High power AllnGaN based multi-chip light emitting diode
First Claim
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1. A method for fabricating a light emitting diode chip, the method comprising forming a substantially transparent substrate having an aspect ratio which defines an elongated geometry.
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Abstract
A light emitting diode chip having a substantially transparent substrate and having an aspect ratio, which defines an elongated geometry provides enhanced efficiency and brightness. Method for forming and operating the same are also disclosed.
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Citations
57 Claims
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1. A method for fabricating a light emitting diode chip, the method comprising forming a substantially transparent substrate having an aspect ratio which defines an elongated geometry.
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2. A method for forming a light emitting diode chip, the method comprising:
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providing a substantially transparent substrate;
forming at least one active region upon the substrate; and
cutting the substrate to form at least one light emitting diode chip having an active area with an aspect ratio which is greater than approximately 1.5 to 1. - View Dependent Claims (3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17)
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18. A light emitting diode chip comprising a substantially transparent substrate and having an aspect ratio which defines an elongated geometry.
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19. A light emitting diode chip comprising:
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a substantially transparent substrate;
an active region formed upon the substrate; and
wherein an aspect ratio of the active area is greater than approximately 1.5 to 1. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33)
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34. A light emitting diode chip comprising:
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a substantially transparent substrate;
an active region formed upon the substrate;
an upper LED layer and a lower LED layer cooperating to define the active region;
an upper contact finger formed upon the upper LED layer;
a lower contact finger formed upon the lower LED layer; and
a reflector disposed intermediate the active region and the lower contact finger, the reflector being configured to reflect light directed from the active region toward the lower contact finger away from the lower contact finger so as to enhance a brightness of the light emitting diode chip.
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35. A light emitting diode lamp comprising:
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a package;
at least one light emitting diode chip disposed within the package, the light emitting diode(s) comprising;
a substantially transparent substrate;
an active region formed upon the substrate; and
wherein an aspect ratio of the active area is greater than approximately 1.5 to 1. - View Dependent Claims (36, 37, 38, 39, 40, 41, 42, 43, 44, 45, 46, 47, 48, 49, 50, 51, 52, 53)
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54. An illumination device comprising:
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a power source;
a light emitting diode lamp in electrical communication with the power source, the light emitting diode lamp comprising;
a package;
at least one light emitting diode chip disposed within the package, the light emitting diode(s) comprising;
a substantially transparent substrate;
an active region formed upon the substrate; and
wherein an aspect ratio of the active area is greater than approximately 1.5 to 1. - View Dependent Claims (55, 56, 57)
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Specification