Method and apparatus for vibrational damping of implantable hearing aid components

• US 20060058573A1
• Filed: 09/16/2005
• Published: 03/16/2006
• Est. Priority Date: 09/16/2004
• Status: Abandoned Application

• Current Assignee: Envoy Medical Corporation
• Original Assignee: Envoy Medical Corporation
• Inventors: Neisz, Johann J., Skubitz, Jason J.
• Application Number:
  US11/229,477
• Publication Number:
  US 20060058573A1
• Time in Patent Office: Days
• US Class Current: 600/25
• CPC Class Codes: H04R 25/606 acting directly on the eardrum, the ossicles or the skull, e.g. mastoid, tooth, maxillary or mandibular bone, or mechanically stimulating the cochlea, e.g. at the oval window

Abstract

A method and apparatus for minimizing or eliminating the transmission of vibration away from, as well as induction of vibration into, a middle ear driving or sensing structure of an at least partially implantable hearing aid system. A vibration damping intermediary layer may be positioned between an originating structure and its housing, and/or between a housing and its mounting to the surrounding. The intermediary layer may be formed of a structure having elastic and damping characteristics. The intermediary layer may also have a number of fluid flow paths for absorbing energy and damping vibration.

Claims

1. A driver/sensor assembly for a middle ear implantable hearing aid system, the driver/sensor assembly comprising:

a transducer assembly having a proximal end and a distal end;

a housing disposed adjacent the proximal end of the transducer assembly, the housing adapted to be mounted within a middle ear space; and

a first intermediary layer disposed between the transducer assembly and the housing to couple the housing to the transducer assembly and provide vibrational damping therebetween, the first intermediary layer comprising a vibration damping structure.

2. The driver/sensor assembly of claim 1 further comprising a second intermediary layer disposed on an outer surface of the housing to provide vibrational damping between the housing and the middle ear space, the second intermediary layer comprising a vibration damping structure.

3. The driver/sensor assembly of claim 2 wherein the transducer assembly is a driver adapted to receive an electrical signal and configured to deliver vibrations to an ossicular element of a middle ear.

4. The driver/sensor assembly of claim 2 wherein the transducer assembly is a sensor adapted to receive mechanical vibrations from an auditory element and configured to generate an electrical signal.

5. The driver/sensor assembly of claim 1 wherein the intermediary layer is formed of an aerated medical adhesive.

6. The driver/sensor assembly of claim 1 wherein the intermediary layer is formed of an elastic biocompatible polymer.

7. The driver/sensor assembly of claim 1 wherein the first intermediary layer is formed of a low density polymer.

8. The driver/sensor assembly of claim 7 wherein the low density polymer is a compressible solid.

9. The driver/sensor assembly of claim 7 wherein the low density polymer comprises a plurality of generally spherical elastic balls.

10. The driver/sensor assembly of claim 1 further comprising a damping mass operatively coupled to the housing.

11. The driver/sensor assembly of claim 1 wherein the vibration damping structure comprises a plurality of flow paths adapted to move a fluid to absorb mechanical energy.

12. The driver/sensor assembly of claim 11 wherein the vibration damping structure further comprises a reservoir, and a plurality of chambers adapted to contain a fluid, at least one chamber being in at least partial fluid communication with the reservoir via one or more of the flow paths.

13. The driver/sensor assembly of claim 12 wherein at least one chamber is adapted to respond to a compressive force by moving a fluid contained therein to the reservoir via a flow path.

14. The driver/sensor assembly of claim 12 wherein the plurality of chambers includes front upper, front lower, rear upper, and rear lower chambers.

15. The driver/sensor assembly of claim 12 further comprising at least one seal element disposed in a flow path between a chamber and the reservoir, the seal element being adapted to cause a greater restriction of fluid flow from the chamber to the reservoir than from the reservoir to the chamber.

16. A driver/sensor assembly for a middle ear implantable hearing aid system, the driver/sensor assembly comprising:

a transducer assembly having a proximal end and a distal end;

a housing coupled to the proximal end of the transducer assembly, the housing adapted to be mounted within a middle ear space; and

a first intermediary layer disposed on an outer surface of the housing to provide vibrational damping between the housing and the middle ear space, the first intermediary layer comprising a vibration damping structure.

17. The driver/sensor assembly of claim 16 wherein the first intermediary layer comprises at least one layer of a material having elastic damping properties and at least one layer of an adhesive substance.

18. The driver/sensor assembly of claim 16 wherein the first intermediary layer is a low density polymer.

19. The driver/sensor assembly of claim 18 wherein the low density polymer is a compressible solid.

20. The driver/sensor assembly of claim 18 wherein the low density polymer comprises a plurality of generally spherical elastic balls.

