LED package and method for producing the same

• US 20060057751A1
• Filed: 09/14/2005
• Published: 03/16/2006
• Est. Priority Date: 09/15/2004
• Status: Active Grant

• Current Assignee: Suzhou Industrial Park Tony Lighting Technology Co., Ltd.
• Original Assignee: Yu-Nung Shen
• Inventors: Shen, Yu-Nung
• Granted Patent: US 7,307,287 B2
• Time in Patent Office: Days
• US Class Current: 438/22
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05008 Bonding area integrally formed with a redistribution layer on the semiconductor or solid-state body, e.g.
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/051 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/24105 Connecting bonding areas at different heights
• CPC Class Codes: H01L 2224/24146 the HDI interconnect connecting to the same level of the lower semiconductor or solid-state body at which the upper semiconductor or solid-state body is mounted
• CPC Class Codes: H01L 24/13 of an individual bump connector
• CPC Class Codes: H01L 24/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 24/24 of an individual high density interconnect connector
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 25/167 comprising optoelectronic devices, e.g. LED, photodiodes
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

A method for producing an LED package is provided, the LED package includes an LED die, which has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode and a second electrode arranged on the non-light-emitting surface, a reverse-voltage protection member arranged on the non-light-emitting surface of the LED die, a conductive member electrically connecting the respective electrode of the LED die and the respective pole of the reverse-voltage protection member, and two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit. Wherein the reverse-voltage protection member has a first pole that is the first polarity and a second pole that is the second polarity; the polarity of each pole of the reverse-voltage protection member is opposite to that of the electrode of the LED die.

Claims

1. A method for producing an LED package, comprising:

providing an LED die that illuminates when it is excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner;

arranging a reverse-voltage protection member on the non-light-emitting surface of the LED die, wherein the reverse-voltage protection member which has a first pole is the first polarity and a second pole is the second polarity;

forming a conductive member electrically connecting at least one of the electrodes of the LED die and a respective one of the poles of the reverse-voltage protection member, wherein the polarity of each of the poles of the reverse-voltage protection member is opposite to that of the electrode of the LED die; and

forming two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit.

2. The method as claimed in claim 1, wherein the step of providing the LED die includes:

forming an auxiliary conductive layer on each electrode of the LED die.

3. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die; and

forming an opaque insulative layer, on the LED die, that has two exposure holes exposing the electrodes respectively, and an opaque protective layer, on the opaque insulative layer, that has two through holes corresponding to the two exposure holes one to one for communication, wherein each of the through holes is larger than the respective exposure hole;

the step of arranging the reverse-voltage protection member includes;

forming an auxiliary opaque insulative layer on a second surface of the reverse-voltage protection member and an auxiliary opaque protective layer on the auxiliary opaque insulative layer, wherein the reverse-voltage protection member has an auxiliary LED die including a first surface, the second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary opaque insulative layer has two auxiliary exposure holes exposing the auxiliary electrodes respectively, and the auxiliary opaque protective layer has two auxiliary through holes corresponding to the two auxiliary exposure holes one to one for communication;

each of the auxiliary through holes is larger than the respective auxiliary exposure hole;

wherein the auxiliary LED die is disposed on the opaque protective layer of the LED die while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the through hole of the LED die is larger than the auxiliary through hole;

the step of forming the conductive member includes;

forming a plurality of conductors of the conductive member inside the through hole and the respective exposure hole in order to electrically connect to the respective electrode;

wherein the first electrode of the LED die electrically connects with the second auxiliary electrode of the auxiliary LED die but the second electrode of the LED die electrically connects with the first auxiliary electrode of the auxiliary LED die, while the auxiliary LED die is disposed on the opaque protective layer of the LED die;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the opaque protective layer of the LED die, wherein the opaque enclosing layer covers the auxiliary LED die and has two openings corresponding to the through holes of the opaque protective layer of the LED die respectively for exposing a partial portion of the conductors formed inside the through holes respectively; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

4. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die; and

forming an insulative layer on the LED die that has two exposure holes exposing the electrodes respectively, and a protective layer on the insulative layer that has two through holes corresponding to the two exposure holes one to one for communication, wherein each of the through holes is larger than the respective exposure hole;

the step of arranging the reverse-voltage protection member includes;

forming an auxiliary insulative layer on a second surface of the reverse-voltage protection member and an auxiliary protective layer on the auxiliary insulative layer, wherein the reverse-voltage protection member has a Zener diode including a first surface, the second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary insulative layer has two auxiliary exposure holes exposing the auxiliary electrodes respectively, and the auxiliary protective layer has two auxiliary through holes corresponding to the two auxiliary exposure holes one to one for communication;

each of the auxiliary through holes is larger than the respective auxiliary exposure hole;

wherein the Zener diode is disposed on the protective layer of the LED die while the second surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the through hole of the LED die is larger than the auxiliary through hole;

the step of forming the conductive member includes;

forming a plurality of conductors of the conductive member inside the through hole and the respective exposure hole in order to electrically connect to the respective electrode;

wherein the first electrode of the LED die electrically connects with the second auxiliary electrode of the Zener diode but the second electrode of the LED die electrically connects with the first auxiliary electrode of the Zener diode, while the Zener diode is disposed on the protective layer of the LED die;

the step before forming the two outer conductive members includes;

forming an enclosing layer over the opaque protective layer of the LED die, wherein the enclosing layer covers the Zener diode and has two openings corresponding to the through holes of the protective layer of the LED die respectively for exposing a partial portion of the conductors formed inside the through holes respectively; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

5. The method as claimed in claim 3, wherein the step of forming the conductive member includes:

forming the conductive member by printing a conductive paste.

6. The method as claimed in claim 4, wherein the step of forming the conductive member includes:

forming the conductive member by printing a conductive paste.

7. The method as claimed in claim 3, wherein the step of forming the conductive member includes:

forming the conductive member by sputtering a metallic material.

8. The method as claimed in claim 4, wherein the step of forming the conductive member includes:

forming the conductive member by sputtering a metallic material.

