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Semiconductor device packaged into chip size and manufacturing method thereof

  • US 20060060984A1
  • Filed: 09/14/2005
  • Published: 03/23/2006
  • Est. Priority Date: 09/17/2004
  • Status: Active Grant
First Claim
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1. A semiconductor device comprising:

  • a semiconductor substrate having an integrated circuit and at least one connection pad;

    at least one external connection electrode electrically connected with the connection pad;

    a first sealing material provided on the semiconductor substrate around the external connection electrode, each impurity concentration of an Na ion, a K ion, a Ca ion and Cl ion contained in the first sealing material being not greater than 10 ppm; and

    a second sealing material provided on at least one of a lower surface and a peripheral side surface of the semiconductor substrate, a total impurity concentration of an Na ion, a K ion, a Ca ion and a Cl ion contained in the second sealing material being not smaller than 100 ppm.

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