PHOTOSENSITIVE BONDING PACKAGE STRUCTURE
First Claim
1. A photosensitive bonding package structure, comprising:
- a photosensitive device having an active surface, wherein the active surface has a photosensitive region and a plurality of bonding pads disposed around the photosensitive region;
a circuit substrate having a light incident area disposed over the photosensitive region, wherein the circuit substrate has a plurality of inner contacts and a plurality of corresponding outer contacts, the inner contacts are disposed around the light incident area and electrically connected with corresponding outer contacts; and
a plurality of bumps disposed between the circuit substrate and the photosensitive device, wherein each bump connect one of the bonding pads with a corresponding inner contact.
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Accused Products
Abstract
A photosensitive bonding package structure mainly comprising a substrate, a photosensitive device and a plurality of bumps is provided. The substrate has a light incident area located near the central area of the substrate. The photosensitive device has a photosensitive area in a position corresponding to the light incident area so that the photosensitive device can receive a beam of incident light passing through the opening. In addition, the substrate has a plurality of inner contacts and corresponding outer contacts. Pads on the photosensitive device are connected to the inner contacts through bumps so that the electrical signals resulting from illuminating the photosensitive area is transmitted to the substrate.
35 Citations
23 Claims
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1. A photosensitive bonding package structure, comprising:
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a photosensitive device having an active surface, wherein the active surface has a photosensitive region and a plurality of bonding pads disposed around the photosensitive region;
a circuit substrate having a light incident area disposed over the photosensitive region, wherein the circuit substrate has a plurality of inner contacts and a plurality of corresponding outer contacts, the inner contacts are disposed around the light incident area and electrically connected with corresponding outer contacts; and
a plurality of bumps disposed between the circuit substrate and the photosensitive device, wherein each bump connect one of the bonding pads with a corresponding inner contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A photosensitive bonding package structure, comprising:
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a photosensitive device having a photosensitive region with a plurality of bonding pads thereon, wherein the bonding pads are disposed on the surface of the photosensitive device around the photosensitive region;
a transparent substrate having a transparent region located above the photosensitive region, wherein the transparent substrate has a plurality of inner contacts and a plurality of corresponding outer contacts, the inner contacts are distributed around the transparent substrate and the inner contacts are electrically connected to the corresponding outer contacts; and
a plurality of bumps disposed between the transparent substrate and the photosensitive device, wherein each bump connects one of he bonding pads to a corresponding inner contact. - View Dependent Claims (13, 14)
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15. A bonding package structure, comprising:
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an optical pick-up device having a light source for emitting a beam of light, wherein the optical pick-up device has a plurality of bonding pads disposed around the light source;
a circuit substrate having a light incident area disposed over the light source, wherein the circuit substrate has a plurality of inner contacts and a plurality of corresponding outer contacts, the inner contacts are disposed around the circuit substrate and the inner contacts are electrically connected to the corresponding outer contacts; and
a plurality of bumps disposed between the circuit substrate and the optical pick-up device such that each bonding pad is electrically connected to one of the inner contacts. - View Dependent Claims (16, 17, 18, 19, 20, 21, 22, 23)
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Specification