Light emitting device

• US 20060060867A1
• Filed: 09/08/2005
• Published: 03/23/2006
• Est. Priority Date: 09/09/2004
• Status: Active Grant

• Current Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Original Assignee: Toyoda Gosei Company Limited (Toyota Motor Corporation)
• Inventors: Suehiro, Yoshinobu
• Granted Patent: US 7,875,897 B2
• Time in Patent Office: Days
• US Class Current: 257/81
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16245 the item being metallic
• CPC Class Codes: H01L 2924/00011 Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 33/54 having a particular shape
• CPC Class Codes: H01L 33/56 Materials, e.g. epoxy or silicone resin

Abstract

A light emitting device having: a light-emitting portion having a light emitting element flip-chip mounted, a first power supply portion that supplies power to the light emitting element, and an inorganic sealing material that seals the light emitting element; a second power supply portion that supplies power to the light-emitting portion; and a resin that seals the light-emitting portion. The resin comprises an optical-shaped surface.

Claims

1. A light emitting device, comprising:

a light-emitting portion comprising a light emitting element flip-chip mounted, a first power supply portion that supplies power to the light emitting element, and an inorganic sealing material that seals the light emitting element;

a second power supply portion that supplies power to the light-emitting portion; and

a resin that seals the light-emitting portion,

wherein the resin comprises an optical-shaped surface.

3. The light emitting device according to claim 1, wherein:

the first power supply portion comprises glass-containing Al₂O₃, Al₂O₃ or AlN.

9. The light emitting device according to claim 1, wherein:

the resin for sealing the light-emitting portion has a width twice or more greater than the light-emitting portion, where width is a width relative to a central axis of the light emitting element.

12. The light emitting device according to claim 1, wherein:

the second power supply portion comprises a metal lead on which a mirror is formed.

15. The light emitting device according to claim 12, wherein:

the mirror is formed, in a direction of a central axis of the light emitting element, higher than the inorganic sealing material.

16. The light emitting device according to claim 1, wherein:

the resin for sealing the light-emitting portion comprises plural kinds of resins.

19. The light emitting device according to claim 16, wherein:

the plural kinds of resins comprise a transparent resin and a resin that has a high reflectivity to light emitted from the light-emitting portion.

20. The light emitting device according to claim 19, wherein:

the high-reflectivity resin is a white resin and is disposed a backside of the light emitting element.

21. The light emitting device according to claim 16, wherein:

the plural kinds of resins comprises a transparent resin and a black resin that is disposed on the periphery of the device.

22. The light emitting device according to claim 1, wherein:

the resin for sealing the light-emitting portion comprises a phosphor.

25. The light emitting device according to claim 1, further comprising:

a reflection surface that reflects light emitted from the light-emitting portion.

28. The light emitting device according to claim 25, wherein:

the reflection surface is formed on an optical surface provided with the resin for sealing the light-emitting portion.

29. The light emitting device according to claim 1, wherein:

the resin for sealing the light-emitting portion comprises an optical surface formed thereon, and

the optical surface is formed on a light emission side of the light emitting element and on a backside thereof.

32. The light emitting device according to claim 1, wherein:

the resin for sealing the light-emitting portion comprises a light-guiding portion that guides light emitted from the light emitting element.

42. The light emitting device according to claim 1, wherein:

the light emitting element comprises a substrate that has a refractive index equal to a semiconductor layer including a light emitting layer, and

the light emitting element is sealed with the inorganic sealing material with a refractive index ratio in the range of 0.68 to 0.85 relative to the light emitting element.

46. The light emitting device according to claim 1, wherein:

the inorganic sealing material comprises a phosphor.

2. A light emitting device, comprising:

a light-emitting portion comprising a light emitting element, a first power supply portion that comprises a conductive pattern on which the light emitting element is mounted and which supplies power to the light emitting element, and an inorganic sealing material that seals the light emitting element and has a thermal expansion coefficient equal to the first power supply portion;

a second power supply portion that supplies power to the light-emitting portion; and

a resin that seals the light-emitting portion,

wherein the resin comprises an optical-shaped surface.

4. The light emitting device according to claim 2, wherein:

the first power supply portion comprises glass-containing Al₂O₃, Al₂O₃ or AlN.

7. The light emitting device according to claim 2, wherein:

the light emitting element is of a flip-chip mount type.

10. The light emitting device according to claim 2, wherein:

the resin for sealing the light-emitting portion has a width twice or more greater than the light-emitting portion, where width is a width relative to a central axis of the light emitting element.

13. The light emitting device according to claim 2, wherein:

the second power supply portion comprises a metal lead on which a mirror is formed.

17. The light emitting device according to claim 2, wherein:

the resin for sealing the light-emitting portion comprises plural kinds of resins.

23. The light emitting device according to claim 2, wherein:

the resin for sealing the light-emitting portion comprises a phosphor.