21. The driver/sensor assembly of claim 18 wherein the low density polymer is a hydrogel material.

22. The driver/sensor assembly of claim 21 wherein an inflammatory reactant has been added to the hydrogel material.

23. The driver/sensor assembly of claim 16 further comprising a damping mass operatively coupled to the housing.

24. The driver/sensor assembly of claim 16 wherein the intermediary layer is formed of an aerated medical adhesive.

25. The driver/sensor assembly of claim 16 wherein the intermediary layer is formed of an elastic biocompatible polymer.

26. The driver/sensor assembly of claim 16 further comprising a mounting bracket adapted for attachment to a temporal bone, the mounting bracket coupled to the housing with the first intermediary layer disposed therebetween.

27. The driver/sensor assembly of claim 16 wherein the vibration damping structure comprises a plurality of flow paths adapted to move a fluid to absorb mechanical energy.

28. The driver/sensor assembly of claim 27 wherein the vibration damping structure further comprises a reservoir, and a plurality of chambers adapted to contain a fluid, at least one chamber being in at least partial fluid communication with the reservoir via one or more of the flow paths.

29. The driver/sensor assembly of claim 28 wherein at least one chamber is adapted to respond to a compressive force by moving a fluid contained therein to the reservoir via a flow path.

30. The driver/sensor assembly of claim 28 wherein the plurality of chambers includes front upper, front lower, rear upper, and rear lower chambers.

31. The driver/sensor assembly of claim 28 further comprising at least one seal element disposed in a flow path between a chamber and the reservoir, the seal element being adapted to cause a greater restriction of fluid flow from the chamber to the reservoir than from the reservoir to the chamber.

32. A method of reducing vibrations in a middle ear implantable hearing aid system having transducer assemblies mounted within a middle ear space, the method comprising:

providing a transducer assembly;

providing a housing to support the transducer assembly, the housing adapted to be mounted within a middle ear space; and

forming an intermediary layer on a portion of the housing to provide vibrational damping, the intermediary layer comprising a vibration damping structure.

33. The method of claim 32 wherein the intermediary layer is disposed between the transducer assembly and the housing to couple the housing to the transducer assembly and provide vibrational damping therebetween.

34. The method of claim 32 wherein the intermediary layer is disposed on an outer surface of the housing to provide vibrational damping between the housing and the middle ear space.

35. The method of claim 34 wherein the intermediary layer is formed on an outer surface of the housing prior to mounting the housing in the middle ear space.

36. The method of claim 34 wherein the intermediary layer is formed on an outer surface of the housing during mounting of the housing in the middle ear space.

37. The method of claim 32 wherein the intermediary layer is an aerated material.

38. The method of claim 37 wherein the intermediary layer is an aerated medical adhesive.

39. The method of claim 37 wherein the aerated material is formed using a chemical process.

40. The method of claim 37 wherein the aerated material is formed using a mechanical process.

41. The method of claim 37 wherein the intermediary layer has an elasticity which may be varied to change the frequency response of the vibration damping.

42. The method of claim 41 wherein the elasticity of the intermediary layer may be varied by changing one or more characteristics of the vibration damping structure selected from the group consisting of size, orientation, and amount of air in the aerated material.

43. The method of claim 37 wherein the intermediary layer provides a frequency selective damping response that may be adjusted by varying one or more characteristics of the vibration damping structure selected from the group consisting of size, orientation, and amount of air in the aerated material.

44. The method of claim 43 wherein the intermediary layer is adapted to dampen vibrational energy over a range of frequencies including a resonant frequency of the transducer assembly and housing.

45. A middle ear implantable hearing aid system comprising:

a driver assembly having

a driver transducer assembly having a proximal end and a distal end, the transducer assembly adapted to convert electrical energy to mechanical energy, and

a driver housing disposed adjacent the proximal end of the driver transducer assembly, the driver housing adapted to be mounted within a middle ear space;

a sensor assembly having

a sensor transducer assembly having a proximal end and a distal end, the sensor transducer assembly adapted to convert mechanical energy to electrical energy, and

a sensor housing disposed adjacent the proximal end of the sensor transducer assembly, the sensor housing adapted to be mounted within a middle ear space;

an electronics unit having

a sound processor and a battery, the sound processor adapted to filter and amplify signals from the sensor assembly and provide said signals to the driver assembly; and

leads coupling the driver and sensor assemblies to the electronics unit,

wherein an intermediary layer is disposed on at least one of the sensor housing and driver housing to provide vibrational damping, the intermediary layer comprising a vibration damping structure.

46. The middle ear implantable hearing aid system of claim 45 wherein the intermediary layer is disposed between the transducer assembly and the housing of at least one of the sensor and driver assemblies.

47. The middle ear implantable hearing aid system of claim 45 wherein the intermediary layer is disposed on an outer surface of the housing of at least one of the sensor and driver assemblies.