9. The method as claimed in claim 3, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

10. The method as claimed in claim 4, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

11. The method as claimed in claim 3, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

12. The method as claimed in claim 4, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

13. The method as claimed in claim 3, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

14. The method as claimed in claim 4, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

15. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die;

the step of arranging the reverse-voltage protection member includes;

arranging an auxiliary LED die on the reverse-voltage protection member, wherein the auxiliary LED die has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, wherein the auxiliary LED die is disposed on the non-light-emitting surface of the LED die while the first surface of the auxiliary LED die is arranged under the non-light-emitting surface and faces the non-light-emitting surface of the LED die;

the step after arranging the reverse-voltage protection member includes;

forming an opaque insulative layer on the non-light-emitting surface of the LED die, and an opaque protective layer on the opaque insulative layer, wherein the opaque insulative layer has a plurality of exposure holes exposing the corresponding electrodes of the LED die and the auxiliary LED die, and the opaque protective layer has two through holes communicating with the respective exposure holes for electrically connecting two electrodes, one electrode acts as the LED die, the other electrode acts as the auxiliary LED die and has polarity opposite to that of the other one;

the step of forming the conductive member includes;

arranging two conductors of the conductive member;

wherein each of the two conductors includes a first portion that is disposed inside the respective exposure hole to electrically connect with the respective electrode of the LED die, a second portion that is disposed inside the respective through hole that communicates with the exposure hole of the insulative layer receiving the first portion to electrically connect with the first portion, and a third portion that is disposed inside the respective exposure hole that communicates with the through hole for receiving the second portion in order to electrically connect with the respective auxiliary electrode of the auxiliary LED die and the second portion;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the opaque protective layer of the LED die, wherein the opaque enclosing layer has two openings for exposing the second portion of the conductor; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

16. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die;

the step of arranging the reverse-voltage protection member includes;

arranging a Zener diode on the reverse-voltage protection member, wherein the Zener diode has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the Zener diode is disposed on the non-light-emitting surface of the LED die while the first surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the step after arranging the reverse-voltage protection member includes;

forming an insulative layer on the non-light-emitting surface of the LED die, and a protective layer on the insulative layer, wherein the insulative layer has a plurality of exposure holes exposing the corresponding electrodes of the LED die and the Zener diode, and the opaque protective layer has two through holes communicating with the respective exposure holes for electrically connecting two electrodes, one electrode acts as the LED die, the other is of the Zener diode and has polarity opposite to that of the other one;

the step of forming the conductive member includes;

arranging two conductors of the conductive member;

wherein each of the two conductors includes a first portion that is disposed inside the respective exposure hole to electrically connect with the respective electrode of the LED die, a second portion that is disposed inside the respective through hole that communicates with the exposure hole of the insulative layer receiving the first portion to electrically connect with the first portion, and a third portion that is disposed inside the respective exposure hole that communicates with the through hole receiving the second portion in order to electrically connect with the respective auxiliary electrode of the Zener diode and the second portion;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the protective layer of the LED die, wherein the opaque enclosing layer has two openings for exposing the second portion of the conductor; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

17. The method as claimed in claim 15, wherein the step of forming the conductive member includes:

forming the conductors by printing a conductive paste.

18. The method as claimed in claim 16, wherein the step of forming the conductive member includes forming the conductors by printing a conductive paste.

19. The method as claimed in claim 15, wherein the step of forming the conductive member includes:

forming the conductors by sputtering a metallic material.

20. The method as claimed in claim 16, wherein the step of forming the conductive member includes:

forming the conductors by sputtering a metallic material.

21. The method as claimed in claim 15, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

22. The method as claimed in claim 16, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

23. The method as claimed in claim 15, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

24. The method as claimed in claim 16, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

25. The method as claimed in claim 15, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

26. The method as claimed in claim 16, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

27. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die;

the step after providing the LED die includes;

forming an opaque insulative layer on the non-light-emitting surface of the LED die, wherein the opaque insulative layer has two exposure holes exposing the electrodes respectively, each of the exposure holes is larger than the respective electrode;

the step of forming the conductive member includes;

arranging two conductors inside the respective exposure holes in order to electrically connect with the respective electrodes of the LED die;

the step of arranging the reverse-voltage protection member includes;

arranging an auxiliary LED die on the reverse-voltage protection member, wherein the auxiliary LED die has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the first auxiliary electrode of the auxiliary LED die is electrically connected with the second electrode of the LED die via a respective one of the conductors, while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

but the second auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via the other conductor;

the step after arranging the reverse-voltage protection member includes;

forming an opaque enclosing layer over the insulative layer, wherein the opaque enclosing layer has two openings for exposing a partial portion of the respective conductor; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

28. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die;

the step after providing the LED die includes;

forming an opaque insulative layer on the non-light-emitting surface of the LED die, wherein the opaque insulative layer has two exposure holes exposing the electrodes respectively, each of the exposure holes is larger than the respective electrode;

the step of forming the conductive member includes;

arranging two conductors inside the respective exposure holes in order to electrically connect with the respective electrodes of the LED die;

the step of arranging the reverse-voltage protection member includes;

arranging a Zener diode on the reverse-voltage protection member, wherein the Zener diode has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the first auxiliary electrode of the Zener diode is electrically connected with the second electrode of the LED die via a respective one of the conductors, while the second surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

but the second auxiliary electrode of the Zener diode is electrically connected with the first electrode of the LED die via the other one of the conductors;

the step after arranging the reverse-voltage protection member includes;

forming an enclosing layer over the insulative layer, wherein the enclosing layer has two openings for exposing a partial portion of the respective conductor; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

29. The method as claimed in claim 27, wherein the step of forming the conductive member includes:

forming the conductors by printing a conductive paste.

30. The method as claimed in claim 28, wherein the step of forming the conductive member includes:

forming the conductors by printing a conductive paste.

31. The method as claimed in claim 27, wherein the step of forming the conductive member includes:

forming the conductors by sputtering a metallic material.

32. The method as claimed in claim 28, wherein the step of forming the conductive member includes:

forming the conductors by sputtering a metallic material.

