Methods and apparatuses for electronics cooling

• US 20060060333A1
• Filed: 08/05/2005
• Published: 03/23/2006
• Est. Priority Date: 11/05/2002
• Status: Abandoned Application

• Current Assignee: Brian Moyer, John C. Davis, Lalit Chordia, Robert Panella, Stephan Fatschel
• Original Assignee: Brian Moyer, John C. Davis, Lalit Chordia, Robert Panella, Stephan Fatschel
• Inventors: Chordia, Lalit, Davis, John C., Panella, Robert, Moyer, Brian, Fatschel, Stephan
• Application Number:
  US11/198,889
• Publication Number:
  US 20060060333A1
• Time in Patent Office: Days
• US Class Current: 165/104.330
• CPC Class Codes: F25B 2309/061 with cycle highest pressure above the supercritical pressure
• CPC Class Codes: F28D 15/0266 with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers F28D15/043 takes precedence
• CPC Class Codes: F28F 2260/02 having microchannels
• CPC Class Codes: F28F 3/12 Elements constructed in the shape of a hollow panel, e.g. with channels F28D1/02, F28D1/03 take precedence
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

Methods and apparatuses for cooling a device are disclosed. The device may be an electrical or electronic component that includes an integrated circuit or embedded control. The apparatus employs a fluid that near or above its critical pressure and at least one heat exchanger. At least two configurations are disclosed: one with a pump and another without a pump.

Claims

1. An apparatus for cooling a device comprising:

(a) a fluid near or above its critical pressure;

(b) at least one heat exchanger;

(c) a pump for circulation of the fluid; and

(d) a fluid connection between the heat exchanger and the pump.

2. The apparatus as in claim 1, wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.

3. The apparatus as in claim 1, wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.

4. The apparatus as in claim 1, wherein the pump utilizes electrical, electromechanical, mechanical or magnetic means of fluid flow.

5. The apparatus as in claim 4, wherein the actuation of the pump is selected from the group consisting of electrohydrodynamic, magnetic and electromechanical actuations.

6. The apparatus as in claim 1, wherein the at least one heat exchanger is of microchannel type.

7. The apparatus as in claim 1, wherein an absence of lubricants increases performance of the apparatus.

8. The apparatus as in claim 1, further comprising control by software, hardware or other method.

9. The apparatus as in claim 1, further comprising at least one sensor to monitor and control temperature and temperature-related phenomena.

10. The apparatus as in claim 1, wherein power is derived from a public power network of the device.

11. The apparatus as in claim 1, wherein power is derived from an independent source.

12. The apparatus as in claim 1, wherein the at least one heat exchanger and the pump are contained in the apparatus package.

13. The apparatus as in claim 12, further comprising at least one heat exchanger that is external to the apparatus package.

14. The apparatus as in claim 13, wherein the external heat exchanger is connected to the apparatus by a fluidic connection.

15. The apparatus as in any one of claims 12-14, wherein the heat exchanger is integrated into a package of the device.

16. The apparatus as in claim 15, wherein the external heat exchanger is in thermal contact with the device.

17. The apparatus as in claim 1, wherein the fluid comprises thermally conductive nanoparticles to increase cooling performance.

18. The apparatus as in claim 1, further comprising an additional effect selected from the group consisting of electrohydrodynamic and magnetic effect to increase cooling performance.

53. The apparatus as in claim 1 or claim 19 wherein, nanomaterials with high heat capacity are added to the fluid to reduce the fluid flow rate.

55. The apparatus as in claim 1 or claim 19 wherein the fluid is a high thermal conducting fluid.

19. An apparatus for cooling a device comprising:

(a) a fluid near or above its critical pressure;

(b) at least two heat exchangers; and

(c) a fluid connection between the heat exchangers.

20. The apparatus as in claim 19, wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.

21. The apparatus as in claim 19, wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.

22. The apparatus as in claim 19, wherein the at least one heat exchanger is of microchannel type.

23. The apparatus as in claim 19, further comprising a control by software, hardware or other method.

24. The apparatus as in claim 19, further comprising a sensor to monitor and control temperature and temperature-related phenomena.

25. The apparatus as in claim 19, wherein the at least one heat exchanger is contained in the apparatus package.

26. The apparatus as in claim 25, further comprising at least one heat exchanger external to the apparatus package.

27. The apparatus as in claim 26, wherein the external heat exchanger is connected to the apparatus by a fluidic connection.

