Method and equipment for mounting part
First Claim
1. A method of component mounting for picking up components and mounting the same onto respective predetermined mounting positions of a circuit substrate by means of a plurality of nozzles connected to a single vacuum generating source, wherein the method including procedures for preventing occurrence of defective circuit substrates due to missing component, said procedures comprising steps of:
- initializing achieved vacuum pressure of a nozzle after completion of component pick up operation to zero;
detecting vacuum pressure decrease of the nozzle from the initialized zero value; and
if the detected vacuum pressure decrease exceeds predetermined first threshold, making a judgment that the nozzle has failed to pick up a component, and skipping component mounting operation by that particular nozzle.
2 Assignments
0 Petitions
Accused Products
Abstract
The present invention is to provide a method and an apparatus for mounting components having a feature of detecting with high accuracy component pick up failure by the nozzle at component pick up stage, and/or component carrying back by the nozzle at component mounting stage. Achieved vacuum pressure is initialized to zero after completion of component pick up by the nozzle 25, and vacuum pressure decrease of the nozzle 25 is detected from the initialized zero point. If the detected value is bigger than the predetermined threshold, it may be judged that at least one of the nozzles failed to pick up a component. The failed nozzle may be identified by using a component recognition device 37. Blowing air blow volume flowing through the nozzle 25 is measured upon completion of component mounting. If the blowing air flow is smaller that the predetermined threshold, it is judged that the nozzle 25 carries back a component 30. Two thresholds may be used, and it may be judged that the component has been properly mounted if the measurement value is bigger than both thresholds, filter 22 is clogged if the measurement value is in between the two thresholds, and the nozzle 25 carries back the component if the measurement value is smaller than both thresholds.
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Citations
29 Claims
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1. A method of component mounting for picking up components and mounting the same onto respective predetermined mounting positions of a circuit substrate by means of a plurality of nozzles connected to a single vacuum generating source, wherein the method including procedures for preventing occurrence of defective circuit substrates due to missing component, said procedures comprising steps of:
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initializing achieved vacuum pressure of a nozzle after completion of component pick up operation to zero;
detecting vacuum pressure decrease of the nozzle from the initialized zero value; and
if the detected vacuum pressure decrease exceeds predetermined first threshold, making a judgment that the nozzle has failed to pick up a component, and skipping component mounting operation by that particular nozzle. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method of component mounting for picking up a component by means of vacuum sucking effect of a nozzle, and separating the component from the nozzle and mounting the same onto a predetermined mounting position of a circuit substrate by means of air blowing effect of the nozzle, wherein the method including procedures for preventing occurrence of defective substrates, which procedures comprising steps of;
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measuring air flow volume blown from the nozzle at an air flow passage at a timing immediately after completion of component mounting operation, which air flow passage is provided for supplying pressurized air to the nozzle; and
making a judgment that the component has not been mounted onto the circuit substrate, if the measurement value is smaller than a predetermined threshold. - View Dependent Claims (8, 9)
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10. A method of component mounting for picking up a component by means of vacuum sucking effect of a nozzle, and separating the component from the nozzle and mounting the same onto a predetermined mounting position of a circuit substrate by means of air blowing effect of the nozzle, wherein the method including procedures for preventing occurrence of defective substrates, which procedures comprising steps of;
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measuring differential of air flow volume blown from the nozzle at an air flow passage at a timing immediately after completion of component mounting operation, which air flow passage is provided for supplying pressurized air to the nozzle; and
making a judgment that the component has not been mounted onto the circuit substrate, if the differential of air flow volume decrease obtained by the measurement is bigger than a predetermined threshold. - View Dependent Claims (11, 12)
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13. A method of component mounting for picking up a component by means of vacuum sucking effect of a nozzle, and separating the component from the nozzle and mounting the same onto a predetermined mounting position of a circuit substrate by means of air blowing effect of the nozzle, wherein the method including procedures for preventing occurrence of defective substrates, which procedures comprising steps of;
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measuring blowing air pressure blown from the nozzle at an air flow passage at a timing immediately after completion of component mounting operation, which air flow passage is provided for supplying pressurized air to the nozzle; and
making a judgment that the component has not been mounted onto the circuit substrate, if the measurement value is bigger than a predetermined threshold. - View Dependent Claims (14, 15)
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16. A method of component mounting for picking up a component by means of vacuum sucking effect of a nozzle, and separating the component from the nozzle and mounting the same onto a predetermined mounting position of a circuit substrate by means of air blowing effect of the nozzle, wherein the method including procedures for preventing occurrence of defective substrates, which procedures comprising steps of;
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measuring differential of blowing air pressure blown from the nozzle at an air flow passage at a timing immediately after completion of component mounting operation, which air flow passage is provided for supplying pressurized air to the nozzle; and
