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Patterned wafer thickness detection system

  • US 20060062897A1
  • Filed: 01/11/2005
  • Published: 03/23/2006
  • Est. Priority Date: 09/17/2004
  • Status: Abandoned Application
First Claim
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1. An apparatus for monitoring an electroless deposition process comprising:

  • a plurality of chamber walls that enclose a processing region;

    a substrate support disposed in the processing region having a substrate receiving surface;

    an electromagnetic radiation source that is mounted proximate to the processing region and is adapted to emit electromagnetic radiation that strikes a surface of a substrate mounted on the substrate receiving surface at an angle that is substantially perpendicular to the substrate surface;

    a detector that is mounted proximate to the processing region and is adapted to detect the intensity of reflected electromagnetic radiation from the surface of the substrate during an electroless deposition process; and

    a controller adapted to receive a signal from the detector and modify the electroless deposition process.

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