Singulation method used in image sensor packaging process and support for use therein
First Claim
1. A singulation method used in a process for making a plurality of image sensor packages, the singulation method comprising the following steps:
- providing a semi-finished product including a plurality of package structures formed on a substrate, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing;
placing the semi-finished product on a support having a plurality of cavities such that the package structures are respectively received in the cavities of the support; and
simultaneously sawing the semi-finished product into separate image sensor packages and decreasing the air pressure in the cavities to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support.
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Accused Products
Abstract
A singulation method used in a process for making a plurality of image sensor packages is disclosed. Firstly, a semi-finished product including a plurality of package structures formed on a substrate is placed on a support having a plurality of cavities for receiving the package structures. Then, the semi-finished product is sawed into separate image sensor packages. During the sawing step, the air pressure in the cavities is decreased to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support whereby the package structures are positioned precisely and clamped in place with the support during the sawing step.
9 Citations
16 Claims
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1. A singulation method used in a process for making a plurality of image sensor packages, the singulation method comprising the following steps:
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providing a semi-finished product including a plurality of package structures formed on a substrate, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing;
placing the semi-finished product on a support having a plurality of cavities such that the package structures are respectively received in the cavities of the support; and
simultaneously sawing the semi-finished product into separate image sensor packages and decreasing the air pressure in the cavities to create suction within the cavities such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A singulation method used in a process for making a plurality of image sensor packages, the singulation method comprising the following steps:
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providing a semi-finished product including a plurality of package structures formed on a substrate, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing;
providing a support having a plurality of cavities and a plurality of first slots between the cavities;
placing the semi-finished product on the support such that the package structures are respectively received in the cavities of the support;
simultaneously sawing the semi-finished product into separate image sensor packages and decreasing the air pressure in the first slots to create suction within the first slots such that the support abuts against at least a portion of the housing of each package structure with a gap between the transparent component and the support whereby the package structures are positioned precisely and clamped in place with the support during the sawing step. - View Dependent Claims (8, 9, 10, 11, 12)
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13. A support for supporting a semi-finished product including a plurality of package structures formed on a substrate having a plurality of sawing streets between the package structures, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing, the support comprising:
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a plurality of cavities defined in the support for receiving the package structures; and
a plurality of slots between the cavities, the slots facing the cutting streets of the substrate when the package structures are received in the cavities, wherein a gap is provided between the transparent component and the support when the support abuts against at least a portion of the housing of each package structure. - View Dependent Claims (14)
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15. A support for supporting a semi-finished product including a plurality of package structures formed on a substrate having a plurality of sawing streets between the package structures, wherein each of the package structures comprises a housing formed on the substrate, an image sensor chip disposed within the housing and electrically coupled to the substrate, and a transparent component supported by the housing, the support comprising:
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a plurality of cavities defined in the support for receiving the package structures; and
a plurality of first and second slots defined in the support at locations between the cavities, the first slots facing a portion of the package structures and the second slots facing the cutting streets of the substrate when the package structures are received in the cavities, wherein a gap is provided between the transparent component and the support when the support abuts against at least a portion of the housing of each package structure. - View Dependent Claims (16)
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Specification