33. The method as claimed in claim 27, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

34. The method as claimed in claim 28, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

35. The method as claimed in claim 27, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

36. The method as claimed in claim 28, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

37. The method as claimed in claim 27, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

38. The method as claimed in claim 28, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

39. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die;

the step after providing the LED die includes;

forming an opaque insulative layer on the non-light-emitting surface of the LED die, wherein the opaque insulative layer has a first exposure hole exposes the first electrode and a second exposure hole exposes the second electrode, the first exposure hole is larger than each of the electrodes;

the step of forming the conductive member includes;

forming a conductor inside the first exposure hole of the insulative layer in order to electrically connect with the first electrode of the LED die;

the step of arranging the reverse-voltage protection member includes;

disposing an auxiliary LED die on the reverse-voltage protection member, wherein the auxiliary LED die includes a first surface, the second surface opposite to the first surface, a first auxiliary electrode disposed on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the second auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the step after arranging the reverse-voltage protection member includes;

forming an opaque first protective layer on the insulative layer and an opaque second protective layer on the opaque first protective layer, wherein the opaque first protective layer has three auxiliary through holes exposing the first auxiliary electrode of the auxiliary LED die, the second electrode of the LED die, and the partial portion of the conductive member respectively;

wherein the opaque second protection has a first through hole corresponding to one of the auxiliary through holes, which reveals the partial portion of the conductor, in order to electrically connect with the partial portion of the conductor; and

a second through hole communicating with the other auxiliary through holes;

the step of forming the conductive member includes;

forming a conductor inside a respective one of the auxiliary through holes of the first protective layer and the first through hole of the second protective layer in order to electrically connect with the partial portion of the conductor, and another conductor inside the other auxiliary through holes of the first protective layer and the second through hole of the second protective layer for the second electrode of the LED die to electrically connect to the first auxiliary electrode of the auxiliary LED die;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the second protective layer, wherein the opaque enclosing layer has two openings communicating with the respective first and the second through holes for exposing the respective conductors; and

the step of forming the two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the respective conductor and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

40. The method as claimed in claim 1, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die;

the step after providing the LED die includes;

forming an opaque insulative layer on the non-light-emitting surface of the LED die, wherein the opaque insulative layer has a first exposure hole exposes the first electrode and a second exposure hole exposes the second electrode, the first exposure hole is larger than each of the electrodes;

the step of forming the conductive member includes;

forming a conductor inside the first exposure hole of the insulative layer in order to electrically connect with the first electrode of the LED die;

the step of arranging the reverse-voltage protection member includes;

disposing an Zener diode on the reverse-voltage protection member, wherein the Zener diode includes a first surface, and the second surface is opposite to the first surface, the Zener diode further includes a first auxiliary electrode disposed on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the second auxiliary electrode of the Zener diode is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the second surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the step after arranging the reverse-voltage protection member includes;

forming a first protective layer on the insulative layer and a second protective layer on the first protective layer, wherein the opaque first protective layer has three auxiliary through holes exposing the first auxiliary electrode of the Zener diode, the second electrode of the LED die, and the partial portion of the conductive member respectively;

wherein the second protection has a first through hole corresponding to a respective one of the auxiliary through hole, which reveals the partial portion of the conductor, in order to electrically connect with the partial portion of the conductor; and

a second through hole communicating with the other auxiliary through holes;

the step of forming the conductive member includes;

forming a conductor inside a respective one of the auxiliary through holes of the first protective layer and the first through hole of the second protective layer in order to electrically connect with the partial portion of the conductor, and another conductor inside the other auxiliary through holes of the first protective layer and the second through hole of the second protective layer for the second electrode of the LED die to electrically connect to the first auxiliary electrode of the Zener diode;

the step before forming the two outer conductive members includes;

forming an enclosing layer over the second protective layer, wherein the enclosing layer has two openings communicating with the respective first and the second through holes for exposing the respective conductors; and

the step of forming the two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the respective conductor and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

41. The method as claimed in claim 39, wherein the step of forming the conductive member includes:

forming the conductors by printing a conductive paste.

42. The method as claimed in claim 40, wherein the step of forming the conductive member includes:

forming the conductors by printing a conductive paste.

43. The method as claimed in claim 39, wherein the step of forming the conductive member includes:

forming the conductors by sputtering a metallic material.

44. The method as claimed in claim 40, wherein the step of forming the conductive member includes:

forming the conductors by sputtering a metallic material.

45. The method as claimed in claim 39, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

46. The method as claimed in claim 40, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

47. The method as claimed in claim 39, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

48. The method as claimed in claim 40, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

49. The method as claimed in claim 39, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

50. The method as claimed in claim 40, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

51. A method for producing an LED package, comprising:

providing an LED die that illuminates when it is excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner;

arranging a reverse-voltage protection member on the non-light-emitting surface of the LED die, wherein the reverse-voltage protection member has a first pole area and a second pole area aligned with the first and the second electrodes of the LED die respectively;

wherein the first pole area acts as the first polarity and the second pole area acts as the second polarity;

both the first and the second pole area have a through hole that exposes the respective electrode, whose polarity is opposite to the pole area; and

forming two outer conductive members electrically connecting the electrodes to an exterior circuit.

52. The method as claimed in claim 51, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die

the step of arranging the reverse-voltage protection member includes;

the reverse-voltage protection member is an auxiliary LED die; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective through hole and electrically connects to the respective electrode of the LED die and the respective pole area of the auxiliary LED die, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective through hole.

53. The method as claimed in claim 52, wherein

the step of providing the LED die includes:

arranging the first and the second electrodes on the non-light-emitting surface of the LED die

the step of arranging the reverse-voltage protection member includes;

the reverse-voltage protection member is a Zener diode; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective through hole and electrically connects to the partial portion of the first conductive portion and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective through hole.

54. The method as claimed in claim 51, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

55. The method as claimed in claim 52, wherein the step after forming the conductive member includes:

forming an auxiliary conductive member over the conductive member.

56. The method as claimed in claim 51, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

57. The method as claimed in claim 52, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

58. The method as claimed in claim 51, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

59. The method as claimed in claim 52, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

60. A method for producing an LED package, comprising:

providing an LED die that illuminates when it is excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the selected surface that is arranged with the first electrode;

arranging a reverse-voltage protection member on the non-light-emitting surface of the LED die, wherein the reverse-voltage protection member is a capacitor, which includes two poles extending around the electrodes of the LED die respectively, and being opposite to each other;

forming an insulative layer, on an electrode installation surface of the LED die, wherein the insulative layer is defined with two exposure holes by an exposing and developing process, the two through holes expose a respective one of the electrodes of the LED die and the respective pole of the reverse-voltage protection member extend around the electrode of the LED die;

forming a conductive member electrically that includes two conductors, for electrically connecting the respective electrodes of the LED die to the respective poles of the reverse-voltage protection member;

wherein the two conductors are disposed inside the respective through holes for electrically connecting the respective electrodes of the LED die to the respective poles of the reverse-voltage protection member;

forming an enclosing layer over the protective layer of the LED die, wherein the enclosing layer has two openings for exposing the conductors; and

forming at least two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit, wherein each of the two outer conductive members has a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

61. The method as claimed in claim 60, wherein the steps of providing the LED die and of forming the conductive member includes:

forming an auxiliary conductive member over each conductor of the conductive member.

