Low cost fabrication of microelectrode arrays for cell-based biosensors and drug discovery methods

• US 20060057771A1
• Filed: 03/10/2005
• Published: 03/16/2006
• Est. Priority Date: 03/10/2004
• Status: Active Grant

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford University)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford University)
• Inventors: Giovangrandi, Laurent, Kovacs, Gregory T.A.
• Granted Patent: US 7,501,301 B2
• Time in Patent Office: Days
• US Class Current: 438/106
• CPC Class Codes: G01N 33/4836 using multielectrode arrays
• CPC Class Codes: H05K 1/0212 Printed circuits or mounted components having integral heating means
• CPC Class Codes: H05K 3/0052 Depaneling, i.e. dividing a panel into circuit boards; Working of the edges of circuit boards
• CPC Class Codes: H05K 3/281 by means of a preformed insulating foil H05K3/284 takes precedence

Abstract

A method for making a plurality of low-cost microelectrode arrays (MEAs) on one substrate utilizing certain unmodified printed circuit board (PCB) fabrication processes and selected materials. In some embodiments, a MEA device is composed of a thin polymer substrate containing patterned conductive traces. Coverlays on both sides of the substrate insulate the conductive traces and defines the electrodes. Preferably, flexible PCB technology is utilized to simultaneously define the microelectrode arrays. In an embodiment, the sensor is an integrated temperature sensor/heater in which the MEA device operates to record extracellular electrical signals from electrically active cell cultures. The present invention enables economical and efficient mass production of MEA devices, making them particularly suitable for disposable applications such as drug discovery, biosensors, etc.

Claims

1. A method of fabricating a plurality of microelectrode array (MEA) devices simultaneously, each MEA device having a MEA and at least one sensor, said method comprising:

providing a substrate; and

simultaneously defining a plurality of MEAs and sensors on said substrate utilizing a selected printed circuit board (PCB) fabrication process;

wherein

said substrate is characterized as flexible or rigid; and

wherein

said device is useful for biological applications including recording of electrically active cell cultures, stimulation of electrically active and non-active cell cultures, and impedance measurement of electrically active and non-active cell cultures.

2. A biosensor device made by the method of claim 1.

3. The method of claim 1, wherein

said substrate is made of a material selected from the group consisting of polymer, polyimide, liquid crystal polymer, polyester, polyethylene naphtalate, and polytetrafluoroethylene.

4. The method of claim 1, wherein

said substrate contains conductive traces on one or both sides thereof.

5. The method of claim 1, wherein

said sensor is an integrated sensor/actuator, an integrated temperature sensor/heater, a heater, a temperature sensor, a pH sensor, a glucose sensor, a dopamine sensor, an ion selective amperometric sensor, an oxygen sensor, or a combination thereof.

6. The method of claim 1, wherein

said sensor is an integrated temperature sensor and heater;

wherein

said temperature sensor is composed of conductive traces for providing a direct and accurate temperature measurement of said substrate; and

wherein

said heater is composed of conductive traces for providing low-power heating of said substrate in a controlled manner.

7. The method of claim 1, wherein said defining step further comprises the steps of

defining a set of electrodes as oxygen sensor electrodes;

depositing and patterning a solid electrolyte and a passivation layer on said set of electrodes, thereby integrating an oxygen sensor.

8. The method of claim 1, further comprising the step of applying a plurality of metal layers to integrate features and increase routing density.

9. The method of claim 1, wherein said defining step further comprises the steps of

applying coverlays;

and

defining electrodes by laser etching or plasma etching said coverlays.

10. The method of claim 1, wherein said defining step further comprises the steps of

defining openings in coverlays;

and

applying said coverlays.

11. The method of claim 1, wherein said substrate contains patterned conductive traces and wherein said substrate is insulated with coverlays, further comprising the step of

defining electrodes using said conductive traces of minimal line width crossed by perpendicular openings in said coverlays having a minimal line width.

12. The method of claim 1, wherein said substrate is insulated with at least one coverlay having an opening through which electrodes are defined, and wherein said defining step further comprises the step of

utilizing a thermal reflow resulting from melting an adhesive layer between said substrate and said coverlay to reduce size of said opening.

13. The method of claim 1, wherein said substrate is insulated with at least one coverlay, and wherein said defining step further comprises the step of

utilizing a single opening in said coverlay to define multiple electrodes with metal lines, each having a minimal width and being exposed at periphery of said opening.

14. The method of claim 1, wherein said defining step further comprises the step of

drilling a single hole through metal lines deposited on a coverlay and laminated to said substrate such that multiple vertical electrodes are defined at bottom and periphery of said hole and are capable of providing intimate contact with cells or biological tissue;

wherein size of each of said vertical electrodes is defined by a cross-section of a minimal width metal line.

15. The method of claim 1, further comprising the step of

arranging said plurality of MEAs into arrays of MEAs that correspond to a multiwell plate format.

16. The method of claim 15, further comprising the step of

integrating a plurality of wells directly onto said substrate via said PCB fabrication process by defining said wells on coverlays prior to laminating said coverlays onto said substrate.

17. The method of claim 16, further comprising the step of

enabling said wells to share a common culture media having certain chemical and biochemical conditions, thereby allowing simultaneous experiments on electrically and physically independent cultures under said chemical and biochemical conditions.

18. The method of claim 16, further comprising the step of

enabling each of said wells to have an individual culture medium, thereby allowing simultaneous experiments on electrically, physically, and chemically independent cultures.

19. The method of claim 16, further comprising the step of

filling or draining overlying fluid, allowing said wells to transition between fluidically coupled wells to fluidically and electrically isolated wells.

20. The method of claim 16, further comprising the step of

chemically modifying a top surface of a coverlay to prevent cells from growing on said top surface and connecting adjacent wells.

21. The method of claim 1, further comprising the step of

incorporating said device with discrete or integrated circuit electronic components including amplifiers and multiplexers, thereby increasing noise performance and electrode/well density.

22. The method of claim 1, further comprising the step of

plating said MEA with a coating having necessary electrical properties for recording electrical signals from, stimulation to, or impedance measurement of said electrically active cell cultures.