28. The apparatus as in any one of claims 25-27, wherein the heat exchanger is integrated into the package of the device.

29. The apparatus as in claim 28, wherein the external heat exchanger is in thermal contact with the device.

30. The apparatus as in claim 19, wherein a density difference is maintained between at least two heat exchangers.

31. The apparatus as in claim 19, wherein the fluid comprises thermally conductive nanoparticles to increase cooling performance.

32. The apparatus as in claim 19, further comprising an additional effect selected from the group consisting of electrohydrodynamic and magnetic effect to increase cooling performance.

57. The apparatus as in claim 8 or claim 23 wherein the control software and hardware are integrated with the device.

33. A method of cooling a device, the method comprising:

(a) providing a fluid near or above its critical pressure;

(b) transferring heat from the device to the fluid;

(c) transferring heat from the fluid to an external environment; and

(d) providing a pump for fluid flow.

34. The method as in claim 33, wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.

35. The method as in claim 33, wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.

36. The method as in claim 33, wherein the pump utilizes an electrical, electromechanical, mechanical or magnetic means for fluid flow.

37. The method as in claim 33, wherein the actuation of the pump is selected from the group consisting of electrohydrodynamic, magnetic and electromechanical actuations.

38. The method as in claim 33, wherein an absence of lubricants increases the performance of the apparatus.

39. The method as in claim 33, further providing a control by software, hardware or other method.

40. The method as in claim 33, further providing at least one sensor to monitor and control temperature and temperature-related phenomena.

41. The method as in claim 33, further providing power from a public power network of the device.

42. The method as in claim 33, further providing power from an independent source.

43. The method as in claim 33, further adding thermally conductive nanoparticles to the fluid to increase cooling performance.

44. The method as in claim 33, further adding an electrohydrodynamic or magnetic effect to increase cooling performance.

52. The method as in claim 33 or claim 45 wherein, nanomaterials with high heat capacity are added to the fluid to reduce the fluid flow rate.

54. The method as in claim 33 or claim 45 wherein the fluid is a high thermal conducting fluid.

56. The method as in claim 39 or claim 48 wherein the control software and hardware are integrated with the device.

45. A method for cooling a device comprising

(a) providing a fluid near or above its critical pressure;

(b) transferring heat from the device to the fluid; and

(c) transferring heat from the fluid to an external environment.

46. The method as in claim 45, wherein the device is selected from the group consisting of electrical or electronic components comprising at least an integrated circuit or embedded control.

47. The method as in claim 45, wherein the fluid is selected from the group consisting of carbon dioxide, water, air, and a natural hydrocarbon.

48. The method as in claim 45, further providing a control by software, hardware or other method.

49. The method as in claim 45, further providing at least one sensor to monitor and control temperature and temperature-related phenomena.

50. The method as in claim 45, further providing an addition of thermally conductive nanoparticles to the fluid to increase cooling performance.

51. The method as in claim 45, further providing an addition of an electrohydrodynamic or magnetic effect to increase cooling performance.

58. A method of removing heat from a printed circuit boards consisting of:

(a) Impelling means to impel a fluid;

(b) At least one heat exchanger for transferring heat from the heat-transfer fluid to an external environment;

(c) At least one heat exchanger for accepting heat to the heat-transfer fluid from within a printed circuit board;

(d) A closed loop connecting a-c.

59. An apparatus for removing heat from a printed circuit board consisting of:

(a) A mechanism to impel a fluid;

(b) At least one heat exchanger for rejecting heat;

(c) At least one heat exchanger that accepts heat laminated to a printed circuit board;

(d) Fluid connections among a-c.

60. The apparatus as in claim 59 wherein the heat-accepting heat exchanger incorporates microchannels of a depth of less than 500 micro meters.

61. The apparatus as described in claim 59 wherein the heat exchanger that accepts heat is formed from materials from the group consisting of metallic, ceramic, polymeric or a combination thereof.

62. The apparatus as described in claim 59 wherein the fluid is chosen from the group consisting of water, carbon dioxide, ammonia, sulfur dioxide, chlorofluorocarbon, hydrofluorocarbon, hydrocarbon or combination thereof.

63. The apparatus as described in claim 59 wherein the impelling means is a pump.

64. The apparatus as described in claim 59 wherein the impelling means is a compressor.

65. The apparatus as described in claim 59 wherein heat is removed from multiple sources on the printed circuit board.

66. The apparatus as described in claim 59 wherein the printed circuit board has thermal vias.