62. The method as claimed in claim 60, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using the same metallic materials.

63. The method as claimed in claim 60, wherein the step of forming two outer conductive members includes:

arranging the first and second conductive portions using different metallic materials.

64. A method for producing an LED package, comprising:

providing an LED die that illuminates when it is excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the non-light-emitting surface, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the non-light-emitting surface;

forming a conductive member, which has a transparent conductive layer on the first electrode of the non-light-emitting surface of the LED die and an adjacent area near the first electrode;

arranging an auxiliary LED die on the transparent conductive layer, wherein the auxiliary LED die includes a first surface, a second surface opposite to the first surface, a first auxiliary electrode disposed on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary LED die is disposed on the transparent conductive layer while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die, so that the second auxiliary electrode of the auxiliary LED die electrically connects to the first electrode of the LED die via the conductive layer;

forming an opaque enclosing layer on the non-light-emitting surface of the LED die for covering the auxiliary LED die, wherein the enclosing layer has two openings exposing the second electrode of the LED die and the first auxiliary electrode of the auxiliary LED die; and

disposing an outer conductive member inside each of the openings;

wherein the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the respective electrodes, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

65. A method for producing an LED package, comprising:

providing an LED die that illuminates when it is excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the non-light-emitting surface, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the non-light-emitting surface;

arranging an auxiliary LED die on the non-light-emitting surface of the LED die, wherein the auxiliary LED die which acts as a first pole that is the first polarity and a second pole that is the second polarity;

forming a conductive member electrically connecting at least one of the electrodes of the LED die and a respective one of the poles of the auxiliary LED die, wherein the polarity of the respective pole of the auxiliary LED die is the same as that of the electrode of the LED die; and

forming two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit.

66. The method as claimed in claim 65, wherein

the step of providing the LED die includes:

forming an insulative layer, on the LED die, that has two exposure holes exposing the electrodes respectively, and a protective layer, on the insulative layer, that has two through holes corresponding to the two exposure holes one to one for communication, wherein each of the through holes is larger than the respective exposure hole;

the step of arranging the auxiliary LED die includes;

forming an auxiliary insulative layer on a second surface of the auxiliary LED die and an auxiliary protective layer on the auxiliary insulative layer, wherein the auxiliary LED die includes a first surface, the second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary insulative layer has two auxiliary exposure holes exposing the auxiliary electrodes respectively, and the auxiliary protective layer has two auxiliary through holes corresponding to the two auxiliary exposure holes one to one for communication;

each of the auxiliary through holes is larger than the respective auxiliary exposure hole;

wherein the auxiliary LED die is disposed on the protective layer of the LED die while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the through hole of the LED die is larger than the auxiliary through hole;

the step of forming the conductive member includes;

forming a plurality of conductors of the conductive member inside the through hole and the respective exposure hole in order to electrically connect to the respective electrode;

the first electrode of the LED die electrically connects with the first auxiliary electrode of the auxiliary LED die via the corresponding conductor but the second electrode of the LED die electrically connects with the second auxiliary electrode of the auxiliary LED die via the corresponding conductor, while the auxiliary LED die is disposed on the protective layer of the LED die;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the protective layer of the LED die, wherein the opaque enclosing layer covers the auxiliary LED die and has two openings corresponding to the through holes of the protective layer of the LED die respectively for exposing a partial portion of the conductors formed inside the through holes respectively; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

67. The method as claimed in claim 65, wherein

the step of providing the auxiliary LED die includes:

arranging the auxiliary LED die on the on the non-light-emitting surface of the LED die while a first surface of the auxiliary LED die is arranged under the non-light-emitting surface, the auxiliary LED die faces the non-light-emitting surface of the LED die, wherein the auxiliary LED die includes a first auxiliary electrode arranged on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary LED die has a first surface, and the second surface is opposite to the first surface;

the step after arranging the auxiliary LED die includes;

forming an insulative layer on the non-light-emitting surface of the LED die, and a protective layer on the insulative layer, wherein the insulative layer has a plurality of exposure holes exposing the corresponding electrodes of the LED die and the auxiliary LED die, and the protective layer has two through holes communicating with the exposure holes for electrically concocting two electrodes, one electrode acts as the LED die, the other electrode acts as the auxiliary LED die and has the same polarity as that of the prior one;

the step of forming the conductive member includes;

arranging two conductors of the conductive member;

wherein each of the two conductors includes a first portion that is disposed inside the respective exposure hole to electrically connect with the respective electrode of the LED die, a second portion that is disposed inside the respective through hole that communicates with the exposure hole of the insulative layer receiving the first portion to electrically connect with the first portion, and a third portion that is disposed inside the respective exposure hole that communicates with the through hole receiving the second portion in order to electrically connect with the two auxiliary electrodes of the auxiliary LED die and the second portion;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the protective layer of the LED die, wherein the opaque enclosing layer has two openings for exposing the second portion of the conductor; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

68. The method as claimed in claim 65, wherein

the step after providing the LED die includes:

forming an insulative layer on the non-light-emitting surface of the LED die, wherein the insulative layer has two exposure holes exposing the electrodes respectively, each of the exposure holes is larger than the respective electrode;

the step of forming the conductive member includes;

arranging two conductors inside the respective exposure holes in order to electrically connect with the respective electrodes of the LED die;

the step of arranging the auxiliary LED die includes;

arranging an auxiliary LED die, having a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, wherein the first auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

but the second auxiliary electrode of the auxiliary LED die is electrically connected with the second electrode of the LED die via the other one of the conductors;

the step after arranging the reverse-voltage protection member includes;

forming an opaque enclosing layer over the insulative layer, wherein the opaque enclosing layer has two openings for exposing a partial portion of the respective conductor; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

