Semiconductor device

• US 20060061965A1
• Filed: 11/10/2005
• Published: 03/23/2006
• Est. Priority Date: 10/15/2003
• Status: Abandoned Application

• Current Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Original Assignee: Visteon Global Technologies Incorporated (Visteon Corporation)
• Inventors: Trublowski, John, Jairazbhoy, Vivek A., Reddy, Prathap A.
• Application Number:
  US11/271,471
• Publication Number:
  US 20060061965A1
• Time in Patent Office: Days
• US Class Current: 361/689
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Abstract

A liquid cooled semiconductor device is provided. The device includes a semiconductor die and a heat spreader. In one aspect of the invention, the heat spreader is mounted to a substrate such that a first side of the spreader is exposed on one side of the substrate and that a second side of the heat spreader is exposed on an opposing side of the substrate. Attached to a first side of the spreader is the semiconductor die. In another aspect of the invention, a wetting material is used to provide a thermal/electrical connection between the die and heat spreader. Sealant is provided between the die and the heat spreader to encapsulate and contain the wetting material.

Claims

1. A semiconductor device comprising:

a semiconductor die;

a heat spreader having a first side and a second side, the first side being attached to the semiconductor die;

a wetting material providing a thermal connection between the semiconductor die with the heat spreader; and

a sealant extending between the semiconductor die and the heat spreader and encapsulating the wetting material.

2. The device according to claim 1, wherein the wetting material is a liquefiable solder.

3. The device according to claim 1, wherein the heat spreader is constructed primarily of copper.

4. The device according to claim 1, wherein the heat spreader includes a dielectric coating on the second side of the heat spreader.

5. The device according to claim 4, wherein the coating is a ceramic coating.

6. The device according to claim 1, further comprising a substrate to which the spreader is mounted, the spreader being mounted to the substrate such that at least part of the second side of the heat spreader is exposed from the substrate.

7. A semiconductor device comprising:

a semiconductor die;

a heat spreader having a first and a second side, the first side being attached to the semiconductor die; and

a substrate for fixing the location of the heat spreader, the heat spreader being mounted to the substrate such that at least a portion of the second side of the heat spreader is exposed through the substrate.

8. The system according to claim 7, wherein the substrate comprises a plastic material.

9. The system according to claim 8, wherein the heat spreader is insert molded into the substrate such that the second side of the heat spreader is exposed from the substrate.

10. The system according to claim 7, wherein the heat spreader is a copper heat spreader.

11. The system according to claim 7, wherein the heat spreader includes a dielectric coating on the second side of the heat spreader.

12. The system according to claim 11, wherein the coating is a ceramic coating.

13. The system according to claim 7, further comprising a base including wall portions defining a channel adapted to having cooling fluid flow through the channel, part of the wall portions defining an aperture and the substrate being mounted over the aperture such that the second side of the heat spreader will be contacted by a flow of the cooling fluid through the channel.