Sensor device having stopper for limitting displacement

• US 20060055062A1
• Filed: 09/13/2005
• Published: 03/16/2006
• Est. Priority Date: 09/14/2004
• Status: Active Grant

• Current Assignee: DENSO Corporation
• Original Assignee: DENSO Corporation
• Inventors: Ohta, Tameharu
• Granted Patent: US 7,385,296 B2
• Time in Patent Office: Days
• US Class Current: 257/784
• CPC Class Codes: G01C 19/5719 using planar vibrating masses driven in a translation vibration along an axis
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/2919 with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/4813 Connecting within a semiconductor or solid-state body, i.e. fly wire, bridge wire
• CPC Class Codes: H01L 2224/48145 the bodies being stacked
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48624 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48644 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/48724 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48744 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 2224/8314 Guiding structures outside the body
• CPC Class Codes: H01L 2224/8385 using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
• CPC Class Codes: H01L 2224/85424 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/85444 : Gold (Au) as principal constituent
• CPC Class Codes: H01L 2225/06506 : Wire or wire-like electrical connections between devices
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06593 : Mounting aids permanently on device; arrangements for alignment use of temporary supports H01L21/6835
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/83 : using a layer connector
• CPC Class Codes: H01L 25/18 : the devices being of types provided for in two or more different subgroups of the same main group of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/0665 : Epoxy resin
• CPC Class Codes: H01L 2924/07802 : not being an ohmic electrical conductor
• CPC Class Codes: H01L 2924/1305 : Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/13091 : Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/1517 : Multilayer substrate
• CPC Class Codes: H01L 2924/16195 : Flat cap [not enclosing an internal cavity]
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/351 : Thermal stress

Abstract

A sensor includes: a first chip; a second chip disposed on the first chip through an adhesive member; and a stopper. The second chip is connected to the first chip through a bonding wire. The stopper limits a displacement of the second chip when the adhesive member is deformed. The stopper is disposed around the second chip. Since the displacement of the second chip is restricted, deformation of the bonding wire between the first and the second chips is also restricted.

Claims

1. A sensor comprising:

a first chip;

a second chip disposed on the first chip through an adhesive member; and

a stopper, wherein

the second chip is connected to the first chip through a bonding wire,

the stopper limits a displacement of the second chip when the adhesive member is deformed, and

the stopper is disposed around the second chip.

2. The sensor according to claim 1, wherein

the first chip is a circuit chip, and

the second chip is a sensor chip.

3. The sensor according to claim 1, wherein

the stopper is a bonding wire disposed on a part of the first chip, the part being disposed outside of a periphery of the second chip.

4. The sensor according to claim 3, wherein

the second chip has a rectangular shape, and

the bonding wire of the stopper has an inverted horseshoe arch shape, and is disposed outside-of a corner of the rectangular shape of the second chip.

5. The sensor according to claim 4, wherein

the bonding wire of the stopper has two ends, each of which is connected to a surface of the first chip.

6. The sensor according to claim 1, wherein

the stopper is a stud bump disposed on a part of the first chip, the part being disposed outside of a periphery of the second chip.

7. The sensor according to claim 6, wherein

the second chip has a rectangular shape, and

the stud bump of the stopper includes a pair of bumps, which are close to one another and disposed outside of a corner of the rectangular shape of the second chip.

8. The sensor according to claim 7, wherein

the bumps of the stopper are disposed on a surface of the first chip.

9. The sensor according to claim 1, wherein

the stopper is a solder bump disposed on a part of the first chip, the part being disposed outside of a periphery of the second chip.

10. The sensor according to claim 9, wherein

the second chip has a rectangular shape, and

the solder bump of the stopper is disposed outside of a side of the rectangular shape of the second chip.

11. The sensor according to claim 10, wherein

the solder bump is disposed on a surface of the first chip.

12. The sensor according to claim 1, wherein

the stopper is a resin member disposed on a part of the first chip, the part being disposed outside of a periphery of the second chip.

13. The sensor according to claim 12, wherein

the second chip has a rectangular shape, and

the resin member of the stopper has an elongated shape, and is disposed outside of a side of the rectangular shape of the second chip.

14. The sensor according to claim 13, wherein

the resin member is disposed on a surface of the first chip.

15. The sensor according to claim 1, wherein

the stopper is a large wire, which connects between the first chip and the second chip, and

the large wire has a diameter larger than that of the bonding wire.

16. The sensor according to claim 15, wherein

the second chip has a rectangular shape, and

the larger wire of the stopper is disposed on a corner of the rectangular shape of the second chip.

17. The sensor according to claim 1, further comprising:

a package, wherein

the first chip is mounted on the package, and

the stopper is a wire, which connects between the second chip and the package.

18. The sensor according to claim 17, wherein

the second chip has a rectangular shape, and

the wire of the stopper is disposed on a corner of the rectangular shape of the second chip.