69. The method as claimed in claim 65, wherein the

the step after providing the LED die includes:

forming an insulative layer on the non-light-emitting surface of the LED die, wherein the insulative layer has a first exposure hole exposing the first electrode of the LED die and a second exposure hole exposing the second electrode of the LED die, the first exposure hole is larger than each of the electrodes of the LED die;

the step of forming the conductive member includes;

forming a conductor inside the first exposure hole of the insulative layer in order to electrically connect with the first electrode of the LED die;

the step of arranging the auxiliary LED die includes;

arranging an auxiliary LED die having a first surface, a second surface opposite to the first surface, a first auxiliary electrode arranged on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the first auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the first surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the step after arranging the auxiliary LED die includes;

forming a first protective layer on the insulative layer and a second protective layer on the first protective layer, wherein the first protective layer has three auxiliary through holes exposing the second auxiliary electrode of the auxiliary LED die, the second electrode of the LED die, and the partial portion of the conductive member, respectively;

wherein the second protection has a first through hole corresponding to a respective one of the auxiliary through hole, which reveals the partial portion of the conductor, of the first protective layer in order to electrically connect with the partial portion of the conductive member; and

a second through hole communicating with the other auxiliary through holes of the first protection payer;

the step of forming the conductive member includes;

forming a conductor inside a respective one of the auxiliary through holes of the first protective layer and the first through hole of the second protective layer in order to electrically connect with the partial portion of the conductor, and another conductor inside the other auxiliary through holes of the first protective layer and the second through hole of the second protective layer for the second electrode of the LED die to electrically connect to the first auxiliary electrode of the auxiliary LED die;

the step before forming the two outer conductive members includes;

forming an opaque enclosing layer over the second protective layer, wherein the opaque enclosing layer has two openings communicating with the respective first and the second through holes for exposing the respective conductors; and

the step of forming two outer conductive members includes;

arranging a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

70. A method for producing an LED package, comprising:

providing an LED die that illuminates when it is excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner;

arranging an auxiliary LED die on the non-light-emitting surface of the LED die, wherein the auxiliary LED die which acts as a first pole area and a second pole area are aligned with the first and the second electrodes of the LED die respectively;

the first pole area acts as the first polarity and the second pole area acts as the second polarity, both the first and the second pole area have a through hole that exposes the respective electrode, whose polarity is the same as the pole area; and

forming at least two outer conductive members electrically connecting the electrodes to an exterior circuit, wherein each of the outer conductive members which act as a first conductive portion and electrically connects with the respective electrode of the LED die and the respective pole area of the auxiliary LED die, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

71. An LED package, comprising:

an LED die that illuminates when excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner;

a reverse-voltage protection member arranged on the non-light-emitting surface of the LED die, wherein the reverse-voltage protection member has a first pole that is the first polarity and a second pole that is the second polarity;

a conductive member electrically connecting at least one of the electrodes of the LED die and a respective one of the poles of the reverse-voltage protection member, wherein the polarity of each pole of the reverse-voltage protection member is opposite to that of the electrode of the LED die; and

two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit.

72. The LED package as claimed in claim 71, furthering including an auxiliary conductive layer formed on each electrode of the LED die.

73. The LED package as claimed in claim 71,

further including an opaque insulative layer formed on the non-light-emitting surface of the LED die and an opaque protective layer formed on the opaque insulative layer;

wherein the first and second electrode are arranged on the non-light-emitting surface of the LED die, the opaque insulative layer has two exposure holes exposing the electrodes respectively, and the opaque protective layer has two through holes corresponding to the two exposure holes one to one for communication, wherein each of the through holes is larger than the respective exposure hole;

further including an auxiliary opaque insulative layer formed on a second surface of the reverse-voltage protection member and an auxiliary opaque protective layer formed on the auxiliary opaque insulative layer, wherein the reverse-voltage protection member has an auxiliary LED die including a first surface, the second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary opaque insulative layer has two auxiliary exposure holes exposing the auxiliary electrodes respectively, and the auxiliary opaque protective layer has two auxiliary through holes corresponding to the two auxiliary exposure holes one to one for communication;

each of the auxiliary through holes is larger than the respective auxiliary exposure hole;

wherein the auxiliary LED die is disposed on the opaque protective layer of the LED die while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the through hole of the LED die of the LED die is larger than the auxiliary through hole of the auxiliary LED die;

wherein the conductive member has a plurality of conductors inside a respective one of the through holes and the corresponding exposure hole in order to electrically connect to the respective electrode;

wherein the first electrode of the LED die electrically connects with the second auxiliary electrode of the auxiliary LED die via a respective one of the conductors but the second electrode of the LED die electrically connects with the first auxiliary electrode of the auxiliary LED die via a respective one of the conductors, while the auxiliary LED die is disposed on the opaque protective layer of the LED die;

further including an opaque enclosing layer formed over the opaque protective layer of the LED die, wherein the opaque enclosing layer covers the auxiliary LED die and has two openings corresponding to the through holes of the opaque protective layer of the LED die respectively for exposing a partial portion of the conductors formed inside the through holes respectively; and

wherein each outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

74. The LED package as claimed in claim 71,

further including an opaque insulative layer formed on the non-light-emitting surface of the LED die and an opaque protective layer formed on the opaque insulative layer;

wherein the first and second electrode are arranged on the non-light-emitting surface of the LED die, the opaque insulative layer has two exposure holes exposing the electrodes respectively, and the opaque protective layer has two through holes corresponding to the two exposure holes one to one for communication, wherein each of the through holes is larger than the respective exposure hole;

further including an auxiliary insulative layer formed on a second surface of the reverse-voltage protection member and an auxiliary protective layer formed on the auxiliary insulative layer, wherein the reverse-voltage protection member has an Zener diode including a first surface, the second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary insulative layer has two auxiliary exposure holes exposing the auxiliary electrodes respectively, and the auxiliary protective layer has two auxiliary through holes corresponding to the two auxiliary exposure holes one to one for communication;

each of the auxiliary through holes is larger than the respective auxiliary exposure hole;

wherein the Zener diode is disposed on the protective layer of the LED die while the second surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the through hole of the LED die of the LED die is larger than the auxiliary through hole of the Zener diode;

wherein the conductive member has a plurality of conductors inside a respective one of the through holes and the corresponding exposure hole in order to electrically connect to the respective electrode;

wherein the first electrode of the LED die electrically connects with the second auxiliary electrode of the Zener diode via a respective one of the conductors but the second electrode of the LED die electrically connects with the first auxiliary electrode of the Zener diode via a respective one of the conductors, while the Zener diode is disposed on the protective layer of the LED die;

