heat spreader and the package, and a second portion is disposed on the package but outside the heat spreader.

31. The apparatus as set forth in claim 30, further comprising an ultra wide bandwidth (UWB) transceiver coupled to the antenna.

32. The apparatus as set forth in claim 31, wherein the transceiver transmits a baseband signal.

33. The apparatus as set forth in claim 31, wherein the transceiver transmits a signal having a carrier frequency and a bandwidth at least twenty percent the carrier frequency.

34. The apparatus as set forth in claim 29, further comprising an ultra wide bandwidth (UWB) transceiver coupled to the antenna.

36. The apparatus as set forth in claim 34, wherein the transceiver transmits a baseband signal.

37. The apparatus as set forth in claim 34, wherein the transceiver transmits a signal having a carrier frequency and a bandwidth at least twenty percent the carrier frequency.

38. A system comprising:

a die comprising a UWB transceiver;

a board comprising an antenna, wherein the antenna is in electrical communication with the die; and

a tester comprising a UWB transceiver to communicate with the UWB transceiver of the die to test the die.

39. A system comprising:

a die comprising a UWB transceiver and a pin; and

a probe board, wherein the die is not in contact with the probe board, the probe board comprising an antenna and a pin to make electrical contact with the pin on the die.