making a judgment that the component has not been mounted onto the circuit substrate, if the differential of blowing air pressure decrease obtained by the measurement is smaller than a predetermined threshold. - View Dependent Claims (17, 18)
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19. A method of component mounting for picking up a component by means of vacuum sucking effect of a nozzle, and separating the component from the nozzle and mounting the same onto a predetermined mounting position of a circuit substrate by means of air blowing effect of the nozzle, wherein the method including procedures for preventing occurrence of defective substrates, which procedures comprising steps of;
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measuring either one of blowing air flow volume, differential of blowing air flow volume decrease, blowing air pressure, or differential of blowing air pressure decrease of the air blown from the nozzle at an air flow passage at a timing immediately after completion of component mounting operation, which air flow passage is provided for supplying pressurized air to the nozzle;
comparing the result of the measurement with a predetermined corresponding threshold;
making a judgment that the component has been separated from the nozzle and mounted onto the circuit substrate properly, if the blowing air flow volume or the differential of blowing air pressure decrease is bigger than the corresponding predetermined threshold, or the differential of blowing air volume decrease or blowing air pressure is smaller than the corresponding predetermined threshold, and then performing next round component pick up operation;
making a judgment that the component has not been separated from the nozzle and that the circuit substrate is missing the component, if the blowing air flow volume or the differential of blowing air pressure decrease is smaller than the corresponding predetermined threshold, or the differential of blowing air volume decrease or blowing air pressure is bigger than the corresponding predetermined threshold;
stopping the component mounting apparatus;
checking the nozzle, removing the component carried by the nozzle, and confirming that the nozzle is in a proper condition; and
restarting the component mounting apparatus for next round component pick up operation. - View Dependent Claims (23, 24, 25)
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20. A method of component mounting for picking up a component by means of vacuum sucking effect of a nozzle, and separating the component from the nozzle and mounting the same onto a predetermined mounting position of a circuit substrate by means of air blowing effect of the nozzle, wherein the method including procedures for preventing occurrence of defective substrates, which procedures comprising steps of;
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measuring either one of blowing air flow volume, differential of blowing air flow volume decrease, blowing air pressure, or differential of blowing air pressure decrease of the air blown from the nozzle at an air flow passage at a timing immediately after completion of component mounting operation, which air flow passage is provided for supplying pressurized air to the nozzle;
comparing the result of the measurement with a first predetermined corresponding threshold;
making a judgment that the component has been separated from the nozzle and mounted onto the circuit substrate properly, if the blowing air flow volume or the differential of blowing air pressure decrease is bigger than the corresponding predetermined first thresholds, or the differential of blowing air flow volume decrease or blowing air pressure is smaller than the corresponding predetermined first threshold, and then performing next round component pick up operation;
comparing the result of the measurement with a second corresponding predetermined threshold, if the blowing air flow volume or the differential of blowing air pressure decrease is smaller than the corresponding predetermined first threshold, or the differential of blowing air flow volume decrease or the blowing air pressure is bigger than the corresponding predetermined first threshold;
making a judgment that the component has been mounted onto the circuit substrate but that a filter disposed at an air flow passage is clogged, and generating an alarm, if the blowing air flow volume or the differential of blowing air pressure decrease is bigger than the corresponding predetermined second thresholds, or the differential of blowing air flow volume decrease or blowing air pressure is smaller than the corresponding predetermined second threshold;
making a judgment that the component has not been separated from the nozzle and that the circuit substrate is missing the component, if the blowing air flow volume or the differential of blowing air pressure decrease is smaller than the corresponding predetermined second threshold, or the differential of blowing air volume decrease or the blowing air pressure is bigger than the corresponding predetermined second threshold;
stopping the component mounting apparatus;
checking the nozzle, removing the component carried by the nozzle, and confirming that the nozzle is in a proper condition; and
restarting the component mounting apparatus for next round component pick up operation. - View Dependent Claims (21, 22)
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26. A component mounting apparatus comprising:
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component supply for supplying component continuously;
a mounting head having nozzles for picking up components from the component supply by means of air sucking effect, and separating and mounting the components onto predetermine respective mounting positions of a circuit substrate by means of air blowing effect;
a substrate holder for transporting and positioning the circuit substrate;
an air sucking/blowing mechanism connected to the nozzles for providing air sucking effect and air blowing effect to the nozzle; and
a controller for controlling overall operations of the component mounting apparatus, wherein the air sucking/blowing mechanism further comprising;
either one of a measuring meter capable of measuring blowing air flow volume or differential of the blowing air flow volume, or a pressure meter capable of measuring blowing air pressure or differential of the blowing air pressure, either one of which is disposed at an air flow passage for supplying pressurized air to the nozzle, and for measuring either blowing air volume or pressure at a timing immediately after completion of blowing air; and
a controller for comparing the measuring result obtained by either one of the meters with a corresponding preliminary inputted threshold, and for making a judgment whether or not the component has been mounted properly. - View Dependent Claims (27, 28, 29)
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Specification