Installation structure of electronic component for tire

• US 20060059982A1
• Filed: 01/28/2004
• Published: 03/23/2006
• Est. Priority Date: 02/24/2003
• Status: Active Grant

• Current Assignee: Yokohama Rubber Company Limited
• Original Assignee: Yokohama Rubber Company Limited
• Inventors: Shimura, Kazuhiro
• Granted Patent: US 7,347,088 B2
• Time in Patent Office: Days
• US Class Current: 73/146
• CPC Class Codes: B60C 23/0493 for attachment on the tyre
• CPC Class Codes: B60C 23/0498 for rim attachments B60C23/0494, B60C23/0496 take precedence

Abstract

An installation structure of an electronic component for a tire, where the installation structure protects the electronic component from heat produced by a tire and a braking device and enables accurate information about the inside of the tire to be obtained without being affected by the heat sources. In the installation structure, an electronic component housed in a case is installed at an arbitrary installation in the air chamber of a tire and a heat-insulating structure is interposed between the electronic components and the installation position.

Claims

1. An installation structure of an electronic component for a tire, where the electronic component housed in a case is installed at an arbitrary installation position in an air chamber of the tire, characterized in that a heat-insulating structure is interposed between the electronic component and the installation position.

4. The installation structure of an electronic component for a tire according to any of claims 1 to 3, wherein a heat-insulating space is interposed as the heat-insulating structure.

5. The installation structure of an electronic component for a tire according to any of claims 1 to 3, wherein a heat-insulating material is interposed as the heat-insulating structure.

6. The installation structure of an electronic component for a tire according to claim 5, wherein the heat-insulating material is formed of any of resin foam, organic fibers and inorganic fibers.

2. An installation structure of an electronic component for a tire, where an electronic component housed in a case is installed at an arbitrary installation position in an air chamber of the tire, characterized in that a heat-insulating structure is interposed between the case and the installation position.

3. An installation structure of an electronic component for a tire, where an electronic component housed in a case is installed at an arbitrary installation position in an air chamber of the tire, characterized in:

that a pedestal including a base plate part which comes into contact with the installation position, and supporting parts which support the case is used;

that the base plate part of the pedestal is attached to the installation position;

that the case is fixed to the supporting parts of the pedestal; and

that a heat-insulating structure is interposed between the case and the base plate part of the pedestal.

7. The installation structure of an electronic component for a tire according to claim 3, wherein the pedestal is formed of resin of which continuous duty is allowed at temperatures of no less than 80°

C.

8. The installation structure of an electronic component for a tire according to claim 3, wherein a patch which can be bonded to the installation position is integrated with the pedestal.

9. The installation structure of an electronic component for a tire according to claim 8, wherein through holes are provided in the patch at positions corresponding to the supporting parts of the pedestal, and the pedestal is held by the patch while inserting the supporting parts into the through holes.