Plasma treatment for purifying copper or nickel

• US 20060054184A1
• Filed: 11/08/2005
• Published: 03/16/2006
• Est. Priority Date: 05/08/2003
• Status: Abandoned Application

• Current Assignee: Kolektor Group DOO
• Original Assignee: Kolektor Group DOO
• Inventors: Cvelbar, Uros, Mozetic, Miran
• Application Number:
  US11/270,256
• Publication Number:
  US 20060054184A1
• Time in Patent Office: Days
• US Class Current: 134/1.100
• CPC Class Codes: B08B 7/0035 by radiant energy, e.g. UV, laser, light beam or the like
• CPC Class Codes: B23K 1/20 Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating preparation of surfaces in particular ways, see the relevant classes for the treatments or the materials treated, e.g. C04B, C23C
• CPC Class Codes: C23G 5/00 Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents

Abstract

A method for treating electronic components made of copper, nickel or alloys thereof or with materials such as brass or plated therewith and includes the steps of arranging the components in a treatment chamber, generating a vacuum in the treatment chamber, introducing oxygen into the treatment chamber, providing a pressure ranging between 10⁻¹ and 50 mbar in the treatment chamber and exciting a plasma in the chamber, allowing the oxygen radicals to act on the components, generating a vacuum in the treatment chamber, introducing hydrogen into the treatment chamber, providing a pressure ranging between 10⁻¹ and 50 mbar in the treatment chamber and exciting a plasma in the chamber and allowing the hydrogen radicals to act on the components.

Claims

1. A method for treatment of electronic components that are made of copper or nickel or of alloys thereof with one another or of other materials such as brass, or that are coated therewith, which method comprises the following steps:

disposing the components in a treatment chamber;

evacuating the treatment chamber;

introducing oxygen or water vapor into the treatment chamber;

ensuring a pressure in the range of 101 to 50 mbar in the treatment chamber and exciting a plasma in the chamber by a high-frequency generator having a frequency of higher than approximately 1 MHz;

causing oxygen radicals to act on the components, the flux of radicals on the component surface being greater than approximately 1021 radicals per square meter per second;

pumping out the chamber;

introducing hydrogen into the treatment chamber;

ensuring a pressure in the range of 101 to 50 mbar in the treatment chamber and exciting a plasma in the chamber by a high-frequency generator having a frequency of higher than approximately 1 MHz or generating hydrogen radicals in a d.c. glow discharge;

causing hydrogen radicals to act on the components, the flux of radicals on the component surface being greater than approximately 1021 radicals per square meter per second.

2. A method according to claim 1, wherein oxygen is replaced by a mixture of a noble gas and oxygen.

3. A method according to claim 1, wherein oxygen is replaced by a mixture of a noble gas and water vapor.

4. A method according to claim 1, wherein hydrogen is replaced by a mixture of a noble gas and hydrogen.

5. A method according to claim 1, wherein the plasma is excited by inputting a power density of approximately 30 to approximately 1000 W per liter of discharge volume.

6. A method according to claim 1, wherein the gases are passed through the chamber at a flowrate of approximately 100 to approximately 10000 sccm per m2 of treated surface during the plasma-treatment steps.

7. A method according to claim 1, wherein the high-frequency generator is inductively coupled.

8. A method according to claim 1, wherein the components are negatively biased by an additional d.c. energy supply.

9. A treatment of electronic components that are made of copper or nickel or of alloys thereof with one another or of other materials such as brass, or that are coated therewith, comprising a treatment according to claim 1 first and then cementing, soldering or welding another material onto the surface of the electronic component treated in this way.