further including an enclosing layer formed over the protective layer of the LED die, wherein the enclosing layer covers the Zener diode and has two openings corresponding to the through holes of the opaque protective layer of the LED die respectively for exposing a partial portion of the conductors formed inside the through holes respectively; and

wherein each outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

75. The LED package as claimed in claim 71,

wherein the first and the second electrodes are disposed on the non-light-emitting surface of the LED die;

wherein the reverse-voltage protection member includes an auxiliary LED die, which has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the auxiliary LED die is disposed on the non-light-emitting surface of the LED die while the first surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

further including an opaque insulative layer formed on the non-light-emitting surface of the LED die, and an opaque protective layer formed on the opaque insulative layer, wherein the opaque insulative layer has a plurality of exposure holes exposing the corresponding electrodes of the LED die and the auxiliary LED die, and the opaque protective layer has two through holes communicating with the respective exposure holes for electrically connecting two electrodes, one electrode acts as the LED die, the other electrode acts as the auxiliary LED die and has polarity opposite to that of the other one;

wherein the conductive member includes two conductors;

wherein each of the two conductors includes a first portion that is disposed inside the respective exposure hole to electrically connect with the respective electrode of the LED die, a second portion that is disposed inside the respective through hole that communicates with the exposure hole of the insulative layer receiving the first portion to electrically connect with the first portion, and a third portion that is disposed inside the respective exposure hole that communicates with the through hole receiving the second portion in order to electrically connect with the respective auxiliary electrode of the auxiliary LED die and the second portion;

further including an opaque enclosing layer formed over the opaque protective layer of the LED die, wherein the opaque enclosing layer has two openings for exposing the second portion of the conductor; and

wherein each of the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

76. The LED package as claimed in claim 71,

wherein the first and the second electrodes are disposed on the non-light-emitting surface of the LED die;

wherein the reverse-voltage protection member includes an Zener diode, which has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the Zener diode is disposed on the non-light-emitting surface of the LED die while the first surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

further including an insulative layer formed on the non-light-emitting surface of the LED die, and a protective layer formed on the insulative layer, wherein the insulative layer has a plurality of exposure holes exposing the corresponding electrodes of the LED die and the Zener diode, and the protective layer has two through holes communicating with the respective exposure holes for electrically connecting two electrodes, one electrode acts as the LED die, the other electrode is a Zener diode and has polarity opposite to that of the other one;

wherein the conductive member includes two conductors;

wherein each of the two conductors includes a first portion that is disposed inside the respective exposure hole to electrically connect with the respective electrode of the LED die, a second portion that is disposed inside the respective through hole that communicates with the exposure hole of the insulative layer receiving the first portion to electrically connect with the first portion, and a third portion that is disposed inside the respective exposure hole that communicates with the through hole receiving the second portion in order to electrically connect with the respective auxiliary electrode of the Zener diode and the second portion;

further including an enclosing layer formed over the protective layer of the LED die, wherein the enclosing layer has two openings for exposing the second portion of the conductor; and

wherein each of the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

77. The LED package as claimed in claim 71,

wherein the first and the second electrodes are disposed on the non-light-emitting surface of the LED die;

further including an opaque insulative layer formed on the non-light-emitting surface of the LED die, wherein the opaque insulative layer has two exposure holes exposing the electrodes respectively, each of the exposure holes is larger than the respective electrode;

wherein the conductive member includes two conductors inside the respective exposure holes in order to electrically connect with the respective electrodes of the LED die;

wherein the reverse-voltage protection member includes an auxiliary LED die, which has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the first auxiliary electrode of the auxiliary LED die is electrically connected with the second electrode of the LED die via a respective one of the conductors, while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

but the second auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via the other one of the conductors;

further including an opaque enclosing layer formed over the insulative layer, wherein the opaque enclosing layer has two openings for exposing a partial portion of the respective conductor; and

wherein each of the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

78. The LED package as claimed in claim 71,

wherein the first and the second electrodes are disposed on the non-light-emitting surface of the LED die;

further including an insulative layer formed on the non-light-emitting surface of the LED die, wherein the insulative layer has two exposure holes exposing the electrodes respectively, each of the exposure holes is larger than the respective electrode;

wherein the conductive member includes two conductors inside the respective exposure holes in order to electrically connect with the respective electrodes of the LED die;

wherein the reverse-voltage protection member includes a Zener diode, which has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, the first auxiliary electrode of the Zener diode is electrically connected with the second electrode of the LED die via a respective one of the conductors, while the second surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

but the second auxiliary electrode of the Zener diode is electrically connected with the first electrode of the LED die via the other one of the conductors;

further including an enclosing layer formed over the insulative layer, wherein the enclosing layer has two openings for exposing a partial portion of the respective conductor; and

wherein each of the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

79. The LED package as claimed in claim 71,

wherein the first and the second electrodes are arranged on the non-light-emitting surface of the LED die;

further including an opaque insulative layer formed on the non-light-emitting surface of the LED die, wherein the opaque insulative layer which has a first exposure hole exposing the first electrode and a second exposure hole exposing the second electrode, the first exposure hole is larger than each of the electrodes;

wherein the conductive member includes a conductor arranged inside the first exposure hole of the insulative layer in order to electrically connect with the first electrode of the LED die;

wherein the reverse-voltage protection member includes an auxiliary LED die, which includes a first surface, a second surface opposite to the first surface, a first auxiliary electrode disposed on the first surface, and a second auxiliary electrode arranged on the second surface, wherein the second auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

further including an opaque first protective layer formed on the insulative layer and an opaque second protective layer formed on the opaque first protective layer, wherein the opaque first protective layer has three auxiliary through holes exposing the first auxiliary electrode of the auxiliary LED die, the second electrode of the LED die, and the partial portion of the conductive member respectively;

wherein the opaque second protection has a first through hole corresponding to a respective one of the auxiliary through holes, which reveals the partial portion of the conductor, in order to electrically connect with the partial portion of the conductor; and

a second through hole communicating with the other auxiliary through holes;

wherein the conductive member include a conductor arranged inside a respective one of the auxiliary through holes of the first protective layer and the first through hole of the second protective layer in order to electrically connect with the partial portion of the conductor, and another conductor inside the other auxiliary through holes of the first protective layer and the second through hole of the second protective layer for the second electrode of the LED die to electrically connect to the first auxiliary electrode of the auxiliary LED die;

further including an opaque enclosing layer formed over the second protective layer, wherein the opaque enclosing layer has two openings communicating with the respective first and the second through holes for exposing the respective conductors; and

wherein each of the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the respective conductor and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

