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Semiconductor device

  • US 20060061965A1
  • Filed: 11/10/2005
  • Published: 03/23/2006
  • Est. Priority Date: 10/15/2003
  • Status: Abandoned Application
First Claim
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1. A semiconductor device comprising:

  • a semiconductor die;

    a heat spreader having a first side and a second side, the first side being attached to the semiconductor die;

    a wetting material providing a thermal connection between the semiconductor die with the heat spreader; and

    a sealant extending between the semiconductor die and the heat spreader and encapsulating the wetting material.

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