Optical waveguide type iontophoresis sensor chip and method for packaging sensor chip
First Claim
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1. An optical waveguide type iontophoresis sensor chip comprising:
- a substrate having a first hinged plate and a second hinged plate;
an optical waveguide plate connected to the first hinged plate and positioned over a first opening delineated in the first hinged plate; and
a gel layer fixed on the second hinged plate and covering a second opening delineated in the second hinged plate and configured to contact with the optical waveguide plate through the first opening in case that the substrate is folded.
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Abstract
An optical waveguide type iontophoresis sensor chip has a substrate having a first hinged plate and a second hinged plate, an optical waveguide plate connected to the first hinged plate and positioned over a first opening delineated in the first hinged plate, and a gel layer fixed on the second hinged plate and covering a second opening delineated in the second hinged plate and configured to contact with the optical waveguide plate through the first opening in case that the substrate is folded.
17 Citations
7 Claims
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1. An optical waveguide type iontophoresis sensor chip comprising:
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a substrate having a first hinged plate and a second hinged plate;
an optical waveguide plate connected to the first hinged plate and positioned over a first opening delineated in the first hinged plate; and
a gel layer fixed on the second hinged plate and covering a second opening delineated in the second hinged plate and configured to contact with the optical waveguide plate through the first opening in case that the substrate is folded. - View Dependent Claims (2, 3, 4, 5, 6)
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7. A method for packaging sensor chip comprising:
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covering two sides of a substrate having a first hinged plate and a second hinged plate with a packaging sheet;
forming a first sealed cell by pasting the packaging sheet on a peripheral region of the first hinged plate; and
forming a second sealed cell by pasting the packaging sheet on a peripheral region of the second hinged plate.
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Specification