80. The LED package as claimed in claim 71,

wherein the first and the second electrodes are arranged on the non-light-emitting surface of the LED die;

further including an insulative layer formed on the non-light-emitting surface of the LED die, wherein the insulative layer which acts as a first exposure hole exposes the first electrode and a second exposure hole exposes the second electrode, the first exposure hole is larger than each of the electrodes;

wherein the conductive member includes a conductor arranged inside the first exposure hole of the insulative layer in order to electrically connect with the first electrode of the LED die;

wherein the reverse-voltage protection member includes a Zener diode, which includes a first surface, a second surface opposite to the first surface, a first auxiliary electrode disposed on the first surface, and a second auxiliary electrode arranged on the second surface, wherein the second auxiliary electrode of the Zener diode is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the second surface of the Zener diode is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

further including a first protective layer formed on the insulative layer and a second protective layer formed on the first protective layer, wherein the first protective layer has three auxiliary through holes exposing the first auxiliary electrode of the Zener diode, the second electrode of the LED die, and the partial portion of the conductive member respectively;

wherein the opaque second protection has a first through hole corresponds to a respective one of the auxiliary through hole, which reveals the partial portion of the conductor, in order to electrically connect with the partial portion of the conductor; and

a second through hole communicating with the other auxiliary through holes;

wherein the conductive member includes a conductor arranged inside a respective one of the auxiliary through holes of the first protective layer and the first through hole of the second protective layer in order to electrically connect with the partial portion of the conductor, and another conductor inside the other auxiliary through holes of the first protective layer and the second through hole of the second protective layer for the second electrode of the LED die to electrically connect to the first auxiliary electrode of the Zener diode;

further including an enclosing layer formed over the second protective layer, wherein the enclosing layer has two openings communicating with the respective first and the second through holes for exposing the respective conductors; and

wherein each of the outer conductive members include a first conductive portion that is disposed inside the respective opening and electrically connects to the respective conductor and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

81. An LED package, comprising:

an LED die that illuminates when excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner;

a reverse-voltage protection member arranged on the non-light-emitting surface of the LED die, and having a first pole area and a second pole area aligned with the first and the second electrodes of the LED die respectively;

the first pole area acts as the first polarity and the second pole area acts as the second polarity;

both the first and the second pole area have a through hole that exposes the respective electrode, whose polarity is opposite to the pole area; and

two outer conductive members electrically connecting the electrodes to an exterior circuit.

82. The LED package as claimed in claim 81,

wherein the first and the second electrodes are arranged on the non-light-emitting surface of the LED die;

wherein the reverse-voltage protection member is an auxiliary LED die; and

wherein each of the conductor includes a first conductive portion that is disposed inside the respective through hole and electrically connects to the respective electrode of the LED die and the respective pole area of the auxiliary LED die, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective through hole.

83. The LED package as claimed in claim 81,

wherein the first and the second electrodes are arranged on the non-light-emitting surface of the LED die;

wherein the reverse-voltage protection member is a Zener diode; and

wherein each of the conductor includes a first conductive portion that is disposed inside the respective through hole and electrically connects to the respective electrode of the LED die and the respective pole area of the Zener diode, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective through hole.

84. An LED package, comprising:

an LED die that illuminates when excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the selected surface that is arranged with the first electrode;

a reverse-voltage protection member arranged on the non-light-emitting surface of the LED die, wherein the reverse-voltage protection member is a capacitor, which includes two poles extending around the electrodes of the LED die respectively, and being opposite to each other;

an insulative layer formed on an electrode installation surface of the LED die, wherein the insulative layer is defined with two exposure holes by an exposing and developing process, the two through holes expose a respective one of the electrodes of the LED die and the respective pole of the reverse-voltage protection member extends around the electrode of the LED die;

a conductive member including two conductors, wherein the two conductors are disposed inside the respective through holes for electrically connecting the respective electrodes of the LED die to the respective poles of the reverse-voltage protection member;

an enclosing layer formed over the protective layer of the LED die, wherein the enclosing layer has two openings for exposing the conductors; and

at least two outer conductive members, wherein each of the two outer conductive members has a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

85. An LED package, comprising:

an LED die that illuminates when excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the non-light-emitting surface, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the non-light-emitting surface;

a conductive member having a transparent conductive layer on the first electrode of the non-light-emitting surface of the LED die and an adjacent area near the first electrode;

an auxiliary LED die disposed on the transparent conductive layer, wherein the auxiliary LED die includes a first surface, a second surface opposite to the first surface, a first auxiliary electrode disposed on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary LED die is disposed on the transparent conductive layer while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die, so that the second auxiliary electrode of the auxiliary LED die electrically connects to the first electrode of the LED die via the conductive layer;

an opaque enclosing layer formed on the non-light-emitting surface of the LED die for covering the auxiliary LED die, wherein the enclosing layer has two openings exposing the second electrode of the LED die and the first auxiliary electrode of the auxiliary LED die; and

an outer conductive member arranged inside each of the openings;

wherein the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the respective electrodes, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

86. An LED package, comprising:

an LED die that illuminates when excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the non-light-emitting surface, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the non-light-emitting surface;

an auxiliary LED die disposed on the non-light-emitting surface of the LED die, wherein the auxiliary LED die has a first pole that is the first polarity and a second pole that is the second polarity;

a conductive member electrically connecting at least one of the electrodes of the LED die and a respective one of the poles of the auxiliary LED die, wherein the polarity of the respective pole of the auxiliary LED die is the same as that of the electrode of the LED die; and

two outer conductive members electrically connecting the selected electrode or pole to an exterior circuit.