26. The light emitting device according to claim 2, further comprising:

a reflection surface that reflects light emitted from the light-emitting portion.

30. The light emitting device according to claim 2, wherein:

the resin for sealing the light-emitting portion comprises an optical surface formed thereon, and

the optical surface is formed on a light emission side of the light emitting element and on a backside thereof.

33. The light emitting device according to claim 2, wherein:

the resin for sealing the light-emitting portion comprises a light-guiding portion that guides light emitted from the light emitting element.

37. The light emitting device according to claim 2, wherein:

the light emitting element, the inorganic substrate and the inorganic sealing material have nearly an equal thermal expansion coefficient.

43. The light emitting device according to claim 2, wherein:

the light emitting element comprises a substrate that has a refractive index equal to a semiconductor layer including a light emitting layer, and

the light emitting element is sealed with the inorganic sealing material with a refractive index ratio in the range of 0.68 to 0.85 relative to the light emitting element.

47. The light emitting device according to claim 2, wherein:

the inorganic sealing material comprises a phosphor.

5. A light emitting device, comprising:

a light-emitting portion comprising a light emitting element, a first power supply portion that comprises a metal material that supplies power to the light emitting element, and an inorganic sealing material that seals the light emitting element;

a second power supply portion that supplies power to the light-emitting portion; and

a resin that seals the light-emitting portion,

wherein the resin comprises an optical-shaped surface.

6. The light emitting device according to claim 5, wherein:

the first power supply portion and the second power supply portion comprises a common member.

8. The light emitting device according to claim 5, wherein:

the light emitting element is of a flip-chip mount type.

11. The light emitting device according to claim 5, wherein:

the resin for sealing the light-emitting portion has a width twice or more greater than the light-emitting portion, where width is a width relative to a central axis of the light emitting element.

14. The light emitting device according to claim 5, wherein:

the second power supply portion comprises a metal lead on which a mirror is formed.

18. The light emitting device according to claim 5, wherein:

the resin for sealing the light-emitting portion comprises plural kinds of resins.

24. The light emitting device according to claim 5, wherein:

the resin for sealing the light-emitting portion comprises a phosphor.

27. The light emitting device according to claim 5, further comprising:

a reflection surface that reflects light emitted from the light-emitting portion.

31. The light emitting device according to claim 5, wherein:

the resin for sealing the light-emitting portion comprises an optical surface formed thereon, and

the optical surface is formed on a light emission side of the light emitting element and on a backside thereof.

34. The light emitting device according to claim 5, wherein:

the resin for sealing the light-emitting portion comprises a light-guiding portion that guides light emitted from the light emitting element.

44. The light emitting device according to claim 5, wherein:

the light emitting element comprises a substrate that has a refractive index equal to a semiconductor layer including a light emitting layer, and

the light emitting element is sealed with the inorganic sealing material with a refractive index ratio in the range of 0.68 to 0.85 relative to the light emitting element.

48. The light emitting device according to claim 5, wherein:

the inorganic sealing material comprises a phosphor.

35. A light emitting device, comprising:

a light-emitting portion comprising a light emitting element flip-chip mounted, a first power supply portion that supplies power to the light emitting element, and an inorganic sealing material that seals the light emitting element, inorganic material comprising an optical shape that prevents a total reflection of light emitted from the light emitting element at an interface thereof to the air;

a second power supply portion that supplies power to the light-emitting portion; and

a resin that seals the light-emitting portion,

wherein the resin comprises an optical-shaped surface.

36. The light emitting device according to claim 35, wherein:

the light-emitting portion comprises an inorganic substrate which comprises the first power supply portion and on which the light emitting element is mounted, and a heat radiation portion that is formed on the inorganic substrate and comprises a heat conductive material.

38. The light emitting device according to claim 35, wherein:

the light emitting element, the inorganic substrate and the inorganic sealing material have nearly an equal thermal expansion coefficient.

39. The light emitting device according to claim 36, wherein:

the light-emitting portion comprises plural light emitting elements that are mounted on the inorganic substrate and sealed with the inorganic sealing material.

40. The light emitting device according to claim 36, wherein:

the light-emitting portion comprises a light emitting element that has a size of 500 μ

m square or more mounted on the inorganic substrate and is sealed with the inorganic sealing material.

41. The light emitting device according to claim 35, wherein:

the resin for sealing the light-emitting portion comprises a reflection portion that reflects light emitted from the light emitting element.

45. The light emitting device according to claim 35, wherein:

the light emitting element comprises a substrate that has a refractive index equal to a semiconductor layer including a light emitting layer, and

the light emitting element is sealed with the inorganic sealing material with a refractive index ratio in the range of 0.68 to 0.85 relative to the light emitting element.

49. The light emitting device according to claim 35, wherein:

the inorganic sealing material comprises a phosphor.