Rugged industrial computing module

• US 20060064524A1
• Filed: 10/05/2005
• Published: 03/23/2006
• Est. Priority Date: 09/12/2003
• Status: Abandoned Application

• Current Assignee: Logic Controls Incorporated
• Original Assignee: Logic Controls Incorporated
• Inventors: Lum, Jackson
• Application Number:
  US11/244,313
• Publication Number:
  US 20060064524A1
• Time in Patent Office: Days
• US Class Current: 710/62
• CPC Class Codes: G06F 1/18 Packaging or power distribution
• CPC Class Codes: G06F 1/20 Cooling means
• CPC Class Codes: G06F 13/38 Information transfer, e.g. on bus G06F13/14 takes precedence
• CPC Class Codes: G06F 15/7814 Specially adapted for real time processing, e.g. comprising hardware timers

Abstract

A rugged computing module includes a circuit board having traces associated therewith, an integrated circuit mounted on the circuit board, and an interface connector mounted proximate to an edge of the circuit board. The interface connector is electrically coupled to the integrated circuit exclusively through the traces associated therewith, thereby eliminating cable connections between the integrated circuit and the interface connector. The computing module may include a housing substantially enclosing the circuit board and restricting airflow to the integrated circuit, and a thermal transfer device thermally coupled to the integrated circuit. The thermal transfer device is adapted to transfer heat from the integrated circuit to the housing, and includes at least one of a heat sink, thermally conductive foam, and a heat pipe.

Claims

1. A rugged computing module comprising:

a circuit board comprising traces associated therewith;

an integrated circuit mounted on the circuit board; and

an interface connector mounted proximate to an edge of the circuit board, the interface connector being electrically coupled to the integrated circuit exclusively through the traces associated therewith, thereby eliminating cable connections between the integrated circuit and the interface connector.

2. A rugged computing module as defined by claim 1, wherein the interface connector comprises at least one of an Ethernet connector, a Universal Serial Bus (USB) connector, a serial connector, a parallel connector, a keyboard/mouse connector, a Super Video Graphics Array (SVGA) connector, an Infrared (IR) connector, a Bluetooth connector, and a wireless port connector.

3. A rugged computing module as defined by claim 1, further comprising a housing substantially enclosing the computing module, the housing substantially restricting airflow to the integrated circuit.

4. A rugged computing module as defined by claim 3, wherein the housing is adapted to be used as a heat sink for the integrated circuit.

5. A rugged computing module as defined by claim 3, wherein the housing comprises grooves on an external surface thereof.

6. A rugged computing module as defined by claim 1, wherein the integrated circuit includes at least one of a microcontroller, microprocessor, digital signal processor (DSP), application specific integrated circuit (ASIC), and gate array.

7. A rugged computing module as defined by claim 1, wherein the circuit board comprises multiple layers.

8. A rugged computing module as defined by claim 1, further comprising a heat sink thermally coupled to the integrated circuit.

9. A rugged computing module as defined by claim 8, wherein the heat sink comprises a plurality of partially enclosed chambers.

10. A rugged computing module as defined by claim 1, further comprising heat conducting foam thermally coupled to the integrated circuit.

11. A rugged computing module as defined by claim 1, further comprising a heat pipe thermally coupled to the integrated circuit.

12. A rugged computing module comprising:

a circuit board comprising traces associated therewith;

an integrated circuit mounted on the circuit board;

a housing substantially enclosing the circuit board and integrated circuit;

the housing substantially restricting airflow to the integrated circuit; and

a thermal transfer device thermally coupled to the integrated circuit, the thermal transfer device being adapted to transfer heat from the integrated circuit to the housing, the thermal transfer device comprising at least one of a heat sink, thermally conductive foam, and a heat pipe.

13. A rugged computing module as defined by claim 12, further comprising an interface connector mounted proximate to an edge of the circuit board, the interface connector being electrically coupled to the integrated circuit exclusively through the traces associated therewith, thereby eliminating cable connections between the integrated circuit and the interface connector.

14. A rugged computing module as defined by claim 13, wherein the interface connector comprises at least one of an Ethernet connector, a Universal Serial Bus (USB) connector, a serial connector, a parallel connector, a keyboard/mouse connector, a Super Video Graphics Array (SVGA) connector, an Infrared (IR) connector, a Bluetooth connector, and a wireless port connector.

15. A rugged computing module as defined by claim 12, wherein the housing is adapted to be used as a heat sink for the integrated circuit.

16. A rugged computing module as defined by claim 12, wherein the housing comprises grooves on an external surface thereof.

17. A rugged computing module as defined by claim 12, wherein the integrated circuit includes at least one of a microcontroller, microprocessor, digital signal processor (DSP), application specific integrated circuit (ASIC), and gate array.

18. A rugged computing module as defined by claim 12, wherein the circuit board comprises multiple layers.

19. A rugged computing module as defined by claim 12, wherein the heat sink comprises a plurality of partially enclosed chambers.