87. The LED package as claimed in claim 86,

further including an insulative layer formed on the LED die and an protective layer formed on the insulative layer, wherein the insulative layer has two exposure holes exposing the electrodes respectively, and the protective layer has two through holes corresponding to the two exposure holes one to one for communication, wherein each of the through holes is larger than the respective exposure hole;

further including an auxiliary insulative layer on a second surface of the auxiliary LED die and an auxiliary protective layer on the auxiliary insulative layer, wherein the auxiliary LED die includes a first surface, the second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary insulative layer has two auxiliary exposure holes exposing the auxiliary electrodes respectively, and the auxiliary protective layer has two auxiliary through holes corresponding to the two auxiliary exposure holes one to one for communication;

each of the auxiliary through holes is larger than the respective auxiliary exposure hole;

wherein the auxiliary LED die is disposed on the protective layer of the LED die while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

the through hole of the LED die is larger than the auxiliary through hole;

wherein the conductive member includes a plurality of conductors inside a respective one of the respective through holes and a respective one of the exposure holes in order to electrically connect to the respective electrodes;

the first electrode of the LED die electrically connects with the first auxiliary electrode of the auxiliary LED die via the corresponding conductor but the second electrode of the LED die electrically connects with the second auxiliary electrode of the auxiliary LED die via the corresponding conductor, while the auxiliary LED die is disposed on the protective layer of the LED die;

further including an opaque enclosing layer formed over the protective layer of the LED die, wherein the opaque enclosing layer covers the auxiliary LED die and has two openings corresponding to the through holes of the protective layer of the LED die respectively for exposing a partial portion of the conductors formed inside the through holes respectively; and

wherein each of the two outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the corresponding conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

88. The LED package as claimed in claim 86,

wherein the auxiliary LED die is disposed on the on the non-light-emitting surface of the LED die while a first surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die, a first auxiliary electrode arranged on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the auxiliary LED die has a first surface, the second surface opposite to the first surface;

further including an insulative layer formed on the non-light-emitting surface of the LED die and a protective layer formed on the insulative layer, wherein the insulative layer has a plurality of exposure holes exposing the corresponding electrodes of the LED die and the auxiliary LED die, and the protective layer has two through holes communicating with the exposure holes for electrically concocting two electrodes, one electrode acts as the LED die, the other electrode acts as the auxiliary LED die and has the same polarity as that of the prior pole;

wherein the conductive member has two conductors;

wherein each of the two conductors includes a first portion that is disposed inside the respective exposure hole to electrically connect with the respective electrode of the LED die, a second portion that is disposed inside the respective through hole that communicates with the exposure hole of the insulative layer receiving the first portion to electrically connect with the first portion, and a third portion that is disposed inside the respective exposure hole that communicates with the through hole receiving the second portion in order to electrically connect with the two auxiliary electrodes of the auxiliary LED die and the second portion;

further including an opaque enclosing layer formed over the protective layer of the LED die, wherein the opaque enclosing layer has two openings for exposing the second portion of the conductor; and

wherein each of the two outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

89. The LED package as claimed in claim 86,

further including an insulative layer formed on the non-light-emitting surface of the LED die, wherein the insulative layer has two exposure holes exposing the electrodes respectively, each of the exposure holes is larger than the respective electrode;

wherein the conductive member includes two conductors inside the respective exposure holes in order to electrically connect with the respective electrodes of the LED die;

wherein the auxiliary LED die has a first surface, a second surface opposite to the first surface, and a first and a second auxiliary electrode arranged on the second surface, wherein the first auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the second surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

but the second auxiliary electrode of the auxiliary LED die is electrically connected with the second electrode of the LED die via the other one of the conductors;

further including an opaque enclosing layer formed over the insulative layer, wherein the opaque enclosing layer has two openings for exposing a partial portion of the respective conductor; and

wherein each of the outer conductive member includes a first conductive portion that is disposed inside the respective opening and electrically connects to the partial portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

90. The LED package as claimed in claim 86,

further including an insulative layer formed on the non-light-emitting surface of the LED die, wherein the insulative layer which acts as a first exposure hole exposes the first electrode of the LED die and a second exposure hole exposes the second electrode of the LED die, the first exposure hole is larger than each of the electrodes of the LED die;

wherein the conductive member includes a conductor arranged inside the first exposure hole of the insulative layer in order to electrically connect with the first electrode of the LED die;

wherein the auxiliary LED die has a first surface, a second surface opposite to the first surface, a first auxiliary electrode arranged on the first surface, and a second auxiliary electrode arranged on the second surface;

wherein the first auxiliary electrode of the auxiliary LED die is electrically connected with the first electrode of the LED die via a respective one of the conductors, while the first surface of the auxiliary LED die is arranged under the non-light-emitting surface, and faces the non-light-emitting surface of the LED die;

further including a first protective layer formed on the insulative layer and a second protective layer formed on the first protective layer, wherein the first protective layer has three auxiliary through holes exposing the second auxiliary electrode of the auxiliary LED die, the second electrode of the LED die, and the partial portion of the conductive member, respectively;

wherein the second protection has a first through hole corresponding to a respective one of the auxiliary through hole, which reveals the partial portion of the conductor, of the first protective layer in order to electrically connect with the partial portion of the conductive member; and

a second through hole communicating with the other auxiliary through holes of the first protection payer;

further including a conductor arranged inside a respective one of the auxiliary through holes of the first protective layer and the first through hole of the second protective layer in order to electrically connect with the partial portion of the conductor, and another conductor inside the other auxiliary through holes of the first protective layer and the second through hole of the second protective layer for the second electrode of the LED die to electrically connect to the first auxiliary electrode of the auxiliary LED die;

further including an opaque enclosing layer formed over the second protective layer, wherein the opaque enclosing layer has two openings communicating with the respective first and the second through holes for exposing the respective conductors; and

wherein each of the two outer conductive members includes a first conductive portion that is disposed inside the respective opening and electrically connects to the second portion of the conductor, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.

91. An LED package, comprising:

an LED die that illuminates when excited, wherein the LED die has a light-emitting surface, a non-light-emitting surface opposite to the light-emitting surface, a first electrode, which acts as a first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner, and a second electrode, which acts as a second polarity that is opposite to the first polarity, arranged on the light-emitting surface and the non-light-emitting surface in an alternative manner;

an auxiliary LED die arranged on the non-light-emitting surface of the LED die, wherein the auxiliary LED die which acts as a first pole area and a second pole area are aligned with the first and the second electrodes of the LED die respectively;

the first pole area acts as the first polarity and the second pole area acts as the second polarity, both the first and the second pole area have a through hole that exposes the respective electrode, whose polarity is the same as the pole area; and

at least two outer conductive members electrically connecting the electrodes to an exterior circuit, wherein each of the outer conductive member acts as a first conductive portion that electrically connects with the respective electrode of the LED die and the respective pole area of the auxiliary LED die, and a second conductive portion that electrically connects to the first conductive portion and protrudes outwardly from the respective opening.